ES2387055T3 - Baños de electrolitos de Pd y Pd-Ni - Google Patents
Baños de electrolitos de Pd y Pd-Ni Download PDFInfo
- Publication number
- ES2387055T3 ES2387055T3 ES08758401T ES08758401T ES2387055T3 ES 2387055 T3 ES2387055 T3 ES 2387055T3 ES 08758401 T ES08758401 T ES 08758401T ES 08758401 T ES08758401 T ES 08758401T ES 2387055 T3 ES2387055 T3 ES 2387055T3
- Authority
- ES
- Spain
- Prior art keywords
- electrolyte
- palladium
- deposition
- group
- electrolyte according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003792 electrolyte Substances 0.000 title claims abstract 20
- 229910052763 palladium Inorganic materials 0.000 title claims abstract 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract 10
- 238000000034 method Methods 0.000 claims abstract 7
- 239000000758 substrate Substances 0.000 claims abstract 4
- 229910001252 Pd alloy Inorganic materials 0.000 claims abstract 3
- -1 3-sulfonylpropyl Chemical group 0.000 claims 6
- 230000008021 deposition Effects 0.000 claims 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 150000003839 salts Chemical class 0.000 claims 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 claims 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229960003237 betaine Drugs 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 150000002500 ions Chemical class 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 229910021645 metal ion Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- KSSJBGNOJJETTC-UHFFFAOYSA-N COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC Chemical compound COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC KSSJBGNOJJETTC-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910000640 Fe alloy Inorganic materials 0.000 claims 1
- 229910002651 NO3 Inorganic materials 0.000 claims 1
- 229910000990 Ni alloy Inorganic materials 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 150000001449 anionic compounds Chemical class 0.000 claims 1
- 239000005557 antagonist Substances 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910001412 inorganic anion Inorganic materials 0.000 claims 1
- 239000003446 ligand Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 125000001453 quaternary ammonium group Chemical group 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 150000002940 palladium Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2008/003667 WO2009135505A1 (de) | 2008-05-07 | 2008-05-07 | Pd- und pd-ni-elektrolytbäder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2387055T3 true ES2387055T3 (es) | 2012-09-12 |
Family
ID=40193655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES08758401T Active ES2387055T3 (es) | 2008-05-07 | 2008-05-07 | Baños de electrolitos de Pd y Pd-Ni |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8900436B2 (enExample) |
| EP (1) | EP2283170B1 (enExample) |
| JP (1) | JP5586587B2 (enExample) |
| KR (1) | KR101502804B1 (enExample) |
| CN (1) | CN102037162B (enExample) |
| AT (1) | ATE555235T1 (enExample) |
| ES (1) | ES2387055T3 (enExample) |
| PL (1) | PL2283170T3 (enExample) |
| TW (1) | TWI475134B (enExample) |
| WO (1) | WO2009135505A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009029558A1 (de) * | 2009-09-17 | 2011-03-31 | Schott Solar Ag | Elektrolytzusammensetzung |
| RU2469697C1 (ru) * | 2011-05-23 | 2012-12-20 | Открытое акционерное общество "Научно-производственный комплекс "Суперметалл" имени Е.И. Рытвина" | Способ нанесения гальванического покрытия на съемные зубные протезы |
| CN104885298B (zh) * | 2012-12-12 | 2017-12-26 | Ls电线有限公司 | 无线电力用天线以及具备该无线电力用天线的双模天线 |
| KR102482321B1 (ko) * | 2014-09-04 | 2022-12-27 | 니혼 고쥰도가가쿠 가부시키가이샤 | 팔라듐 도금액 및 그것을 사용하여 얻어진 팔라듐 피막 |
| JP6189878B2 (ja) * | 2015-01-14 | 2017-08-30 | 松田産業株式会社 | パラジウム又はパラジウム合金めっき用シアン耐性付与剤、めっき液、めっき液へのシアン耐性付与方法 |
| AT516876B1 (de) * | 2015-03-09 | 2016-11-15 | Ing W Garhöfer Ges M B H | Abscheidung von dekorativen Palladium-Eisen-Legierungsbeschichtungen auf metallischen Substanzen |
| US20180053714A1 (en) * | 2016-08-18 | 2018-02-22 | Rohm And Haas Electronic Materials Llc | Multi-layer electrical contact element |
| JP6663335B2 (ja) * | 2016-10-07 | 2020-03-11 | 松田産業株式会社 | パラジウム−ニッケル合金皮膜及びその製造方法 |
| KR101867733B1 (ko) * | 2016-12-22 | 2018-06-14 | 주식회사 포스코 | 철-니켈 합금 전해액, 표면조도가 우수한 철-니켈 합금 포일 및 이의 제조방법 |
| CN107385481A (zh) * | 2017-07-26 | 2017-11-24 | 苏州鑫旷新材料科技有限公司 | 一种无氰电镀金液 |
| EP3456870A1 (en) * | 2017-09-13 | 2019-03-20 | ATOTECH Deutschland GmbH | A bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy |
| CN108864200B (zh) * | 2018-08-06 | 2020-12-11 | 金川集团股份有限公司 | 电镀用硫酸乙二胺钯的一步制备方法 |
| DE102018133244A1 (de) | 2018-12-20 | 2020-06-25 | Umicore Galvanotechnik Gmbh | Nickel-Amin-Komplex mit reduzierter Tendenz zur Bildung schädlicher Abbauprodukte |
| CN110144729B (zh) * | 2019-06-14 | 2020-07-07 | 中国科学院长春应用化学研究所 | 一种导电金包覆聚酰亚胺纤维及其制备方法 |
| JP7282136B2 (ja) * | 2021-02-12 | 2023-05-26 | 松田産業株式会社 | パラジウムめっき液及びパラジウムめっき補充液 |
| CN115244222A (zh) * | 2021-02-12 | 2022-10-25 | 松田产业株式会社 | 镀钯液和镀钯补充液 |
| CN116043290B (zh) * | 2022-12-01 | 2025-07-22 | 崇辉半导体(深圳)有限公司 | 一种提升led灯珠寿命的电镀工艺 |
| AT528141A1 (de) * | 2024-03-28 | 2025-10-15 | Iwg Ing W Garhoefer Ges M B H | Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3972787A (en) * | 1974-06-14 | 1976-08-03 | Lea-Ronal, Inc. | Palladium electrolyte baths utilizing quaternized pyridine compounds as brighteners |
| US4328286A (en) * | 1979-04-26 | 1982-05-04 | The International Nickel Co., Inc. | Electrodeposited palladium, method of preparation and electrical contact made thereby |
| US4401527A (en) * | 1979-08-20 | 1983-08-30 | Occidental Chemical Corporation | Process for the electrodeposition of palladium |
| US4278514A (en) * | 1980-02-12 | 1981-07-14 | Technic, Inc. | Bright palladium electrodeposition solution |
| GB2112018B (en) * | 1981-02-27 | 1984-08-15 | Western Electric Co | Palladium and palladium alloys electroplating procedure |
| US4686017A (en) * | 1981-11-05 | 1987-08-11 | Union Oil Co. Of California | Electrolytic bath and methods of use |
| US4406755A (en) * | 1982-03-08 | 1983-09-27 | Technic Inc. | Bright palladium electrodeposition |
| EP0187811A1 (en) * | 1984-07-02 | 1986-07-23 | AT&T Corp. | Palladium electroplating process |
| JPS6199694A (ja) * | 1984-10-19 | 1986-05-17 | Nippon Kokan Kk <Nkk> | 金属ストリツプの電気めつき方法 |
| DD288291A7 (de) * | 1988-08-24 | 1991-03-28 | Fi F. Ne-Metalle,De | Verfahren zur herstellung von palladiumtetrammindihydrogencarbonat |
| GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
| US5178745A (en) * | 1991-05-03 | 1993-01-12 | At&T Bell Laboratories | Acidic palladium strike bath |
| US5415685A (en) * | 1993-08-16 | 1995-05-16 | Enthone-Omi Inc. | Electroplating bath and process for white palladium |
| CN1214990A (zh) * | 1997-10-22 | 1999-04-28 | 林锦暖 | 聚烯烃塑料一体成型的鞋中底制法 |
| RU2161535C2 (ru) * | 1998-07-15 | 2001-01-10 | Парфенов Анатолий Николаевич | Способ приготовления палладиевого катализатора |
| FR2807450B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages |
| FR2807422B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages |
| CN1289716C (zh) * | 2001-11-30 | 2006-12-13 | 松田产业株式会社 | 钯电镀液 |
-
2008
- 2008-05-07 CN CN2008801290502A patent/CN102037162B/zh active Active
- 2008-05-07 WO PCT/EP2008/003667 patent/WO2009135505A1/de not_active Ceased
- 2008-05-07 KR KR1020107024801A patent/KR101502804B1/ko active Active
- 2008-05-07 ES ES08758401T patent/ES2387055T3/es active Active
- 2008-05-07 AT AT08758401T patent/ATE555235T1/de active
- 2008-05-07 US US12/990,864 patent/US8900436B2/en active Active
- 2008-05-07 PL PL08758401T patent/PL2283170T3/pl unknown
- 2008-05-07 JP JP2011507793A patent/JP5586587B2/ja active Active
- 2008-05-07 EP EP08758401A patent/EP2283170B1/de active Active
-
2009
- 2009-04-13 TW TW098112180A patent/TWI475134B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009135505A1 (de) | 2009-11-12 |
| ATE555235T1 (de) | 2012-05-15 |
| KR101502804B1 (ko) | 2015-03-16 |
| JP2011520036A (ja) | 2011-07-14 |
| EP2283170A1 (de) | 2011-02-16 |
| US8900436B2 (en) | 2014-12-02 |
| CN102037162B (zh) | 2013-03-27 |
| EP2283170B1 (de) | 2012-04-25 |
| CN102037162A (zh) | 2011-04-27 |
| PL2283170T3 (pl) | 2012-09-28 |
| JP5586587B2 (ja) | 2014-09-10 |
| TW201006967A (en) | 2010-02-16 |
| KR20110003519A (ko) | 2011-01-12 |
| TWI475134B (zh) | 2015-03-01 |
| US20110168566A1 (en) | 2011-07-14 |
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