JP5528509B2 - ウェハのためのハンドリング装置およびハンドリング方法 - Google Patents
ウェハのためのハンドリング装置およびハンドリング方法 Download PDFInfo
- Publication number
- JP5528509B2 JP5528509B2 JP2012138512A JP2012138512A JP5528509B2 JP 5528509 B2 JP5528509 B2 JP 5528509B2 JP 2012138512 A JP2012138512 A JP 2012138512A JP 2012138512 A JP2012138512 A JP 2012138512A JP 5528509 B2 JP5528509 B2 JP 5528509B2
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- JP
- Japan
- Prior art keywords
- wafer
- adhesive film
- receiving body
- working space
- contact surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Description
同一の構成要素、および、同じ機能を持つ構成要素は、図中において同一の参照番号によって特定されている。
2 パイプ
3 粘着面
4 ウェハ
5 封印シールと粘着層
6 多孔性の材料
7 当接面
8 作動空間
9 接触面
Claims (1)
- ウェハ(4)用のハンドリング装置であって、
該ハンドリング装置は、受け本体(1)と、前記受け本体(1)に取り付けられた粘着膜(3)であって該粘着膜(3)に前記ウェハ(4)を着脱自在に固定するための前記粘着膜(3)と、を備え、
前記粘着膜(3)及び前記受け本体(1)の間に少なくとも1つの作動空間(8)が形成され、前記受け本体(1)が前記粘着膜(3)に当接する当接面(7)を有しており、前記作動空間(8)から加圧媒体を除去することによって前記粘着膜(3)と前記ウェハ(4)との間の接触面(9)が縮小するように前記当接面(7)が単一の凸形状になっていることを特徴とするハンドリング装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006031434.4A DE102006031434B4 (de) | 2006-07-07 | 2006-07-07 | Handhabungsvorrichtung sowie Handhabungsverfahren für Wafer |
DE102006031434.4 | 2006-07-07 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007178652A Division JP2008013372A (ja) | 2006-07-07 | 2007-07-06 | ウェハのためのハンドリング装置およびハンドリング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012195609A JP2012195609A (ja) | 2012-10-11 |
JP5528509B2 true JP5528509B2 (ja) | 2014-06-25 |
Family
ID=38825091
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007178652A Pending JP2008013372A (ja) | 2006-07-07 | 2007-07-06 | ウェハのためのハンドリング装置およびハンドリング方法 |
JP2012138512A Active JP5528509B2 (ja) | 2006-07-07 | 2012-06-20 | ウェハのためのハンドリング装置およびハンドリング方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007178652A Pending JP2008013372A (ja) | 2006-07-07 | 2007-07-06 | ウェハのためのハンドリング装置およびハンドリング方法 |
Country Status (4)
Country | Link |
---|---|
US (3) | US7909374B2 (ja) |
JP (2) | JP2008013372A (ja) |
AT (1) | AT503848B1 (ja) |
DE (1) | DE102006031434B4 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006026331B4 (de) * | 2006-06-02 | 2019-09-26 | Erich Thallner | Transportable Einheit zum Transport von Wafern und Verwendung einer Gelfolie in einer transportablen Einheit |
US8141926B2 (en) * | 2008-02-06 | 2012-03-27 | Ulvac, Inc. | Robot hand for substrate transfer |
US8950459B2 (en) | 2009-04-16 | 2015-02-10 | Suss Microtec Lithography Gmbh | Debonding temporarily bonded semiconductor wafers |
US8267143B2 (en) | 2009-04-16 | 2012-09-18 | Suss Microtec Lithography, Gmbh | Apparatus for mechanically debonding temporary bonded semiconductor wafers |
DE102009018156A1 (de) | 2009-04-21 | 2010-11-18 | Ev Group Gmbh | Vorrichtung und Verfahren zum Trennen eines Substrats von einem Trägersubstrat |
TWI395281B (zh) * | 2009-07-23 | 2013-05-01 | Epistar Corp | 晶粒分類裝置 |
KR101135622B1 (ko) * | 2009-10-26 | 2012-04-17 | 강원대학교산학협력단 | 접착력 제어가 가능한 이송 스탬퍼 |
US8295944B2 (en) * | 2009-11-30 | 2012-10-23 | Boston Scientific Neuromodulation Corporation | Electrode array with electrodes having cutout portions and methods of making the same |
US9837295B2 (en) | 2010-04-15 | 2017-12-05 | Suss Microtec Lithography Gmbh | Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing |
US9064686B2 (en) | 2010-04-15 | 2015-06-23 | Suss Microtec Lithography, Gmbh | Method and apparatus for temporary bonding of ultra thin wafers |
US9859141B2 (en) | 2010-04-15 | 2018-01-02 | Suss Microtec Lithography Gmbh | Apparatus and method for aligning and centering wafers |
CN103003932A (zh) * | 2010-07-23 | 2013-03-27 | Ev集团有限责任公司 | 用于搬运晶片的搬运设备 |
JP2012204709A (ja) * | 2011-03-28 | 2012-10-22 | Okamoto Machine Tool Works Ltd | 半導体基板保持用のパッドおよびそれを用いて半導体基板を搬送する方法 |
KR101801264B1 (ko) * | 2011-06-13 | 2017-11-27 | 삼성전자주식회사 | 반도체 제조 장치 및 이를 이용한 반도체 패키지 방법 |
JP6196123B2 (ja) * | 2013-10-18 | 2017-09-13 | 東芝メモリ株式会社 | チャッククリーナ及びクリーニング方法 |
JP6032234B2 (ja) * | 2014-03-19 | 2016-11-24 | 信越半導体株式会社 | ワーク保持装置 |
TWI521082B (zh) * | 2014-04-15 | 2016-02-11 | 友達光電股份有限公司 | 操作裝置及其操作方法 |
JP6398301B2 (ja) * | 2014-05-09 | 2018-10-03 | 藤倉化成株式会社 | 吸着離脱装置 |
DE102015109256A1 (de) | 2015-06-11 | 2016-12-15 | Aixacct Systems Gmbh | Verfahren und Vorrichtung zur Bestimmung dehnungsabhängiger Größen |
NL2018244B1 (en) * | 2017-01-27 | 2018-08-07 | Suss Microtec Lithography Gmbh | Endeffektor |
US10724572B2 (en) | 2017-08-23 | 2020-07-28 | Todd H. Becker | Electronically-releasable suction cup assembly secured to an appliance |
GB201800863D0 (en) * | 2018-01-19 | 2018-03-07 | Ocado Innovation Ltd | A grasping affordance for use in a robot system |
WO2020136048A1 (en) * | 2018-12-28 | 2020-07-02 | Asml Holding N.V. | Apparatus and method for cleaning a support structure in a lithographic system |
CN113788318A (zh) * | 2021-11-09 | 2021-12-14 | 苏州物远网络科技有限公司 | 一种工业生产用薄板搬运装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778326A (en) * | 1983-05-24 | 1988-10-18 | Vichem Corporation | Method and means for handling semiconductor and similar electronic devices |
US4921564A (en) * | 1988-05-23 | 1990-05-01 | Semiconductor Equipment Corp. | Method and apparatus for removing circuit chips from wafer handling tape |
US5423716A (en) * | 1994-01-05 | 1995-06-13 | Strasbaugh; Alan | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied |
JPH09108983A (ja) * | 1995-10-17 | 1997-04-28 | Koganei Corp | ワーク搬送装置 |
JP3771320B2 (ja) * | 1996-03-29 | 2006-04-26 | コマツ電子金属株式会社 | 半導体ウェハの貼付方法及び貼付装置 |
JP3469999B2 (ja) * | 1996-10-30 | 2003-11-25 | 京セラ株式会社 | 吸着盤の製造方法 |
US5916015A (en) * | 1997-07-25 | 1999-06-29 | Speedfam Corporation | Wafer carrier for semiconductor wafer polishing machine |
US6383606B2 (en) * | 1999-02-02 | 2002-05-07 | Michelle Broyles | Semiconductor wafer diaphragm |
KR20010030213A (ko) * | 1999-09-02 | 2001-04-16 | 아끼모토 유미 | 연마 헤드, 이것을 이용한 연마 장치, 및 연마 상태 검출방법 |
US6541989B1 (en) * | 2000-09-29 | 2003-04-01 | Motorola, Inc. | Testing device for semiconductor components and a method of using the device |
US6716084B2 (en) * | 2001-01-11 | 2004-04-06 | Nutool, Inc. | Carrier head for holding a wafer and allowing processing on a front face thereof to occur |
JP2002265040A (ja) * | 2001-03-06 | 2002-09-18 | Sharp Corp | 基板搬送用治具及びそれを用いた液晶表示素子の製造方法 |
US20020151260A1 (en) * | 2001-04-12 | 2002-10-17 | Crevasse Annette Margaret | Carrier head for a chemical mechanical polishing apparatus |
JP3892703B2 (ja) * | 2001-10-19 | 2007-03-14 | 富士通株式会社 | 半導体基板用治具及びこれを用いた半導体装置の製造方法 |
WO2004008499A1 (en) * | 2002-07-17 | 2004-01-22 | Matsushita Electric Industrial Co. Ltd. | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor |
JP2004079613A (ja) * | 2002-08-12 | 2004-03-11 | Disco Abrasive Syst Ltd | 半導体ウェーハ移し替え装置 |
AU2003248610A1 (en) * | 2003-07-14 | 2005-01-28 | Systems On Silicon Manufacturing Co. Pte. Ltd. | Perforated plate for wafer chuck |
JP2005093938A (ja) * | 2003-09-19 | 2005-04-07 | Shin Etsu Polymer Co Ltd | 基板保持具 |
US20050221722A1 (en) * | 2004-03-31 | 2005-10-06 | Cheong Yew W | Wafer grinding using an adhesive gel material |
CN1777832B (zh) * | 2004-04-09 | 2010-05-05 | 信越工程株式会社 | 粘结卡盘装置 |
JP4268091B2 (ja) * | 2004-05-12 | 2009-05-27 | 信越ポリマー株式会社 | 部品保持具 |
JP4440005B2 (ja) * | 2004-06-15 | 2010-03-24 | 信越ポリマー株式会社 | 部品保持具 |
US8010263B2 (en) * | 2006-03-22 | 2011-08-30 | GM Global Technology Operations LLC | Method and apparatus for multivariate active driveline damping |
-
2006
- 2006-07-07 DE DE102006031434.4A patent/DE102006031434B4/de active Active
-
2007
- 2007-06-18 AT AT0093907A patent/AT503848B1/de active
- 2007-06-28 US US11/770,004 patent/US7909374B2/en active Active
- 2007-07-06 JP JP2007178652A patent/JP2008013372A/ja active Pending
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2011
- 2011-02-10 US US13/024,439 patent/US8087708B2/en active Active
- 2011-02-10 US US13/024,412 patent/US8157307B2/en active Active
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2012
- 2012-06-20 JP JP2012138512A patent/JP5528509B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
AT503848A2 (de) | 2008-01-15 |
US20110127785A1 (en) | 2011-06-02 |
JP2008013372A (ja) | 2008-01-24 |
AT503848A3 (de) | 2009-04-15 |
DE102006031434A1 (de) | 2008-01-17 |
US8087708B2 (en) | 2012-01-03 |
US7909374B2 (en) | 2011-03-22 |
AT503848B1 (de) | 2010-08-15 |
US20110133500A1 (en) | 2011-06-09 |
US20080008565A1 (en) | 2008-01-10 |
DE102006031434B4 (de) | 2019-11-14 |
JP2012195609A (ja) | 2012-10-11 |
US8157307B2 (en) | 2012-04-17 |
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