JP5586587B2 - Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴 - Google Patents

Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴 Download PDF

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Publication number
JP5586587B2
JP5586587B2 JP2011507793A JP2011507793A JP5586587B2 JP 5586587 B2 JP5586587 B2 JP 5586587B2 JP 2011507793 A JP2011507793 A JP 2011507793A JP 2011507793 A JP2011507793 A JP 2011507793A JP 5586587 B2 JP5586587 B2 JP 5586587B2
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electrolyte
palladium
metal
alloy
electrolyte according
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Japanese (ja)
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JP2011520036A (ja
JP2011520036A5 (enExample
Inventor
ベルガー ザーシャ
オーベルスト フランク
ズィーモン フランツ
マンツ ウーヴェ
ブロンダー クラウス
ヴァイミュラー ベルント
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Umicore Galvanotechnik GmbH
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Umicore Galvanotechnik GmbH
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
JP2011507793A 2008-05-07 2008-05-07 Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴 Active JP5586587B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2008/003667 WO2009135505A1 (de) 2008-05-07 2008-05-07 Pd- und pd-ni-elektrolytbäder

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013120213A Division JP2013189715A (ja) 2013-06-06 2013-06-06 Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴

Publications (3)

Publication Number Publication Date
JP2011520036A JP2011520036A (ja) 2011-07-14
JP2011520036A5 JP2011520036A5 (enExample) 2013-07-25
JP5586587B2 true JP5586587B2 (ja) 2014-09-10

Family

ID=40193655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011507793A Active JP5586587B2 (ja) 2008-05-07 2008-05-07 Ｐｄ電解質浴およびＰｄ−Ｎｉ電解質浴

Country Status (10)

Country Link
US (1) US8900436B2 (enExample)
EP (1) EP2283170B1 (enExample)
JP (1) JP5586587B2 (enExample)
KR (1) KR101502804B1 (enExample)
CN (1) CN102037162B (enExample)
AT (1) ATE555235T1 (enExample)
ES (1) ES2387055T3 (enExample)
PL (1) PL2283170T3 (enExample)
TW (1) TWI475134B (enExample)
WO (1) WO2009135505A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009029558A1 (de) * 2009-09-17 2011-03-31 Schott Solar Ag Elektrolytzusammensetzung
RU2469697C1 (ru) * 2011-05-23 2012-12-20 Открытое акционерное общество "Научно-производственный комплекс "Суперметалл" имени Е.И. Рытвина" Способ нанесения гальванического покрытия на съемные зубные протезы
CN104885298B (zh) * 2012-12-12 2017-12-26 Ls电线有限公司 无线电力用天线以及具备该无线电力用天线的双模天线
KR102482321B1 (ko) * 2014-09-04 2022-12-27 니혼 고쥰도가가쿠 가부시키가이샤 팔라듐 도금액 및 그것을 사용하여 얻어진 팔라듐 피막
JP6189878B2 (ja) * 2015-01-14 2017-08-30 松田産業株式会社 パラジウム又はパラジウム合金めっき用シアン耐性付与剤、めっき液、めっき液へのシアン耐性付与方法
AT516876B1 (de) * 2015-03-09 2016-11-15 Ing W Garhöfer Ges M B H Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen
US20180053714A1 (en) * 2016-08-18 2018-02-22 Rohm And Haas Electronic Materials Llc Multi-layer electrical contact element
JP6663335B2 (ja) * 2016-10-07 2020-03-11 松田産業株式会社 パラジウム−ニッケル合金皮膜及びその製造方法
KR101867733B1 (ko) * 2016-12-22 2018-06-14 주식회사 포스코 철-니켈 합금 전해액, 표면조도가 우수한 철-니켈 합금 포일 및 이의 제조방법
CN107385481A (zh) * 2017-07-26 2017-11-24 苏州鑫旷新材料科技有限公司 一种无氰电镀金液
EP3456870A1 (en) * 2017-09-13 2019-03-20 ATOTECH Deutschland GmbH A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy
CN108864200B (zh) * 2018-08-06 2020-12-11 金川集团股份有限公司 电镀用硫酸乙二胺钯的一步制备方法
DE102018133244A1 (de) 2018-12-20 2020-06-25 Umicore Galvanotechnik Gmbh Nickel-Amin-Komplex mit reduzierter Tendenz zur Bildung schädlicher Abbauprodukte
CN110144729B (zh) * 2019-06-14 2020-07-07 中国科学院长春应用化学研究所 一种导电金包覆聚酰亚胺纤维及其制备方法
JP7282136B2 (ja) * 2021-02-12 2023-05-26 松田産業株式会社 パラジウムめっき液及びパラジウムめっき補充液
CN115244222A (zh) * 2021-02-12 2022-10-25 松田产业株式会社 镀钯液和镀钯补充液
CN116043290B (zh) * 2022-12-01 2025-07-22 崇辉半导体(深圳)有限公司 一种提升led灯珠寿命的电镀工艺
AT528141A1 (de) * 2024-03-28 2025-10-15 Iwg Ing W Garhoefer Ges M B H Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US3972787A (en) * 1974-06-14 1976-08-03 Lea-Ronal, Inc. Palladium electrolyte baths utilizing quaternized pyridine compounds as brighteners
US4328286A (en) * 1979-04-26 1982-05-04 The International Nickel Co., Inc. Electrodeposited palladium, method of preparation and electrical contact made thereby
US4401527A (en) * 1979-08-20 1983-08-30 Occidental Chemical Corporation Process for the electrodeposition of palladium
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution
GB2112018B (en) * 1981-02-27 1984-08-15 Western Electric Co Palladium and palladium alloys electroplating procedure
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
US4406755A (en) * 1982-03-08 1983-09-27 Technic Inc. Bright palladium electrodeposition
EP0187811A1 (en) * 1984-07-02 1986-07-23 AT&T Corp. Palladium electroplating process
JPS6199694A (ja) * 1984-10-19 1986-05-17 Nippon Kokan Kk <Nkk> 金属ストリツプの電気めつき方法
DD288291A7 (de) * 1988-08-24 1991-03-28 Fi F. Ne-Metalle,De Verfahren zur herstellung von palladiumtetrammindihydrogencarbonat
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
US5178745A (en) * 1991-05-03 1993-01-12 At&T Bell Laboratories Acidic palladium strike bath
US5415685A (en) * 1993-08-16 1995-05-16 Enthone-Omi Inc. Electroplating bath and process for white palladium
CN1214990A (zh) * 1997-10-22 1999-04-28 林锦暖 聚烯烃塑料一体成型的鞋中底制法
RU2161535C2 (ru) * 1998-07-15 2001-01-10 Парфенов Анатолий Николаевич Способ приготовления палладиевого катализатора
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
FR2807422B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
CN1289716C (zh) * 2001-11-30 2006-12-13 松田产业株式会社 钯电镀液

Also Published As

Publication number Publication date
WO2009135505A1 (de) 2009-11-12
ATE555235T1 (de) 2012-05-15
KR101502804B1 (ko) 2015-03-16
ES2387055T3 (es) 2012-09-12
JP2011520036A (ja) 2011-07-14
EP2283170A1 (de) 2011-02-16
US8900436B2 (en) 2014-12-02
CN102037162B (zh) 2013-03-27
EP2283170B1 (de) 2012-04-25
CN102037162A (zh) 2011-04-27
PL2283170T3 (pl) 2012-09-28
TW201006967A (en) 2010-02-16
KR20110003519A (ko) 2011-01-12
TWI475134B (zh) 2015-03-01
US20110168566A1 (en) 2011-07-14

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