JP5538797B2 - 電界効果型トランジスタ及び表示装置 - Google Patents
電界効果型トランジスタ及び表示装置 Download PDFInfo
- Publication number
- JP5538797B2 JP5538797B2 JP2009222514A JP2009222514A JP5538797B2 JP 5538797 B2 JP5538797 B2 JP 5538797B2 JP 2009222514 A JP2009222514 A JP 2009222514A JP 2009222514 A JP2009222514 A JP 2009222514A JP 5538797 B2 JP5538797 B2 JP 5538797B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide semiconductor
- amorphous oxide
- semiconductor layer
- layer
- tft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Dram (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009222514A JP5538797B2 (ja) | 2008-12-12 | 2009-09-28 | 電界効果型トランジスタ及び表示装置 |
| EP11009309A EP2423966A1 (en) | 2008-12-12 | 2009-12-03 | Field effect transistor and display apparatus |
| EP09014995A EP2197034B1 (en) | 2008-12-12 | 2009-12-03 | Field effect transistor and display apparatus |
| KR1020090121626A KR101215964B1 (ko) | 2008-12-12 | 2009-12-09 | 전계 효과형 트랜지스터 및 표시장치 |
| US12/634,319 US20100148170A1 (en) | 2008-12-12 | 2009-12-09 | Field effect transistor and display apparatus |
| CN2009102585023A CN101752428B (zh) | 2008-12-12 | 2009-12-11 | 场效应晶体管、场效应晶体管的制造方法和显示装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008317286 | 2008-12-12 | ||
| JP2008317286 | 2008-12-12 | ||
| JP2009222514A JP5538797B2 (ja) | 2008-12-12 | 2009-09-28 | 電界効果型トランジスタ及び表示装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010161339A JP2010161339A (ja) | 2010-07-22 |
| JP2010161339A5 JP2010161339A5 (enExample) | 2012-11-08 |
| JP5538797B2 true JP5538797B2 (ja) | 2014-07-02 |
Family
ID=41820261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009222514A Expired - Fee Related JP5538797B2 (ja) | 2008-12-12 | 2009-09-28 | 電界効果型トランジスタ及び表示装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100148170A1 (enExample) |
| EP (2) | EP2423966A1 (enExample) |
| JP (1) | JP5538797B2 (enExample) |
| KR (1) | KR101215964B1 (enExample) |
| CN (1) | CN101752428B (enExample) |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101648927B1 (ko) * | 2009-01-16 | 2016-08-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제작 방법 |
| US8492756B2 (en) * | 2009-01-23 | 2013-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| TWI535023B (zh) * | 2009-04-16 | 2016-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
| KR102089200B1 (ko) | 2009-11-28 | 2020-03-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
| KR102479269B1 (ko) * | 2010-01-20 | 2022-12-20 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 휴대 전화기 |
| KR20180020327A (ko) * | 2010-03-08 | 2018-02-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 반도체 장치를 제작하는 방법 |
| JP2013531383A (ja) * | 2010-07-02 | 2013-08-01 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | 薄膜トランジスタ |
| US8593858B2 (en) * | 2010-08-31 | 2013-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Driving method of semiconductor device |
| WO2012056933A1 (ja) * | 2010-10-25 | 2012-05-03 | 株式会社日立製作所 | 酸化物半導体装置およびその製造方法 |
| JP2012099661A (ja) * | 2010-11-02 | 2012-05-24 | Idemitsu Kosan Co Ltd | 酸化物半導体の製造方法 |
| KR101457833B1 (ko) | 2010-12-03 | 2014-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2012151453A (ja) * | 2010-12-28 | 2012-08-09 | Semiconductor Energy Lab Co Ltd | 半導体装置および半導体装置の駆動方法 |
| TWI657565B (zh) | 2011-01-14 | 2019-04-21 | 日商半導體能源研究所股份有限公司 | 半導體記憶裝置 |
| JP6053098B2 (ja) * | 2011-03-28 | 2016-12-27 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5977569B2 (ja) * | 2011-04-22 | 2016-08-24 | 株式会社神戸製鋼所 | 薄膜トランジスタ構造、ならびにその構造を備えた薄膜トランジスタおよび表示装置 |
| JP2012238763A (ja) * | 2011-05-12 | 2012-12-06 | Fujitsu Ltd | 半導体装置及び半導体装置の製造方法 |
| US8952377B2 (en) | 2011-07-08 | 2015-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP4982620B1 (ja) * | 2011-07-29 | 2012-07-25 | 富士フイルム株式会社 | 電界効果型トランジスタの製造方法、並びに、電界効果型トランジスタ、表示装置、イメージセンサ及びx線センサ |
| JP5052693B1 (ja) | 2011-08-12 | 2012-10-17 | 富士フイルム株式会社 | 薄膜トランジスタ及びその製造方法、表示装置、イメージセンサー、x線センサー並びにx線デジタル撮影装置 |
| KR20140056392A (ko) * | 2011-09-29 | 2014-05-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2013047629A1 (en) | 2011-09-29 | 2013-04-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP2013093561A (ja) * | 2011-10-07 | 2013-05-16 | Semiconductor Energy Lab Co Ltd | 酸化物半導体膜及び半導体装置 |
| IN2014DN03274A (enExample) | 2011-10-14 | 2015-05-22 | Semiconductor Energy Lab | |
| KR20130046357A (ko) * | 2011-10-27 | 2013-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN102646676B (zh) * | 2011-11-03 | 2015-06-10 | 京东方科技集团股份有限公司 | 一种tft阵列基板 |
| US9082861B2 (en) * | 2011-11-11 | 2015-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Transistor with oxide semiconductor channel having protective layer |
| KR101942980B1 (ko) | 2012-01-17 | 2019-01-29 | 삼성디스플레이 주식회사 | 반도체 디바이스 및 그 형성 방법 |
| KR20130111874A (ko) * | 2012-04-02 | 2013-10-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 표시판 및 표시 장치, 그리고 박막 트랜지스터의 제조 방법 |
| US9553201B2 (en) | 2012-04-02 | 2017-01-24 | Samsung Display Co., Ltd. | Thin film transistor, thin film transistor array panel, and manufacturing method of thin film transistor |
| KR20230004930A (ko) | 2012-04-13 | 2023-01-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102227591B1 (ko) * | 2012-10-17 | 2021-03-15 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN102891183B (zh) * | 2012-10-25 | 2015-09-30 | 深圳市华星光电技术有限公司 | 薄膜晶体管及主动矩阵式平面显示装置 |
| US9171960B2 (en) * | 2013-01-25 | 2015-10-27 | Qualcomm Mems Technologies, Inc. | Metal oxide layer composition control by atomic layer deposition for thin film transistor |
| US9373711B2 (en) * | 2013-02-27 | 2016-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US20140273342A1 (en) * | 2013-03-13 | 2014-09-18 | Applied Materials, Inc. | Vth control method of multiple active layer metal oxide semiconductor tft |
| US10304859B2 (en) | 2013-04-12 | 2019-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an oxide film on an oxide semiconductor film |
| US9590111B2 (en) | 2013-11-06 | 2017-03-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device including the semiconductor device |
| JP6261125B2 (ja) * | 2014-01-31 | 2018-01-17 | 国立研究開発法人物質・材料研究機構 | 酸化物薄膜トランジスタおよびその製造方法 |
| TWI772799B (zh) * | 2014-05-09 | 2022-08-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置 |
| CN104916703B (zh) | 2015-05-07 | 2018-07-31 | 京东方科技集团股份有限公司 | 一种氧化物薄膜晶体管、阵列基板和显示装置 |
| CN105280717B (zh) * | 2015-09-23 | 2018-04-20 | 京东方科技集团股份有限公司 | Tft及其制作方法、阵列基板及显示装置 |
| KR101872421B1 (ko) * | 2016-04-12 | 2018-06-28 | 충북대학교 산학협력단 | 산화물 반도체 기반의 트랜지스터 및 그 제조 방법 |
| CN106711196B (zh) * | 2016-10-20 | 2019-11-19 | 浙江大学 | 一种p型ZnGeSnO非晶氧化物半导体薄膜及其制备方法 |
| CN108389947B (zh) * | 2018-04-27 | 2024-03-26 | 芜湖德豪润达光电科技有限公司 | 发光二极管及其制备方法 |
| US11646379B2 (en) * | 2020-06-23 | 2023-05-09 | Taiwan Semiconductor Manufacturing Company Limited | Dual-layer channel transistor and methods of forming same |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10149250A1 (de) * | 2001-10-05 | 2003-04-17 | Sf Koop Gmbh Beton Konzepte | Formstein aus Beton und Bausatz aus Formsteinen zur Erstellung von Erdreichabdeckungen |
| US7262463B2 (en) * | 2003-07-25 | 2007-08-28 | Hewlett-Packard Development Company, L.P. | Transistor including a deposited channel region having a doped portion |
| US7242039B2 (en) * | 2004-03-12 | 2007-07-10 | Hewlett-Packard Development Company, L.P. | Semiconductor device |
| US7282782B2 (en) * | 2004-03-12 | 2007-10-16 | Hewlett-Packard Development Company, L.P. | Combined binary oxide semiconductor device |
| JP5138163B2 (ja) * | 2004-11-10 | 2013-02-06 | キヤノン株式会社 | 電界効果型トランジスタ |
| CA2585190A1 (en) * | 2004-11-10 | 2006-05-18 | Canon Kabushiki Kaisha | Amorphous oxide and field effect transistor |
| JP2007073704A (ja) * | 2005-09-06 | 2007-03-22 | Canon Inc | 半導体薄膜 |
| JP4850457B2 (ja) * | 2005-09-06 | 2012-01-11 | キヤノン株式会社 | 薄膜トランジスタ及び薄膜ダイオード |
| US7622371B2 (en) * | 2006-10-10 | 2009-11-24 | Hewlett-Packard Development Company, L.P. | Fused nanocrystal thin film semiconductor and method |
| KR101312259B1 (ko) | 2007-02-09 | 2013-09-25 | 삼성전자주식회사 | 박막 트랜지스터 및 그 제조방법 |
| JP5121254B2 (ja) * | 2007-02-28 | 2013-01-16 | キヤノン株式会社 | 薄膜トランジスタおよび表示装置 |
| JP4727684B2 (ja) * | 2007-03-27 | 2011-07-20 | 富士フイルム株式会社 | 薄膜電界効果型トランジスタおよびそれを用いた表示装置 |
| JP2008276212A (ja) * | 2007-04-05 | 2008-11-13 | Fujifilm Corp | 有機電界発光表示装置 |
| KR100982395B1 (ko) * | 2007-04-25 | 2010-09-14 | 주식회사 엘지화학 | 박막 트랜지스터 및 이의 제조방법 |
| CN101663762B (zh) * | 2007-04-25 | 2011-09-21 | 佳能株式会社 | 氧氮化物半导体 |
| KR101345376B1 (ko) * | 2007-05-29 | 2013-12-24 | 삼성전자주식회사 | ZnO 계 박막 트랜지스터 및 그 제조방법 |
| JP5512078B2 (ja) * | 2007-11-22 | 2014-06-04 | 富士フイルム株式会社 | 画像形成装置 |
-
2009
- 2009-09-28 JP JP2009222514A patent/JP5538797B2/ja not_active Expired - Fee Related
- 2009-12-03 EP EP11009309A patent/EP2423966A1/en not_active Withdrawn
- 2009-12-03 EP EP09014995A patent/EP2197034B1/en not_active Not-in-force
- 2009-12-09 KR KR1020090121626A patent/KR101215964B1/ko not_active Expired - Fee Related
- 2009-12-09 US US12/634,319 patent/US20100148170A1/en not_active Abandoned
- 2009-12-11 CN CN2009102585023A patent/CN101752428B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR101215964B1 (ko) | 2012-12-27 |
| US20100148170A1 (en) | 2010-06-17 |
| KR20100068196A (ko) | 2010-06-22 |
| EP2423966A1 (en) | 2012-02-29 |
| EP2197034A2 (en) | 2010-06-16 |
| CN101752428A (zh) | 2010-06-23 |
| CN101752428B (zh) | 2011-12-21 |
| EP2197034B1 (en) | 2012-09-19 |
| EP2197034A3 (en) | 2010-06-30 |
| JP2010161339A (ja) | 2010-07-22 |
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