JP5549066B2 - リードフレーム型基板とその製造方法、及び半導体装置 - Google Patents

リードフレーム型基板とその製造方法、及び半導体装置 Download PDF

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Publication number
JP5549066B2
JP5549066B2 JP2008254312A JP2008254312A JP5549066B2 JP 5549066 B2 JP5549066 B2 JP 5549066B2 JP 2008254312 A JP2008254312 A JP 2008254312A JP 2008254312 A JP2008254312 A JP 2008254312A JP 5549066 B2 JP5549066 B2 JP 5549066B2
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JP
Japan
Prior art keywords
connection terminal
semiconductor element
lead frame
external connection
metal plate
Prior art date
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Expired - Fee Related
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JP2008254312A
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English (en)
Japanese (ja)
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JP2010087221A (ja
JP2010087221A5 (cg-RX-API-DMAC10.html
Inventor
健人 塚本
進 馬庭
順子 戸田
泰宏 境
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
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Toppan Inc
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Publication date
Application filed by Toppan Inc filed Critical Toppan Inc
Priority to JP2008254312A priority Critical patent/JP5549066B2/ja
Priority to TW098132930A priority patent/TWI502711B/zh
Priority to KR1020117006885A priority patent/KR101602982B1/ko
Priority to CN200980138144.0A priority patent/CN102165585B/zh
Priority to PCT/JP2009/005041 priority patent/WO2010038452A1/ja
Publication of JP2010087221A publication Critical patent/JP2010087221A/ja
Priority to US13/064,205 priority patent/US8558363B2/en
Publication of JP2010087221A5 publication Critical patent/JP2010087221A5/ja
Application granted granted Critical
Publication of JP5549066B2 publication Critical patent/JP5549066B2/ja
Expired - Fee Related legal-status Critical Current
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    • H10W70/042—
    • H10W72/00—
    • H10W70/40—
    • H10W70/421—
    • H10W70/656—
    • H10W72/07353—
    • H10W72/334—
    • H10W72/5522—
    • H10W72/884—
    • H10W72/931—
    • H10W74/00—
    • H10W74/111—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP2008254312A 2008-09-30 2008-09-30 リードフレーム型基板とその製造方法、及び半導体装置 Expired - Fee Related JP5549066B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008254312A JP5549066B2 (ja) 2008-09-30 2008-09-30 リードフレーム型基板とその製造方法、及び半導体装置
TW098132930A TWI502711B (zh) 2008-09-30 2009-09-29 導線架基板及其製造方法與半導體裝置
CN200980138144.0A CN102165585B (zh) 2008-09-30 2009-09-30 引线框基板及其制造方法、半导体器件
PCT/JP2009/005041 WO2010038452A1 (ja) 2008-09-30 2009-09-30 リードフレーム基板とその製造方法、及び半導体装置
KR1020117006885A KR101602982B1 (ko) 2008-09-30 2009-09-30 리드 프레임 기판과 그 제조 방법, 및 반도체 장치
US13/064,205 US8558363B2 (en) 2008-09-30 2011-03-10 Lead frame substrate and method of manufacturing the same, and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008254312A JP5549066B2 (ja) 2008-09-30 2008-09-30 リードフレーム型基板とその製造方法、及び半導体装置

Publications (3)

Publication Number Publication Date
JP2010087221A JP2010087221A (ja) 2010-04-15
JP2010087221A5 JP2010087221A5 (cg-RX-API-DMAC10.html) 2011-08-18
JP5549066B2 true JP5549066B2 (ja) 2014-07-16

Family

ID=42073232

Family Applications (1)

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JP2008254312A Expired - Fee Related JP5549066B2 (ja) 2008-09-30 2008-09-30 リードフレーム型基板とその製造方法、及び半導体装置

Country Status (6)

Country Link
US (1) US8558363B2 (cg-RX-API-DMAC10.html)
JP (1) JP5549066B2 (cg-RX-API-DMAC10.html)
KR (1) KR101602982B1 (cg-RX-API-DMAC10.html)
CN (1) CN102165585B (cg-RX-API-DMAC10.html)
TW (1) TWI502711B (cg-RX-API-DMAC10.html)
WO (1) WO2010038452A1 (cg-RX-API-DMAC10.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427716B (zh) * 2010-06-04 2014-02-21 矽品精密工業股份有限公司 無載具之半導體封裝件及其製法
US8673689B2 (en) * 2011-01-28 2014-03-18 Marvell World Trade Ltd. Single layer BGA substrate process
CN102244060B (zh) * 2011-06-02 2013-09-25 日月光半导体制造股份有限公司 封装基板及其制造方法
US9142502B2 (en) * 2011-08-31 2015-09-22 Zhiwei Gong Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits
US8916421B2 (en) * 2011-08-31 2014-12-23 Freescale Semiconductor, Inc. Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
US8597983B2 (en) 2011-11-18 2013-12-03 Freescale Semiconductor, Inc. Semiconductor device packaging having substrate with pre-encapsulation through via formation
JP2014072242A (ja) * 2012-09-27 2014-04-21 Rohm Co Ltd チップ部品およびその製造方法
KR101505088B1 (ko) * 2013-10-22 2015-03-23 앰코 테크놀로지 코리아 주식회사 반도체 패키지와 리드프레임 패들 구조 및 방법
JP6266351B2 (ja) * 2014-01-08 2018-01-24 新日本無線株式会社 センサ装置およびその製造方法
JP7182374B2 (ja) * 2017-05-15 2022-12-02 新光電気工業株式会社 リードフレーム及びその製造方法
JP7039245B2 (ja) * 2017-10-18 2022-03-22 新光電気工業株式会社 リードフレーム及びその製造方法と電子部品装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09307043A (ja) * 1996-05-10 1997-11-28 Dainippon Printing Co Ltd リードフレーム部材とその製造方法、および該リードフレーム部材を用いた半導体装置
JP3642911B2 (ja) 1997-02-05 2005-04-27 大日本印刷株式会社 リードフレーム部材とその製造方法
US6281568B1 (en) * 1998-10-21 2001-08-28 Amkor Technology, Inc. Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
JP3169919B2 (ja) * 1998-12-21 2001-05-28 九州日本電気株式会社 ボールグリッドアレイ型半導体装置及びその製造方法
MY133357A (en) * 1999-06-30 2007-11-30 Hitachi Ltd A semiconductor device and a method of manufacturing the same
KR100677651B1 (ko) * 2001-04-13 2007-02-01 야마하 가부시키가이샤 반도체 소자 및 패키지와 그 제조방법
ATE546835T1 (de) * 2001-07-09 2012-03-15 Sumitomo Metal Mining Co Verfahren zur herstellung eines leiterrahmens
JP2003309242A (ja) * 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
JP2003309241A (ja) * 2002-04-15 2003-10-31 Dainippon Printing Co Ltd リードフレーム部材とリードフレーム部材の製造方法、及び該リードフレーム部材を用いた半導体パッケージとその製造方法
KR100993579B1 (ko) * 2002-04-30 2010-11-10 르네사스 일렉트로닉스 가부시키가이샤 반도체장치 및 전자 장치
CN100380651C (zh) * 2002-04-30 2008-04-09 株式会社瑞萨科技 半导体器件和电子设备
EP1604401B1 (en) * 2003-03-07 2008-03-05 Nxp B.V. Semiconductor device, semiconductor body and method of manufacturing thereof
JP2004349316A (ja) * 2003-05-20 2004-12-09 Renesas Technology Corp 半導体装置及びその製造方法
JP4349063B2 (ja) * 2003-10-08 2009-10-21 株式会社村田製作所 弾性表面波装置の製造方法
JP2005175261A (ja) * 2003-12-12 2005-06-30 Fujitsu Ten Ltd 基板の電子部品実装構造および方法
JP2005191240A (ja) * 2003-12-25 2005-07-14 Renesas Technology Corp 半導体装置及びその製造方法
JP4417150B2 (ja) * 2004-03-23 2010-02-17 株式会社ルネサステクノロジ 半導体装置
TWI262587B (en) * 2005-03-08 2006-09-21 Yi-Ling Jang Leadframe and the manufacturing method thereof
US7687893B2 (en) * 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US8008784B2 (en) * 2008-10-02 2011-08-30 Advanced Semiconductor Engineering, Inc. Package including a lead frame, a chip and a sealant

Also Published As

Publication number Publication date
WO2010038452A1 (ja) 2010-04-08
JP2010087221A (ja) 2010-04-15
KR101602982B1 (ko) 2016-03-11
CN102165585A (zh) 2011-08-24
TWI502711B (zh) 2015-10-01
US20110163435A1 (en) 2011-07-07
US8558363B2 (en) 2013-10-15
KR20110074514A (ko) 2011-06-30
TW201021186A (en) 2010-06-01
CN102165585B (zh) 2014-03-26

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