JP5579180B2 - センサ装置及びその製造方法 - Google Patents
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/026—Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
2a、2b 導体トラック
3、3a、3a’、3b、3b’ NTC素子
4、4a、4b メタライゼーション
5、5a、5b 導電性ブリッジ
6 コンタクト部
Claims (12)
- セラミックキャリア基板(1)と、
前記セラミックキャリア基板(1)上に配置された少なくとも2つの導体トラック(2a、2b)と、
セラミックチップを含み、前記導体トラック(2a、2b)に電気的に接続された少なくとも2つのセラミック部材と、を有し、
前記少なくとも2つのセラミック部材は、焼き付けられたスクリーン印刷ペーストによって前記導体トラック(2a、2b)上に配置されるとともに機械的に接続され、導電性ブリッジ(5)によって互いに接続され、
前記導電性ブリッジ(5)は、前記導体トラックとは異なる材料であって前記セラミックキャリア基板(1)と同一の材料が主材料であるとともに、前記少なくとも2つのセラミック部材を電気的に接続する少なくとも1つの導体トラックを有することを特徴とするセンサ装置。 - 前記少なくとも2つのセラミック部材は、NTC素子を備えることを特徴とする請求項1に記載のセンサ装置。
- 1000℃までの温度を検出するように構成されていることを特徴とする請求項1又は2に記載のセンサ装置。
- 前記センサ装置は少なくとも2つのセラミック部材を有し、
前記少なくとも2つのセラミック部材は、前記セラミックキャリア基板(1)の長手方向において間隔を置いて配置され、且つ、それぞれが少なくとも1つの別個の前記導体トラック(2a、2b)によって互いに電気的に接続されていることを特徴とする請求項1乃至3のいずれか1に記載のセンサ装置。 - 前記少なくとも2つのセラミック部材は、少なくとも1つの共通の導体トラックにより電気的に接続されていることを特徴とする請求項4に記載のセンサ装置。
- 前記セラミックチップは、メタライゼーションが形成されていないことを特徴とする請求項1乃至5のいずれか1に記載のセンサ装置。
- 前記セラミック部材は、構成部材の接続領域を形成する2つの対向する表面を有し、
前記2つの対向する表面の全域には、導電性スクリーン印刷ペーストからなるメタライゼーション(4)が形成されていることを特徴とする請求項1乃至5のいずれか1に記載のセンサ装置。 - 前記セラミック部材は、短冊状をなし導電性スクリーン印刷ペーストからなるメタライゼーション(4a、4b)を有し、
前記メタライゼーションは、2つの対向する側方端部の領域に塗布されることを特徴とする請求項1乃至5のいずれか1に記載のセンサ装置。 - 準備されたセラミックキャリア基板(1)上の、セラミックチップを備える少なくとも2つのセラミック部材を焼き付け可能な導電性スクリーン印刷ペーストにより、前記セラミックキャリア基板(1)に機械的に固定して接続し、前記セラミックキャリア基板(1)上に配置された少なくとも2つの導体トラック(2a、2b)を前記少なくとも2つのセラミック部材上に配置されるとともに機械的に接続された導電性ブリッジ(5)を介して電気的に接続し、
前記導電性ブリッジ(5)は、前記少なくとも2つの導体トラックとは異なる材料であって前記セラミックキャリア基板(1)と同一の材料が主材料であるとともに、前記少なくとも2つのセラミック部材を電気的に接続する少なくとも1つの導体トラックを有することを特徴とするセンサ装置の製造方法。 - 焼き付け可能な前記導電性スクリーン印刷ペーストを前記セラミック部材の少なくとも1つの接続領域及び前記セラミックキャリア基板(1)に塗布し、
前記セラミックキャリア基板(1)の前記導電性スクリーン印刷ペーストと、前記セラミック部材に塗布された前記導電性スクリーン印刷ペーストとを接続し、
焼き付け工程を実施することを特徴とする請求項9に記載の製造方法。 - 準備された前記セラミックキャリア基板(1)に他の導電性スクリーン印刷ペーストを塗布して前記セラミックキャリア基板(1)上に少なくとも2つの導体トラック(2a、2b)を形成し、
前記少なくとも2つのセラミック部材を前記セラミックキャリア基板上に配置し、
前記セラミック部材を少なくとも2つの接続領域を介して、前記セラミックキャリア基板(1)の前記導電性スクリーン印刷ペースト及び前記セラミック部材に塗布された前記導電性スクリーン印刷ペーストに接続し、
次に、前記セラミックキャリア基板(1)の前記導電性スクリーン印刷ペーストを前記セラミックキャリア基板(1)に焼き付けるとともに、前記セラミック部材に塗布された前記導電性スクリーン印刷ペーストを前記セラミック部材に焼き付け、
前記少なくとも2つのセラミック部材、前記セラミックキャリア基板(1)の前記導電性スクリーン印刷ペースト及び前記セラミック部材に塗布された前記導電性スクリーン印刷ペーストは、前記焼き付け工程中に機械的に安定した接続を形成することを特徴とする請求項9又は10に記載の製造方法。 - 準備されたセラミックキャリア基板(1)に他の導電性スクリーン印刷ペーストを塗布して前記セラミックキャリア基板(1)上に少なくとも2つの導体トラック(2a、2b)を形成し、
第1の焼き付け工程において、前記他の導電性スクリーン印刷ペーストを前記セラミックキャリア基板(1)に焼き付け、
焼き付けられた前記導体トラック(2a、2b)に対し、前記少なくとも2つのセラミック部材を配置すると共に、追加の導電性スクリーン印刷ペーストを用いて接続し、
前記少なくとも2つのセラミック部材及び前記追加の導電性スクリーン印刷ペーストは、その後の第2の焼き付け工程の間に機械的に安定した接続を形成することを特徴とする請求項9又は10に記載の製造方法。
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Application Number | Priority Date | Filing Date | Title |
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DE102008036837A DE102008036837A1 (de) | 2008-08-07 | 2008-08-07 | Sensorvorrichtung und Verfahren zur Herstellung |
DE102008036837.7 | 2008-08-07 | ||
PCT/EP2009/060306 WO2010015717A1 (de) | 2008-08-07 | 2009-08-07 | Sensorvorrichtung und verfahren zur herstellung |
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JP2011530186A JP2011530186A (ja) | 2011-12-15 |
JP5579180B2 true JP5579180B2 (ja) | 2014-08-27 |
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JP2011521598A Active JP5579180B2 (ja) | 2008-08-07 | 2009-08-07 | センサ装置及びその製造方法 |
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US (2) | US8705245B2 (ja) |
EP (1) | EP2327284B1 (ja) |
JP (1) | JP5579180B2 (ja) |
KR (1) | KR101628414B1 (ja) |
CN (1) | CN102113424B (ja) |
DE (1) | DE102008036837A1 (ja) |
WO (1) | WO2010015717A1 (ja) |
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US8228160B2 (en) | 2008-11-14 | 2012-07-24 | Epcos Ag | Sensor element and process for assembling a sensor element |
DE102013104207A1 (de) * | 2013-04-25 | 2014-11-13 | Epcos Ag | Vorrichtung und Verfahren zur Herstellung einer elektrisch leitfähigen und mechanischen Verbindung |
DE102014110553A1 (de) | 2014-07-25 | 2016-01-28 | Epcos Ag | Sensorelement, Sensoranordnung und Verfahren zur Herstellung eines Sensorelements |
DE102014110560A1 (de) | 2014-07-25 | 2016-01-28 | Epcos Ag | Sensorelement, Sensoranordnung und Verfahren zur Herstellung eines Sensorelements und einer Sensoranordnung |
JPWO2016159245A1 (ja) * | 2015-03-31 | 2018-02-01 | 株式会社NejiLaw | 通電路付部材及び通電路のパターニング方法、部材変化計測方法 |
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2008
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2009
- 2009-08-07 KR KR1020117004151A patent/KR101628414B1/ko active IP Right Grant
- 2009-08-07 CN CN200980130855.3A patent/CN102113424B/zh active Active
- 2009-08-07 WO PCT/EP2009/060306 patent/WO2010015717A1/de active Application Filing
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KR20110044880A (ko) | 2011-05-02 |
CN102113424A (zh) | 2011-06-29 |
US9370109B2 (en) | 2016-06-14 |
DE102008036837A1 (de) | 2010-02-18 |
WO2010015717A1 (de) | 2010-02-11 |
CN102113424B (zh) | 2014-04-30 |
EP2327284A1 (de) | 2011-06-01 |
US8705245B2 (en) | 2014-04-22 |
KR101628414B1 (ko) | 2016-06-08 |
JP2011530186A (ja) | 2011-12-15 |
EP2327284B1 (de) | 2016-12-28 |
US20110170272A1 (en) | 2011-07-14 |
US20140137402A1 (en) | 2014-05-22 |
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