JP6154402B2 - 高速通信用ジャック - Google Patents
高速通信用ジャック Download PDFInfo
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- JP6154402B2 JP6154402B2 JP2014556564A JP2014556564A JP6154402B2 JP 6154402 B2 JP6154402 B2 JP 6154402B2 JP 2014556564 A JP2014556564 A JP 2014556564A JP 2014556564 A JP2014556564 A JP 2014556564A JP 6154402 B2 JP6154402 B2 JP 6154402B2
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- 230000006854 communication Effects 0.000 title claims description 35
- 238000004891 communication Methods 0.000 title claims description 35
- 239000000758 substrate Substances 0.000 claims description 47
- 239000003990 capacitor Substances 0.000 claims description 26
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 20
- 229910052737 gold Inorganic materials 0.000 claims description 20
- 239000010931 gold Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 10
- 239000003989 dielectric material Substances 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 123
- ZLGYJAIAVPVCNF-UHFFFAOYSA-N 1,2,4-trichloro-5-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 ZLGYJAIAVPVCNF-UHFFFAOYSA-N 0.000 description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- -1 but not limited to Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- BWWVXHRLMPBDCK-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,6-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl BWWVXHRLMPBDCK-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007175 bidirectional communication Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002592 echocardiography Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
- H01R13/7195—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters with planar filters with openings for contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Structure Of Printed Boards (AREA)
Description
本開示は、2012年2月13日に出願された「HIGH SPEED JACK(高速用ジャック)」という名称の米国仮特許出願第61/598288号に対する優先権を主張する。この米国仮特許出願は、引用することにより、その全体が本明細書の一部をなす。
基板と、
各ビアが前記ハウジング上のピンを収容するように構成され、前記基板を貫通する複数のビアと、
各トレースが前記複数のビアのうちの対応する1つから延びる、前記基板の第1の面上の複数のトレースと、
前記基板の前記第1の面とは反対側の該基板の第2の面上のシールド面と、
を有してもよい。
前記ハウジングを囲むシールドケースと、
前記シールドケースと前記ハウジングとの間のフレキシブル回路板と、
を備えてもよい。前記フレキシブル回路板は、
基板と、
各ビアが前記ハウジング上のピンを収容するように構成され、前記基板を貫通する複数のビアと、
各トレースが前記複数のビアのうちの対応する1つから延びる、前記基板の第1の面上の複数のトレースと、
前記基板の前記第1の面とは反対側の該基板の第2の面上のシールド面と、
を有してもよい。
フレキシブル回路板を形成するステップであって、前記フレキシブル回路板は、基板と、各ビアが前記ハウジング上のピンを収容するように構成され、前記基板を貫通する複数のビアと、各トレースが前記複数のビアのうちの対応する1つから延びる、前記基板の第1の面上の複数のトレースと、前記基板の前記第1の面とは反対側の該基板の第2の面上のシールド面と、前記フレキシブル回路板の反対端上にあり、シールドトレースによって該電気回路板に接続される少なくとも2つのシールドタブとを有する、形成するステップと、
前記フレキシブル回路板における各ビアを前記ハウジングの対応するピンに挿入するステップと、
前記ビアを有する前記フレキシブル回路板の一部が、前記ハウジングの前記下面上にあるとともに、前記ハウジングの前記後部上にある前記シールド面を有する前記フレキシブル回路板の一部に対して直交するように、前記フレキシブル回路板を屈曲させるステップと、
1つのシールドタブが前記ハウジングの前記左側面に接触し、1つのシールドタブが前記右側面に接触するように、各シールドタブを屈曲させるステップと、
シールドケースが前記シールドタブのそれぞれに接触するように、前記フレキシブル回路板及び前記ハウジング上に前記シールドケースを形成するステップと、
を含んでもよい。
プラグを受け入れ、該プラグの対応する信号線にそれぞれ接続される複数のピンを有するポートを有するハウジングと、
前記ハウジングを囲むシールドケースと、
前記シールドケースと前記ハウジングとの間の多層フレキシブル回路板と、
を備える高速通信用ジャックを挙げることができる。前記多層フレキシブル回路板は、
各トレースが複数のビアのうちの対応する1つから延びる複数のトレースを有する第1の層と、
前記第1の層の前記トレースとは反対側にある誘電性材料の第2の層と、
前記第2の層の前記第1の層とは反対側にあるとともに導電性材料から作成される戻り面を有する第3の層と、
前記第3の層の前記第2の層とは反対側にあるとともに誘電性材料からで作成される第4の層と、
前記第4の層の前記第3の層とは反対側にあるとともに導電性材料からで作成される第5の層と、
を有してもよい。
各ビアが前記ハウジング上のピンを収容するように構成される複数のビアが、前記第1の層、前記第2の層、前記第3の層、前記第4の層、及び前記第5の層を貫通してもよい。
Claims (20)
- プラグを受け入れ、該プラグの対応する信号線にそれぞれ接続される複数のピンを有するポートを有するハウジングと、
前記ハウジングを囲むシールドケースと、
前記シールドケースと前記ハウジングとの間のフレキシブル回路板であって、
基板と、
各ビアが前記ハウジング上のピンを収容するように構成され、前記基板を貫通する複数のビアと、
各トレースが前記複数のビアのうちの対応する1つから延びる、前記基板の第1の面上の複数のトレースと、
前記基板の前記第1の面とは反対側の該基板の第2の面上のシールド面と、
を有する、フレキシブル回路板と、
を備える、高速通信用ジャック。 - 励起されるとき、前記複数のトレースの各トレースが、前記複数のトレースの隣接する第2のトレースに差動的に整合する、請求項1に記載のジャック。
- 整合対のトレースにおける第1のトレースのインピーダンス値が、前記整合対のトレースにおける前記第2のトレースのインピーダンス値に略等しいように調整される、請求項2に記載のジャック。
- トレース層と、誘電層に埋め込まれている戻り信号層とによって、コンデンサーが各ビアに形成される、請求項1に記載のジャック。
- 前記戻り信号層と前記トレース層との間の距離が、前記コンデンサーがおよそ1pf〜およそ5pfの値を有するように調整される、請求項4に記載のジャック。
- 整合組のトレースにおける各トレースの幅、高さ、又は長さが、前記第1のトレースのインピーダンスが前記第2のトレースのインピーダンスと整合するように調整される、請求項3に記載のジャック。
- 第2のコンデンサーを形成するために、第2の戻り信号層が前記第1の戻り信号層の下方の前記誘電層に形成される、請求項4に記載のジャック。
- 前記第2のコンデンサーの値を1pf〜5pfに調整するために、前記第1の戻り信号層と前記第2の戻り信号層との間の距離が調整される、請求項7に記載のジャック。
- 前記第1のトレース及び前記第2のトレースのインピーダンスは、第1の信号が前記第1のトレース上に送信され、第2の信号が前記第2のトレース上に送信されるとき、前記トレースが整合するように調整される、請求項3に記載のジャック。
- 前記コンデンサーと、前記トレースと、前記戻り信号層とが、整合組のトレースに対するコモンモードフィルターを形成する、請求項4に記載のジャック。
- 前記コンデンサーの値は、前記コモンモードフィルターが前記整合するトレースからの信号の反射を防止するように調整される、請求項10に記載のジャック。
- 前記基板の前記第1のシールドとは反対側に第2のシールドタブを備える、請求項11に記載のジャック。
- 前記トレースは金でめっきされる、請求項1に記載のジャック。
- 前記基板は3.0よりも大きい誘電率を有する誘電性材料を含む、請求項1に記載のジャック。
- プラグを受け入れ、該プラグの対応する信号線に接続される複数のピンを有するポートを有する標準RJ45ハウジングを備える高速通信用ジャックであって、該ジャックは、
前記ハウジングを囲むシールドケースと、
前記シールドケースと前記ハウジングとの間のフレキシブル回路板であって、
基板と、
各ビアが前記ハウジング上のピンを収容するように構成され、前記基板を貫通する複数のビアと、
各トレースが前記複数のビアのうちの対応する1つから延びる、前記基板の第1の面上の複数のトレースと、
前記基板の前記第1の面とは反対側の該基板の第2の面上のシールド面と、
を有する、フレキシブル回路板と、
を備える、高速通信用ジャック。 - 前面と、後面と、上面と、下面と、右面と、左面とを有する標準RJ45ハウジングを用いて高速通信用ジャックを製造する方法であって、前記ハウジングは、前記プラグの対応する信号線にそれぞれ接続される複数のピンを有し、該方法は、
フレキシブル回路板を形成するステップであって、前記フレキシブル回路板は、基板と、各ビアが前記ハウジング上のピンを収容するように構成され、前記基板を貫通する複数のビアと、各トレースが前記複数のビアのうちの対応する1つから延びる、前記基板の第1の面上の複数のトレースと、前記基板の前記第1の面とは反対側の該基板の第2の面上のシールド面と、前記フレキシブル回路板の反対端上にあり、シールドトレースによって該電気回路板に接続される少なくとも2つのシールドタブとを有する、形成するステップと、
前記フレキシブル回路板における各ビアを前記ハウジングの対応するピンに挿入するステップと、
前記ビアを有する前記フレキシブル回路板の一部が、前記ハウジングの前記下面上にあるとともに、前記ハウジングの前記後部上にある前記シールド面を有する前記フレキシブル回路板の一部に対して直交するように、前記フレキシブル回路板を屈曲させるステップと、
1つのシールドタブが前記ハウジングの前記左側面に接触し、1つのシールドタブが前記右側面に接触するように、各シールドタブを屈曲させるステップと、
シールドケースが前記シールドタブのそれぞれに接触するように、前記フレキシブル回路板及び前記ハウジング上に前記シールドケースを形成するステップと、
を含む、方法。 - プラグを受け入れ、該プラグの対応する信号線にそれぞれ接続される複数のピンを有するポートを有するハウジングと、
前記ハウジングを囲むシールドケースと、
前記シールドケースと前記ハウジングとの間の多層フレキシブル回路板であって、
複数のトレースを有する第1の層と、
前記第1の層の前記トレースとは反対側にある誘電性材料の第2の層と、
前記第2の層の前記第1の層とは反対側にあるとともに導電性材料から作成される戻り面を有する第3の層と、
前記第3の層の前記第2の層とは反対側にあるとともに誘電性材料から作成される第4の層と、
前記第4の層の前記第3の層とは反対側にあるとともに導電性材料から作成される第5の層と、
各ビアが前記ハウジング上のピンを収容するように構成され、前記第1の層、前記第2の層、前記第3の層、前記第4の層、及び前記第5の層を貫通する複数のビアと、
を有する、多層フレキシブル回路板と、
を備える、高速通信用ジャック。 - 前記第1の層、前記第2の層、及び前記第3の層上の前記複数のトレースのうちの1つの組合せによって、コンデンサーが各ビアに形成される、請求項17に記載のジャック。
- 前記第2の層の深さは、各ビアにおける前記コンデンサーがおよそ1pf〜およそ5pfの値を有するように調整される、請求項18に記載のジャック。
- 前記第4の層と第5の層との間に形成され、導電性材料で作成される第6の層と、
前記第6の層と前記第5の層との間に形成され、誘電性材料で作成される第7の層と、
を備える、請求項17に記載のジャック。
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US61/598,288 | 2012-02-13 | ||
PCT/US2013/022919 WO2013122727A1 (en) | 2012-02-13 | 2013-01-24 | High speed communication jack |
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