JP5567307B2 - 基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。 - Google Patents

基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。 Download PDF

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Publication number
JP5567307B2
JP5567307B2 JP2009218709A JP2009218709A JP5567307B2 JP 5567307 B2 JP5567307 B2 JP 5567307B2 JP 2009218709 A JP2009218709 A JP 2009218709A JP 2009218709 A JP2009218709 A JP 2009218709A JP 5567307 B2 JP5567307 B2 JP 5567307B2
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Prior art keywords
abnormality
substrate processing
abnormality detection
processing apparatus
detection condition
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JP2009218709A
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Japanese (ja)
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JP2011071166A (ja
JP2011071166A5 (enExample
Inventor
一秀 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Application filed by Hitachi Kokusai Electric Inc, Kokusai Denki Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2009218709A priority Critical patent/JP5567307B2/ja
Priority to US12/873,413 priority patent/US8639367B2/en
Priority to TW099131962A priority patent/TWI427446B/zh
Publication of JP2011071166A publication Critical patent/JP2011071166A/ja
Publication of JP2011071166A5 publication Critical patent/JP2011071166A5/ja
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32191—Real time statistical process monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Chemical Vapour Deposition (AREA)
JP2009218709A 2009-09-24 2009-09-24 基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。 Active JP5567307B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009218709A JP5567307B2 (ja) 2009-09-24 2009-09-24 基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。
US12/873,413 US8639367B2 (en) 2009-09-24 2010-09-01 Substrate processing system
TW099131962A TWI427446B (zh) 2009-09-24 2010-09-21 基板處理系統、群管理裝置、群管理裝置的異常檢測方法、群管理裝置的顯示方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009218709A JP5567307B2 (ja) 2009-09-24 2009-09-24 基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。

Publications (3)

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JP2011071166A JP2011071166A (ja) 2011-04-07
JP2011071166A5 JP2011071166A5 (enExample) 2012-10-18
JP5567307B2 true JP5567307B2 (ja) 2014-08-06

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US (1) US8639367B2 (enExample)
JP (1) JP5567307B2 (enExample)
TW (1) TWI427446B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6133164B2 (ja) 2013-08-12 2017-05-24 東京エレクトロン株式会社 群管理システム及びプログラム
SG11201808283RA (en) * 2016-03-31 2018-10-30 Kokusai Electric Corp Substrate processing apparatus, device management controller and recording medium
JP7247743B2 (ja) * 2019-05-20 2023-03-29 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN110879805B (zh) * 2019-11-22 2022-04-05 北京锐安科技有限公司 一种数据异常发现方法、装置、服务器及存储介质
US11545379B2 (en) * 2020-07-31 2023-01-03 Nanya Technology Corporation System and method for controlling semiconductor manufacturing equipment
CN113111095B (zh) * 2021-04-02 2021-10-26 国网北京市电力公司 一种智能化信息管理方法及系统
JP2023043716A (ja) * 2021-09-16 2023-03-29 株式会社Ｓｃｒｅｅｎホールディングス 処理装置群管理システム、処理装置群管理方法およびプログラム
JP2023110948A (ja) * 2022-01-31 2023-08-10 株式会社Ｓｃｒｅｅｎホールディングス 処理レシピの生成方法、処理レシピの生成装置、処理装置システム、処理レシピ表示方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6123983A (en) * 1998-04-23 2000-09-26 Sandia Corporation Method and apparatus for monitoring plasma processing operations
JP4358465B2 (ja) * 2001-08-23 2009-11-04 株式会社日立国際電気 被処理体の処理装置及びその製造方法
JP4474814B2 (ja) * 2001-09-05 2010-06-09 三菱電機株式会社 監視システム
TW200516686A (en) * 2003-11-10 2005-05-16 Renesas Tech Corp Manufacturing method for semiconductor integrated circuit device
JP4497462B2 (ja) * 2004-06-24 2010-07-07 株式会社安川電機 装置モデル適用型ウエハ搬送コントローラ
JP4953427B2 (ja) * 2006-06-21 2012-06-13 東京エレクトロン株式会社 基板処理装置、表示方法、記録媒体及びプログラム
US7966151B2 (en) * 2006-10-24 2011-06-21 Ford Motor Company Method for analyzing operation of a machine
JP5145116B2 (ja) * 2008-05-21 2013-02-13 株式会社日立ハイテクノロジーズ 表面欠陥データ表示管理装置および表面欠陥データ表示管理方法
US8467994B2 (en) * 2010-09-28 2013-06-18 General Electric Company Monitoring system and display for use in a monitoring system

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Publication number Publication date
US20110071661A1 (en) 2011-03-24
US8639367B2 (en) 2014-01-28
TW201133165A (en) 2011-10-01
JP2011071166A (ja) 2011-04-07
TWI427446B (zh) 2014-02-21

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