TWI406606B - 容納至少一連接器之印刷電路板以及印刷電路板上連接器足區之製造方法 - Google Patents

容納至少一連接器之印刷電路板以及印刷電路板上連接器足區之製造方法 Download PDF

Info

Publication number
TWI406606B
TWI406606B TW097116142A TW97116142A TWI406606B TW I406606 B TWI406606 B TW I406606B TW 097116142 A TW097116142 A TW 097116142A TW 97116142 A TW97116142 A TW 97116142A TW I406606 B TWI406606 B TW I406606B
Authority
TW
Taiwan
Prior art keywords
connector
base plane
component
circuit board
foot
Prior art date
Application number
TW097116142A
Other languages
English (en)
Other versions
TW200847861A (en
Inventor
Hine Tong Dominique Lo
Philippe Minard
Bras Jean-Luc Le
Original Assignee
Thomson Licensing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Licensing filed Critical Thomson Licensing
Publication of TW200847861A publication Critical patent/TW200847861A/zh
Application granted granted Critical
Publication of TWI406606B publication Critical patent/TWI406606B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/02—Connectors or connections adapted for particular applications for antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
    • H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
    • H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

容納至少一連接器之印刷電路板以及印刷電路板上連接器足區之製造方法
本發明係關於一種印刷電路板，能夠保持連接器，尤指測試連接器。
具體而言，本發明係關於該連接器在印刷電路板上轉移足區或隆部圖型之改良以及該圖型之製法。
本發明就一種印刷電路板加以說明，上面裝有接受天線，也有傳輸/接收系統，即無線通訊應用上之「前端無線電」。然而，凡精於此道之士均知，本發明可用於需用到測試連接器之任何印刷電路板。
第1圖簡略表示一種市售印刷電路板，上面裝有射頻(RF)電路，測試連接器1安裝於各印刷線2，把印刷電線3連接至RF電路5的輸入4之一。測試連接器事實上為微型連接器，在印刷電路板上，於天線和RF電路之間自動且確實轉移。
如第2圖所示，左邊係微型連接器之操作模態，右邊是測試模態，各連接器包括機械式切換系統，主要由二壘合片10,11構成，壘合片10在RF電路側輸入線偏移，而壘合片11與片10末端壘合，呈彈性片偏移，在天線側固定於輸出線。
此等連接器操作如下。在操作模態中，二片10,11短路，而RF電路之傳輸/接收訊號(E/R)直接連接於天線，回報若干接入損失。在測試模態中，第2圖中之共軸探針12，裝設有適用轉接器，插入電路板之連接器內。其效果是，以此方式把RF頻道從天線頻道脫開，把片11和片10分離，使RF電路之傳輸/接收訊號(E/R)可以復原，以便測量。
目前，連接器廠家所推荐的偏移足區，其形狀之一如第 3圖所示。因此，更準確而言，在印刷電路板的基體100一部份，實施二金屬饋電線101,102。此二線介於二基礎平面元件103,104之間。在連接器的附設處，各線以焊接短柱105,106延長。又有四焊接短柱107使連接器可附設於電路板。導電性材料足區108藉通過焊接短柱，連接二基礎平面103,104。
如第3圖所示，此足區或圖型利用金屬化洞孔109，連接至印刷電路板之下基礎平面。其他金屬化洞孔亦把基礎平面103,104連接至下基礎平面。金屬化洞孔使基體的上、下平面之間，具有基礎連續性。
以參見第3圖所示足區上安裝的市售測試連接器進行模擬，顯示對所選用操作頻帶而言，傳輸回應(S21)是準低通型。該項回應基本上由於連接器的中央部份之形式，設計來符合二項限制之故，亦即：-機械性限制，包括在二組件的操作模態中，提供完美而可靠的連接，以及在測試模態中，測試連接器的壘合片活動組件間之連接；-電氣性限制，即特別在操作模態中，提供完美阻抗，在特定操作頻帶中，配合特性阻抗之存取線。
本發明擬議轉移足區或隆部圖型之改良，得以產生整合選擇性濾波回應。
本發明係關於一種電路板，特點為至少一連接器，該電路板係由介質基體構成，包括在第一面的第一基礎平面，和在第二面的至少二輸電線，中間安裝連接器和足區，其特徵為，足區包括第一元件，位於二輸電線之間，連接器下方，該第一元件與第一基礎平面，形成電容性元件，在第一元件的各末端，第二元件與第一元件形成自感性且電容性元件，該第二元件各利用第二基礎平面延伸，第二基礎平面係連接 至第一基礎平面。
按照一具體例，第一和第二元件係由導電線構成。
導電線選用維度，使形成電容性和感應性元件的第一和第二元件之共振頻率，相當於至濾波器的頻帶。
按照本發明另一特徵，以多層基體而言，至少一浮動導電性平面係置於足區的第一元件下方。
按照一具體例，第二基礎平面利用位於接近足區第二元件之貫通孔或金屬化洞孔，與第一基礎平面連接。
按照本發明另一特徵，連接器是微型連接器，尤指測試連接器。
本發明亦關係到印刷電路板上連接器足區之製造方法，包括步驟為：-在基體被第一基礎平面覆蓋的相反面，連接於連接器的二輸電線之間，蝕刻導電性足區，包括垂直於輸電線之第一元件，與基礎平面形成電容性元件，而在第一元件之至少一末端，第二元件與第一元件形成自感性且電容性元件，足區在該面利用第二基礎平面延伸，和-經由貫通孔或金屬化通孔，把第二基礎平面連接至第一基礎平面。
本發明其他特徵和優點，由參照附圖所示不同具體例之說明即可明白。
如第4圖所示，由介質基體100形成之印刷電路板，在其下面設有基礎平面109，實施二金屬化存取線101,102。在各線的一末端之間，安裝連接器120。此連接器在盒124內包括U形第一金屬片121，焊接於線101的末端，和J形第二金屬片122，焊接於線102的末端。金屬片121,122的二末端之間，安裝中央片123。該中央片附設在片121的自由端，可相對於片122的自由端活動。盒124在中部裝設通孔 125，設計成可容納測試探針。二存取線101,102之間，連接器下方，實施導電性足區111，利用金屬化洞孔109或貫通孔，與印刷電路板的基礎平面110連接。
以第4圖所示總成進行測試，顯示所得傳輸回應S21對大帶寬度而言，是準低通型。所以，第4圖結構可按照第5圖等效電路圖加以模造，即埠P1和P2顯示連接器片對二存取線之附設點，自電感Ls顯示二金屬片121,122的寄生自電感，而Cp是此等金屬片和跨越連接器的基礎平面111間之寄生耦合電容器，此基礎平面111係利用金屬化洞孔109，與電路板的基礎平面110連接。
本發明係關於足區之改良，使濾波功能可以直接整合。此種具有濾波功能之足區特別有趣，因為可免在電路板上整合另外濾波器。結果是降低生產成本和節省空間。
茲參見第6、7、8圖說明本發明測試連接器之足區。在第6圖右側，顯示本發明具體例，而左側表示裝設該連接器的足區之示意俯視圖。因此，如第6圖所示，在介質基體200形成的印刷電路板下面設有基礎平面，實施二存取導電線201,202。此二線201,202的二末端，裝有測試連接器220。
如第6圖右側所示，在二存取線201,202的末端之間，基體200上實施導電性足區203，包括在二末端201和202間通過之第一元件203a，此第一元件203a是終端線，其維度形成電容性元件。此元件203a在各末端以第二元件203b延伸，後者寬度比元件203a大。元件203b係由終端線形成，其維度在於實施自感性和電容性元件。上述實施之足區電路圖，可參見第7圖詳述。此足區203以上基礎平面204,205延伸，後者利用金屬化洞孔或貫通孔206，連接於下基礎平面(圖上未示)。
在第6圖具體例中，與已知足區相反的是，足區203不 在中部連接下基礎平面。所以，裝設有連接器220的第6圖足區，可按照第7圖之等效電路圖模造。在此情況下，埠P1和P2表示連接器的金屬片在二存取線201和202上之附設點。自電感Ls表示連接器220二金屬片之寄生自電感，而Cp1是此等金屬片和跨越連接器的導電元件203a間之寄生耦合電感。在本發明文脈內，此元件203a不連接於基礎平面，形成電容器Cp2所示電容性元件，相當於線203a和基體下基礎平面間之電容。此電容器Cp2與自電感Lp並聯安裝，後者代表元件203b(把線203a延伸，並連接至利用金屬化洞孔206接地之基礎平面204和205)之等效寄生自電感。
上述足區使用下述元件模擬：足區在厚度1mm而電容率4.4之FR4型基體上實施。
足區在銅等金屬材料內實施，元件203a寬1.1mm、長2mm，第二元件203b維度為3mm×2.17mm。選擇此等維度使等效電路可得下列自電感和電容：Ls=0.4 nH
Cp1=0.7 pF
Cp2=0.2 pF
Lp=0.22 nH
以上述數值可用Agilent公司的ADS模擬器，由電磁模擬而得，其傳輸S21和回流損失S11回應，如第8圖所示。在此情況下，如此實施的足區在11.5 GHz得到斥拒，以5.5 GHz的無線應用情況言，即將2諧波過濾。
茲參見第9圖說明本發明足區之另一具體例。在第9圖右側，足區203'在各側以線元件207延伸。在此情況下，基礎平面204,205利用貫通孔206連接至下基礎平面，與傳統情況之足區不同。連接器220以與第一具體例一致方式焊接於存取線201,202末端。
如第9圖右側所示，另外線元件207長3.3mm，寬1.1 mm。金屬化貫通孔206與元件207末端距離0.5mm。此較長的線藉修飾自電感值，而修改諧振頻率。
茲參見第10圖說明本發明足區另一具體例。在此情況下，所用基體是多層基體，優點是在足區的設計有額外自由度，就中心頻率和帶寬，可符合特殊濾波樣板。
如第10圖所示，300簡示基體。在基體上部，實施二存取線301,302，在其末端之間形成本發明足區303。在線301和302的二末端之間，亦安裝連接器之二片，有如上述。足區303一如第6圖之足區，包括第一元件300a，在各側利用二特別元件300b延伸，具有自電感和電容性效果。足區303在各側連接至上基礎平面304，利用金屬化洞孔306連接至下基礎平面300。
由第10圖清楚顯示，在足區303下方實施浮動導電元件307。此元件可提高拒斥帶之寬度。
上述足區整合選擇性濾波功能。不必再增加外部組件，以實施此功能。
1‧‧‧測試連接器
2‧‧‧印刷線
3‧‧‧印刷電線
4‧‧‧輸入
5‧‧‧RF電路
10,11‧‧‧壘合片
12‧‧‧共軸探針
100,200,300‧‧‧基體
101,102,201,202,301,302‧‧‧存取線
103,104,110‧‧‧基礎平面
105,106,107‧‧‧焊接短柱
108,111,203,203',303‧‧‧足區
109,206,306‧‧‧金屬化洞孔或貫通孔
120,220‧‧‧連接器
121,122‧‧‧金屬片
123‧‧‧中央片
124‧‧‧盒
125‧‧‧通孔
P1,P2‧‧‧埠
Ls,Lp‧‧‧電感
Cp,Cp1,Cp2‧‧‧寄生耦合電感
203a,303a‧‧‧第一元件
203b,303b‧‧‧第二元件
204,205,304‧‧‧上基礎平面
207‧‧‧線元件
307‧‧‧浮動導電元件
第1圖為市售裝有測試連接器的印刷電路板俯視平面圖；第2圖為說明本發明所應用測試連接器操作之極簡略斷面圖；第3圖為能使測試連接器偏移的印刷電路板所實施足區或圖型之簡略平面圖；第4圖為表示先前技術的印刷電路板上測試連接器轉移之斷面圖；第5圖為具有諸如第3圖所界定足區的連接器之等效電路圖；第6圖為本發明在連接器的印刷電路板上轉移用足區之俯視平面圖； 第7圖為具有諸如第6圖所示足區的連接器等效電路圖；第8圖為第6圖足區傳輸和阻抗配合曲線圖；第9圖為本發明足區另一具體例之俯視平面圖；第10圖為本發明足區又一具體例之簡略透視圖。
200‧‧‧基體
201,202‧‧‧存取線
203‧‧‧足區
203a‧‧‧第一元件
203b‧‧‧第二元件
204,205‧‧‧上基礎平面
206‧‧‧金屬化洞孔或貫通孔
220‧‧‧連接器

Claims (7)

  1. 一種容納至少一連接器之電路板，係由介質基體(200,300)構成，包括在第一面之第一基礎平面，和在第二面之至少二輸電線(201,202;301,302)，其間安裝連接器(220)和足區(203,303)，其特徵為，足區包括第一元件(203a,303a)，位於二輸電線之間，連接器下方，該第一元件與第一基礎平面，形成電容性元件，而在第一元件之一末端，第二元件(203b,303b)與第一元件，形成自感性和電容性元件，該第二元件利用第二基礎平面(204,205,304)延伸，該第二基礎平面係連接至第一基礎平面者。
  2. 如申請專利範圍第1項之電路板，其中第一元件(203a,303a)和第二元件(203b,303b)係由導電線構成者。
  3. 如申請專利範圍第2項之電路板，其中選擇導電線之維度，使形成電容性和自感性元件之第一和第二元件，相當於至濾波器之頻率者。
  4. 如申請專利範圍第1項之電路板，其中在多層基體情況下，至少一浮動導電層(307)置於足區(303)下方者。
  5. 如申請專利範圍第1項之電路板，其中第二基礎平面(204,205;304)利用位於接近足區第二元件之至少一貫通孔，連接於第一基礎平面者。
  6. 如申請專利範圍第1項之電路板，其中連接器係測試連接器者。
  7. 一種印刷電路板上連接器足區之製造方法，包括下列步驟：-在基體被第一基礎平面覆蓋的相反面，連接於連接器的二輸電線之間，蝕刻導電性足區，包括垂直於輸電線之第一元件，與基礎平面形成電容性元件，而在第一元件之至少一末端，第二元件與第一元件形成自感性且電容性元件，足區在該面利用第二基礎平面延伸；和-經由貫通孔或金屬化通孔，把第二基礎平面連接至第一基礎平面者。
TW097116142A 2007-05-21 2008-05-02 容納至少一連接器之印刷電路板以及印刷電路板上連接器足區之製造方法 TWI406606B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0755167A FR2916601A1 (fr) 2007-05-21 2007-05-21 Perfectionnement a l'empreinte de report d'un connecteur sur une carte imprimee.

Publications (2)

Publication Number Publication Date
TW200847861A TW200847861A (en) 2008-12-01
TWI406606B true TWI406606B (zh) 2013-08-21

Family

ID=38543670

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097116142A TWI406606B (zh) 2007-05-21 2008-05-02 容納至少一連接器之印刷電路板以及印刷電路板上連接器足區之製造方法

Country Status (8)

Country Link
US (1) US8063719B2 (zh)
EP (1) EP1995998B1 (zh)
JP (1) JP5592060B2 (zh)
KR (1) KR101438188B1 (zh)
CN (1) CN101321435B (zh)
DE (1) DE602008000811D1 (zh)
FR (1) FR2916601A1 (zh)
TW (1) TWI406606B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4772556B2 (ja) * 2006-03-29 2011-09-14 富士通コンポーネント株式会社 電子装置の製造方法
JP5799852B2 (ja) * 2011-03-30 2015-10-28 ソニー株式会社 入出力装置
US10129974B2 (en) 2016-03-21 2018-11-13 Industrial Technology Research Institute Multi-layer circuit structure
CN112595920B (zh) * 2021-02-26 2021-05-25 荣耀终端有限公司 一种射频传导测试方法及相关装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040018814A1 (en) * 2002-07-25 2004-01-29 Tsung-Liang Lin Layout of wireless communication circuit on a printed circuit board
US20050200431A1 (en) * 2004-03-10 2005-09-15 Yo-Shen Lin Lumped-element low-pass filter in multi-layered substrate
WO2006009274A1 (en) * 2004-07-23 2006-01-26 Nec Corporation Composite via structures and filters in multilayer printed circuit boards
CN1798472A (zh) * 2004-12-24 2006-07-05 鸿富锦精密工业（深圳）有限公司 引脚连接结构及其脚位定义的修改方法
US20060158280A1 (en) * 2005-01-14 2006-07-20 Uei-Ming Jow High frequency and wide band impedance matching via
JP2006229161A (ja) * 2005-02-21 2006-08-31 Sumitomo Electric Ind Ltd 多面付け基板
EP1780769A2 (en) * 2005-11-01 2007-05-02 Taiyo Yuden Co., Ltd. High frequency module
US20070134953A1 (en) * 2005-12-09 2007-06-14 Tyco Electronics Corporation Electrical connector having a circuit board with controlled impedance
WO2007132406A2 (en) * 2006-05-11 2007-11-22 Nxp B.V. Resonator device with shorted stub and mim-capacitor
US20080023219A1 (en) * 2006-07-28 2008-01-31 Tdk Corporation Electronic component and method for manufacturing same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9502326D0 (sv) * 1995-06-27 1995-06-27 Sivers Ima Ab Mikrovågskrets, sådan krets av kapslat utförande, samt användning av mikrovågskretsen i ett kretsarrangemang
US6727777B2 (en) * 2001-04-16 2004-04-27 Vitesse Semiconductor Corporation Apparatus and method for angled coaxial to planar structure broadband transition
JP3998996B2 (ja) * 2002-03-01 2007-10-31 凌和電子株式会社 高周波伝送線路接続システムおよびその方法
US7327035B2 (en) * 2004-09-08 2008-02-05 Texas Instruments Incorporated System and method for providing a low frequency filter pole
TWI290443B (en) * 2005-05-10 2007-11-21 Via Tech Inc Signal transmission structure, wire board and connector assembly structure
JP4772556B2 (ja) * 2006-03-29 2011-09-14 富士通コンポーネント株式会社 電子装置の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040018814A1 (en) * 2002-07-25 2004-01-29 Tsung-Liang Lin Layout of wireless communication circuit on a printed circuit board
US20050200431A1 (en) * 2004-03-10 2005-09-15 Yo-Shen Lin Lumped-element low-pass filter in multi-layered substrate
WO2006009274A1 (en) * 2004-07-23 2006-01-26 Nec Corporation Composite via structures and filters in multilayer printed circuit boards
CN1798472A (zh) * 2004-12-24 2006-07-05 鸿富锦精密工业（深圳）有限公司 引脚连接结构及其脚位定义的修改方法
US20060158280A1 (en) * 2005-01-14 2006-07-20 Uei-Ming Jow High frequency and wide band impedance matching via
JP2006229161A (ja) * 2005-02-21 2006-08-31 Sumitomo Electric Ind Ltd 多面付け基板
EP1780769A2 (en) * 2005-11-01 2007-05-02 Taiyo Yuden Co., Ltd. High frequency module
US20070134953A1 (en) * 2005-12-09 2007-06-14 Tyco Electronics Corporation Electrical connector having a circuit board with controlled impedance
WO2007132406A2 (en) * 2006-05-11 2007-11-22 Nxp B.V. Resonator device with shorted stub and mim-capacitor
US20080023219A1 (en) * 2006-07-28 2008-01-31 Tdk Corporation Electronic component and method for manufacturing same

Also Published As

Publication number Publication date
TW200847861A (en) 2008-12-01
JP5592060B2 (ja) 2014-09-17
CN101321435B (zh) 2012-02-08
JP2008288596A (ja) 2008-11-27
KR101438188B1 (ko) 2014-09-04
US8063719B2 (en) 2011-11-22
FR2916601A1 (fr) 2008-11-28
US20080290967A1 (en) 2008-11-27
KR20080102961A (ko) 2008-11-26
CN101321435A (zh) 2008-12-10
EP1995998A1 (en) 2008-11-26
DE602008000811D1 (de) 2010-04-29
EP1995998B1 (en) 2010-03-17

Similar Documents

Publication Publication Date Title
US9812750B2 (en) High frequency band pass filter with coupled surface mount transition
US6078231A (en) High frequency filter with a dielectric board element to provide electromagnetic couplings
US20090236701A1 (en) Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement
US7289069B2 (en) Wireless device antenna
JP5737457B2 (ja) 信号線路モジュールおよび通信端末装置
TWI406606B (zh) 容納至少一連接器之印刷電路板以及印刷電路板上連接器足區之製造方法
JPWO2010013610A1 (ja) 平面アンテナ
TWI242878B (en) High frequency equipment
CN107994344A (zh) 双频天线模块
EP1585184B1 (en) Direct current cut structure
JP2004236327A (ja) 接地導体板を組込んだマルチセグメント型平面アンテナ
EP2363720B1 (en) Method of manufacture of an integrated circuit package
JP7167988B2 (ja) 伝送線路基板、および伝送線路基板の接合構造
US20050062557A1 (en) Laminated ceramic coupler
CN116259940B (zh) 一种半集总元件构成的双通带滤波器
JP4374544B2 (ja) ２ポートアイソレータの特性調整方法
US10840575B2 (en) Band pass filter including microstrip transmission line
CN116915210A (zh) 共振器及电路元件
TWI581501B (zh) Antenna device
KR20220086376A (ko) 다층 pcb의 전송선로와 웨이브가이드 간의 전이구조
JP2005311979A (ja) 帯域フィルタおよび高周波モジュール
KR20060018507A (ko) 마이크로스트립라인을 이용한 대역 통과 필터
US20070170968A1 (en) Device for transmitting electromagnetic signals and application of said device
JP2005167627A (ja) 積層型電子部品、無線装置
KR20040011726A (ko) 안테나 스위치 모듈 측정장치 및 그 제조방법