JP5566200B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP5566200B2
JP5566200B2 JP2010138906A JP2010138906A JP5566200B2 JP 5566200 B2 JP5566200 B2 JP 5566200B2 JP 2010138906 A JP2010138906 A JP 2010138906A JP 2010138906 A JP2010138906 A JP 2010138906A JP 5566200 B2 JP5566200 B2 JP 5566200B2
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JP
Japan
Prior art keywords
insulating layer
connection pad
connection
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010138906A
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English (en)
Japanese (ja)
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JP2012004399A (ja
JP2012004399A5 (enExample
Inventor
人資 近藤
朋幸 下平
雅子 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2010138906A priority Critical patent/JP5566200B2/ja
Priority to US13/158,607 priority patent/US8669478B2/en
Priority to CN201110162222XA priority patent/CN102291933A/zh
Publication of JP2012004399A publication Critical patent/JP2012004399A/ja
Publication of JP2012004399A5 publication Critical patent/JP2012004399A5/ja
Application granted granted Critical
Publication of JP5566200B2 publication Critical patent/JP5566200B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2010138906A 2010-06-18 2010-06-18 配線基板及びその製造方法 Active JP5566200B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010138906A JP5566200B2 (ja) 2010-06-18 2010-06-18 配線基板及びその製造方法
US13/158,607 US8669478B2 (en) 2010-06-18 2011-06-13 Wiring substrate and method of manufacturing the same
CN201110162222XA CN102291933A (zh) 2010-06-18 2011-06-16 布线基板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010138906A JP5566200B2 (ja) 2010-06-18 2010-06-18 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012004399A JP2012004399A (ja) 2012-01-05
JP2012004399A5 JP2012004399A5 (enExample) 2013-05-16
JP5566200B2 true JP5566200B2 (ja) 2014-08-06

Family

ID=45327672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010138906A Active JP5566200B2 (ja) 2010-06-18 2010-06-18 配線基板及びその製造方法

Country Status (3)

Country Link
US (1) US8669478B2 (enExample)
JP (1) JP5566200B2 (enExample)
CN (1) CN102291933A (enExample)

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US8569167B2 (en) * 2011-03-29 2013-10-29 Micron Technology, Inc. Methods for forming a semiconductor structure
US8952540B2 (en) * 2011-06-30 2015-02-10 Intel Corporation In situ-built pin-grid arrays for coreless substrates, and methods of making same
US20130192879A1 (en) * 2011-09-22 2013-08-01 Ibiden Co., Ltd. Multilayer printed wiring board
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
KR101859483B1 (ko) * 2012-03-06 2018-06-27 엘지디스플레이 주식회사 입체 영상 표시 장치 및 그 제조 방법
JP5502139B2 (ja) * 2012-05-16 2014-05-28 日本特殊陶業株式会社 配線基板
CN102833963B (zh) * 2012-09-03 2015-04-01 高德（无锡）电子有限公司 一种改善盲钻孔工件在电镀软金时孔底露铜的水平前处理方法
US9686854B2 (en) * 2012-09-25 2017-06-20 Denso Corporation Electronic device
JP6056490B2 (ja) * 2013-01-15 2017-01-11 株式会社ソシオネクスト 半導体装置とその製造方法
JP6105316B2 (ja) * 2013-02-19 2017-03-29 京セラ株式会社 電子装置
JP6418757B2 (ja) * 2014-03-03 2018-11-07 新光電気工業株式会社 配線基板及びその製造方法と半導体装置
US9704735B2 (en) 2014-08-19 2017-07-11 Intel Corporation Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication
JP2016076534A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 金属ポスト付きプリント配線板およびその製造方法
TWI559829B (zh) * 2014-10-22 2016-11-21 矽品精密工業股份有限公司 封裝結構及其製法
JP6453625B2 (ja) * 2014-11-27 2019-01-16 新光電気工業株式会社 配線基板及びその製造方法と電子部品装置
JP6812678B2 (ja) * 2016-06-29 2021-01-13 昭和電工マテリアルズ株式会社 配線板の製造方法
US10446515B2 (en) * 2017-03-06 2019-10-15 Advanced Semiconductor Engineering, Inc. Semiconductor substrate and semiconductor packaging device, and method for forming the same
US11309294B2 (en) 2018-09-05 2022-04-19 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out packages and methods of forming the same
JP7076347B2 (ja) * 2018-09-18 2022-05-27 日本特殊陶業株式会社 導波管
KR20200055432A (ko) * 2018-11-13 2020-05-21 삼성전기주식회사 인쇄회로기판
KR102680005B1 (ko) * 2018-11-27 2024-07-02 삼성전기주식회사 인쇄회로기판
KR102724892B1 (ko) * 2018-12-04 2024-11-01 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN110691487B (zh) * 2019-09-12 2021-06-22 无锡江南计算技术研究所 一种面向高密度组装的大功率供电背板
US11862594B2 (en) * 2019-12-18 2024-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure with solder resist underlayer for warpage control and method of manufacturing the same
CN113207244B (zh) * 2020-02-03 2024-12-10 奥特斯奥地利科技与系统技术有限公司 制造部件承载件的方法及部件承载件
US12342677B2 (en) * 2021-09-06 2025-06-24 Samsung Display Co., Ltd. Display device and method for fabricating electronic device by using the same
KR102933110B1 (ko) * 2021-09-16 2026-03-03 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판
KR102561794B1 (ko) * 2022-01-12 2023-08-01 주식회사 코리아써키트 인쇄회로기판 및 이의 제조 방법
TW202335542A (zh) * 2022-01-12 2023-09-01 南韓商韓國電路股份有限公司 印刷電路板及其製造方法
JP2024017824A (ja) * 2022-07-28 2024-02-08 Ｆｉｃｔ株式会社 多層基板及び多層基板の製造方法
CN115939101A (zh) * 2022-12-26 2023-04-07 长沙安牧泉智能科技有限公司 一种封装基板的制造方法及结构

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JP2002290022A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 配線基板およびその製造方法ならびに電子装置
JP2006093438A (ja) * 2004-09-24 2006-04-06 Denso Corp プリント基板及びその製造方法
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JP2008140886A (ja) * 2006-11-30 2008-06-19 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP4994922B2 (ja) 2007-04-06 2012-08-08 太陽ホールディングス株式会社 ソルダーレジスト組成物およびその硬化物
KR101551898B1 (ko) * 2007-10-05 2015-09-09 신꼬오덴기 고교 가부시키가이샤 배선 기판, 반도체 장치 및 이들의 제조 방법
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WO2010010910A1 (ja) * 2008-07-23 2010-01-28 日本電気株式会社 コアレス配線基板、半導体装置及びそれらの製造方法

Also Published As

Publication number Publication date
JP2012004399A (ja) 2012-01-05
US8669478B2 (en) 2014-03-11
CN102291933A (zh) 2011-12-21
US20110308849A1 (en) 2011-12-22

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