JP4676007B2 - ラミネート装置及び封止構造体の製造方法 - Google Patents
ラミネート装置及び封止構造体の製造方法 Download PDFInfo
- Publication number
- JP4676007B2 JP4676007B2 JP2009073189A JP2009073189A JP4676007B2 JP 4676007 B2 JP4676007 B2 JP 4676007B2 JP 2009073189 A JP2009073189 A JP 2009073189A JP 2009073189 A JP2009073189 A JP 2009073189A JP 4676007 B2 JP4676007 B2 JP 4676007B2
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- JP
- Japan
- Prior art keywords
- chamber
- substrate
- elastic sheet
- pressing member
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010030 laminating Methods 0.000 title claims description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007789 sealing Methods 0.000 title description 13
- 230000006837 decompression Effects 0.000 claims description 41
- 238000003825 pressing Methods 0.000 claims description 34
- 239000002648 laminated material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 description 56
- 239000011347 resin Substances 0.000 description 38
- 229920005989 resin Polymers 0.000 description 38
- 239000007789 gas Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 13
- 239000000945 filler Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 238000003475 lamination Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 208000034809 Product contamination Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229920002449 FKM Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
Description
Claims (3)
- 減圧チャンバと、
前記減圧チャンバ内に設けられたヒータ台と、
前記減圧チャンバ内であって前記ヒータ台の上方に設けられた押圧部材と、
を備え、
前記押圧部材は、
前記ヒータ台に向き合う弾性シートと、
前記弾性シートを区分して支持し、供給気体の圧力により前記ヒータ台側に前記弾性シートを膨張させる膨張室を区分毎に形成する支持枠と、
を具備していることを特徴とするラミネート装置。 - 前記押圧部材は着脱可能に形成されていることを特徴とする請求項1記載のラミネート装置。
- 減圧チャンバと、前記減圧チャンバ内に設けられたヒータ台と、前記減圧チャンバ内であって前記ヒータ台の上方に設けられた押圧部材とを備え、前記押圧部材は、前記ヒータ台に向き合う弾性シートと、前記弾性シートを区分して支持し、供給気体の圧力により前記ヒータ台側に前記弾性シートを膨張させる膨張室を区分毎に形成する支持枠とを具備しているラミネート装置を用いて、複数のラミネート材が載せられた被ラミネート材を前記ヒータ台に載置し、前記押圧部材により前記複数のラミネート材を押圧しながら前記被ラミネート材にラミネートすることを特徴とする封止構造体の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009073189A JP4676007B2 (ja) | 2009-03-25 | 2009-03-25 | ラミネート装置及び封止構造体の製造方法 |
US12/721,098 US20100243147A1 (en) | 2009-03-25 | 2010-03-10 | Laminating apparatus and method of manufacturing sealed structure body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009073189A JP4676007B2 (ja) | 2009-03-25 | 2009-03-25 | ラミネート装置及び封止構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010221611A JP2010221611A (ja) | 2010-10-07 |
JP4676007B2 true JP4676007B2 (ja) | 2011-04-27 |
Family
ID=42782667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009073189A Expired - Fee Related JP4676007B2 (ja) | 2009-03-25 | 2009-03-25 | ラミネート装置及び封止構造体の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100243147A1 (ja) |
JP (1) | JP4676007B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5010652B2 (ja) | 2009-08-19 | 2012-08-29 | 株式会社東芝 | シート剥離装置および表示装置の製造方法 |
KR101243920B1 (ko) * | 2010-01-07 | 2013-03-14 | 삼성디스플레이 주식회사 | 기판 밀봉에 사용되는 레이저 빔 조사 장치, 기판 밀봉 방법, 및 유기 발광 디스플레이 장치의 제조 방법 |
JP5166468B2 (ja) * | 2010-03-23 | 2013-03-21 | 株式会社東芝 | ペースト塗布装置及びペースト塗布方法 |
KR101543424B1 (ko) * | 2012-08-24 | 2015-08-10 | 가부시키가이샤 메이키 세이사쿠쇼 | 적층 방법 및 적층 시스템 |
JP6269674B2 (ja) * | 2013-07-24 | 2018-01-31 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子の製造方法、及び、製造装置 |
JP6267920B2 (ja) * | 2013-10-15 | 2018-01-24 | 常陽工学株式会社 | 封止装置および封止方法 |
JP7272639B2 (ja) * | 2019-04-26 | 2023-05-12 | 新光エンジニアリング株式会社 | ワーク貼合装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3902255A1 (de) * | 1989-01-26 | 1990-08-02 | Nokia Unterhaltungselektronik | Verfahren und vorrichtung zum herstellen einer fluessigkristallzelle |
JP3627090B2 (ja) * | 1997-09-17 | 2005-03-09 | 株式会社名機製作所 | 積層成形方法および積層成形装置 |
US8137498B2 (en) * | 2005-08-30 | 2012-03-20 | Rockwell Collins Inc. | System and method for completing lamination of rigid-to-rigid substrates by the controlled application of pressure |
-
2009
- 2009-03-25 JP JP2009073189A patent/JP4676007B2/ja not_active Expired - Fee Related
-
2010
- 2010-03-10 US US12/721,098 patent/US20100243147A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20100243147A1 (en) | 2010-09-30 |
JP2010221611A (ja) | 2010-10-07 |
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