JP5592060B2 - プリント回路板上のコネクタのオフセットフットプリントの改良 - Google Patents
プリント回路板上のコネクタのオフセットフットプリントの改良 Download PDFInfo
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- H—ELECTRICITY
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
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- H05K1/02—Details
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
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- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
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- Engineering & Computer Science (AREA)
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- Details Of Connecting Devices For Male And Female Coupling (AREA)
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- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
動作モードにおける2つの部品の完全で信頼のある接続とテストモードにおけるテストコネクタのブレードの稼働部分間の接続を提供することによる機械的制約と、
特に動作モードにおいて、特定の動作帯域の固有インピーダンス50オームのアクセス回線に対する完全なインピーダンス整合を提供する電気的制約
を満たすように設計されたコネクタの中心部の形状に起因する。
第1の接地面により覆われた表面の反対側の基板の表面上の、コネクタに接続される2つの伝送路の間で、接地面とともに容量性素子を形成する伝送路に垂直な第1の素子と、第1の素子の少なくとも1つの先端で、第1の素子とともに自己誘導性及び容量性素子を形成する第2の素子を含み、前記表面上で第2の接地面まで伸長する導電性フットプリントをエッチング加工し、
第2の接地面と第1の接地面をビア又は金属化された孔により結合することから成る工程を含むプリント回路板上のコネクタに対するフットプリントを作る方法に関する。
Ls=0.4nH、
Cp1=0.7pF、
Cp2=0.2pF、
Lp=0.22nH
が等価回路の自己インダクタンスとキャパシタに対して得られるように選択される。
るためにもはや外部部品を付加する必要はない。
以下に、本発明の好ましい態様を示す。
付記1.少なくとも1つのコネクタを受入れ、第1の表面では第1の接地面を含み、及び第2の表面に、その間に前記コネクタとフットプリントが実装される少なくとも2つの伝送路を含む誘電体基板により構成されるプリント回路板であって、
前記フットプリントが、前記コネクタ下の前記2つの伝送路間に位置される第1の素子を含み、
前記第1の素子が前記第1の接地面とともに容量性素子を形成し、前記第1の素子の少なくとも1つの先端で、第2の素子が前記第1の素子とともに自己誘導性及び容量性素子を形成し、前記第2の素子が第2の接地面まで伸長し、前記第2の接地面が前記第1の接地面に結合されることを特徴とするプリント回路板。
付記2.前記第1の素子及び前記第2の素子が導電線で構成されることを特徴とする付記1に記載のプリント回路板。
付記3.前記導電線の寸法が、前記容量性及び自己誘導性素子を形成する前記第1及び第2の素子の共振周波数がフィルタに対する周波数に相当するように選択されることを特徴とする付記2に記載のプリント回路板。
付記4.積層基板の場合に、少なくとも1つのフローティング導電層が前記フットプリント下に配置されることを特徴とする付記1から3のうちのいずれかに記載のプリント回路板。
付記5.前記第2の接地面が、前記フットプリントの第2の素子付近に位置される少なくとも1つのビアにより前記第1の接地面に結合されることを特徴とする付記1〜4のうちのいずれか1つに記載のプリント回路板。
付記6.前記コネクタがテストコネクタであることを特徴とする付記1〜5のうちのいずれか1つに記載のプリント回路板。
付記7.第1の接地面で覆われる表面とは反対側の基板の表面上の、コネクタに接続される2つの伝送路の間で、伝送路に対して垂直で前記接地面とともに容量性素子を形成する第1の素子と、前記第1の素子の少なくとも1つの先端で、前記第1の素子とともに自己誘導性及び容量性素子を形成する第2の素子とを含み、前記表面上で第2の接地面まで伸長する導電性フットプリントをエッチング加工し、
前記第2の接地面をビア又は金属化された孔により前記第1の接地面に結合させることから成る工程を含むプリント回路板上のコネクタに対するフットプリントを製造する方法。
2 プリント回線
3 アンテナ
4 入力口
5 RF回路
10 重なりブレード
11 重なりブレード
100 基板
101 アクセス回線
102 アクセス回線
103 接地面素子
104 接地面素子
105 はんだスタッド
106 はんだスタッド
107 はんだスタッド
108 導電体のフットプリント
109 金属化された孔
110 接地面
111 接地面
120 コネクタ
121 第1の金属ブレード
122 第2の金属ブレード
123 中央ブレード
124 ボックス
125 開口部
200 誘電体基板
201 伝送路
202 伝送路
203 フットプリント
203a 第1の素子
203b 第2の素子
204 接地面
205 接地面
206 金属化された孔
207 回線素子
220 コネクタ
300 基板
301 アクセス回線
302 アクセス回線
303 フットプリント
303a 第1の素子
303b 第2の素子
304 接地面
305 接地面
306 金属化された孔
307 フローティング導体素子
Claims (7)
- 少なくとも1つのコネクタを受入れ、第1の表面において導電層の形態で第1の接地面を含み、及び第2の表面において前記コネクタと2つの伝送路の間のフットプリントとが間に実装される少なくとも前記2つの伝送路を含む誘電体基板により構成されるプリント回路板であって、
前記フットプリントが、前記コネクタ下の前記2つの伝送路間に配置され、前記2つの伝送路を結ぶ線と直交する方向に配置された第1の導電素子と、前記第1の導電素子の少なくとも1つの先端に接続される第2の導電素子とを含み、
前記第1の導電素子が前記第1の接地面とともに容量性素子を形成し、前記第1の導電素子の少なくとも1つの先端において、前記第2の導電素子が前記第1の導電素子とともに自己インダクタンスを形成し、前記第2の導電素子が第2の接地面まで伸長し、前記第2の接地面が前記第1の接地面に電気的に結合される、前記プリント回路板。 - 前記第1の導電素子及び前記第2の導電素子が導電線で構成されることを特徴とする請求項1に記載のプリント回路板。
- それぞれ前記容量性素子及び自己インダクタンスを形成する前記第1の導電素子及び第2の導電素子の共振周波数が、RF回路のフィルタリング可能な周波数に相当するように、前記導電線の寸法を選択する、請求項2に記載のプリント回路板。
- 前記誘電体基板が積層基板の場合に、少なくとも1つのフローティング導電層が前記フットプリント下に配置される、請求項1から3のうちのいずれか1つに記載のプリント回路板。
- 前記第2の接地面が、前記フットプリントの第2の素子付近に配置される少なくとも1つのビアにより前記第1の接地面に電気的に結合される、請求項1から4のうちのいずれか1つに記載のプリント回路板。
- 前記コネクタがテストコネクタである、請求項1から4のうちのいずれか1つに記載のプリント回路板。
- プリント回路板上のコネクタに対するフットプリントを製造する方法であって、
導電層を形成する第1の接地面で覆われる表面とは反対側の基板の表面上の、前記コネクタに接続される2つの伝送路の間で、前記2つの伝送路を結ぶ線と直交する方向に配置され、前記第1の接地面との間で前記第1の接地面とともに容量性素子を形成する第1の導電素子と、前記第1の導電素子の少なくとも1つの先端で、前記第1の導電素子とともに自己インダクタンスを形成する第2の導電素子とを含み、前記反対側の基板の表面上で第2の接地面まで伸長する導電性フットプリントをエッチング加工する工程と、
前記第2の接地面をビア又は金属化された孔により前記第1の接地面に結合させる工程と、
から成る、前記方法。
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Application Number | Priority Date | Filing Date | Title |
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FR0755167 | 2007-05-21 | ||
FR0755167A FR2916601A1 (fr) | 2007-05-21 | 2007-05-21 | Perfectionnement a l'empreinte de report d'un connecteur sur une carte imprimee. |
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JP2008288596A JP2008288596A (ja) | 2008-11-27 |
JP5592060B2 true JP5592060B2 (ja) | 2014-09-17 |
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US (1) | US8063719B2 (ja) |
EP (1) | EP1995998B1 (ja) |
JP (1) | JP5592060B2 (ja) |
KR (1) | KR101438188B1 (ja) |
CN (1) | CN101321435B (ja) |
DE (1) | DE602008000811D1 (ja) |
FR (1) | FR2916601A1 (ja) |
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JP5799852B2 (ja) * | 2011-03-30 | 2015-10-28 | ソニー株式会社 | 入出力装置 |
US10129974B2 (en) | 2016-03-21 | 2018-11-13 | Industrial Technology Research Institute | Multi-layer circuit structure |
CN112595920B (zh) * | 2021-02-26 | 2021-05-25 | 荣耀终端有限公司 | 一种射频传导测试方法及相关装置 |
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US6876836B2 (en) * | 2002-07-25 | 2005-04-05 | Integrated Programmable Communications, Inc. | Layout of wireless communication circuit on a printed circuit board |
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CN100405880C (zh) * | 2004-12-24 | 2008-07-23 | 鸿富锦精密工业(深圳)有限公司 | 引脚连接结构及其脚位定义的修改方法 |
TWI248330B (en) * | 2005-01-14 | 2006-01-21 | Ind Tech Res Inst | High frequency and wide band impedance matching via |
JP2006229161A (ja) * | 2005-02-21 | 2006-08-31 | Sumitomo Electric Ind Ltd | 多面付け基板 |
TWI290443B (en) * | 2005-05-10 | 2007-11-21 | Via Tech Inc | Signal transmission structure, wire board and connector assembly structure |
JP2007128939A (ja) * | 2005-11-01 | 2007-05-24 | Taiyo Yuden Co Ltd | 高周波モジュール |
US7244126B2 (en) * | 2005-12-09 | 2007-07-17 | Tyco Electronics Corporation | Electrical connector having a circuit board with controlled impedance |
JP4772556B2 (ja) * | 2006-03-29 | 2011-09-14 | 富士通コンポーネント株式会社 | 電子装置の製造方法 |
TW200807799A (en) * | 2006-05-11 | 2008-02-01 | Koninkl Philips Electronics Nv | Resonator device with shorted stub and MIM-capacitor |
JP2008034626A (ja) * | 2006-07-28 | 2008-02-14 | Tdk Corp | 電子部品及びその製造方法 |
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2007
- 2007-05-21 FR FR0755167A patent/FR2916601A1/fr active Pending
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2008
- 2008-04-29 EP EP08155381A patent/EP1995998B1/en active Active
- 2008-04-29 DE DE602008000811T patent/DE602008000811D1/de active Active
- 2008-05-02 TW TW097116142A patent/TWI406606B/zh active
- 2008-05-13 KR KR1020080043935A patent/KR101438188B1/ko active IP Right Grant
- 2008-05-19 JP JP2008130577A patent/JP5592060B2/ja active Active
- 2008-05-20 US US12/154,039 patent/US8063719B2/en active Active
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TW200847861A (en) | 2008-12-01 |
EP1995998B1 (en) | 2010-03-17 |
JP2008288596A (ja) | 2008-11-27 |
KR101438188B1 (ko) | 2014-09-04 |
TWI406606B (zh) | 2013-08-21 |
EP1995998A1 (en) | 2008-11-26 |
CN101321435B (zh) | 2012-02-08 |
US20080290967A1 (en) | 2008-11-27 |
CN101321435A (zh) | 2008-12-10 |
DE602008000811D1 (de) | 2010-04-29 |
FR2916601A1 (fr) | 2008-11-28 |
KR20080102961A (ko) | 2008-11-26 |
US8063719B2 (en) | 2011-11-22 |
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