JP5526529B2 - 積層半導体装置及び積層半導体装置の製造方法 - Google Patents

積層半導体装置及び積層半導体装置の製造方法 Download PDF

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Publication number
JP5526529B2
JP5526529B2 JP2008294913A JP2008294913A JP5526529B2 JP 5526529 B2 JP5526529 B2 JP 5526529B2 JP 2008294913 A JP2008294913 A JP 2008294913A JP 2008294913 A JP2008294913 A JP 2008294913A JP 5526529 B2 JP5526529 B2 JP 5526529B2
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Prior art keywords
semiconductor device
substrate
region
element region
insulating layer
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JP2008294913A
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Japanese (ja)
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JP2010123696A5 (enExample
JP2010123696A (ja
Inventor
新吾 松岡
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Nikon Corp
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Nikon Corp
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Priority to JP2008294913A priority Critical patent/JP5526529B2/ja
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Publication of JP2010123696A5 publication Critical patent/JP2010123696A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1302—Disposition
    • H01L2224/13025—Disposition the bump connector being disposed on a via connection of the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
JP2008294913A 2008-11-18 2008-11-18 積層半導体装置及び積層半導体装置の製造方法 Active JP5526529B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008294913A JP5526529B2 (ja) 2008-11-18 2008-11-18 積層半導体装置及び積層半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008294913A JP5526529B2 (ja) 2008-11-18 2008-11-18 積層半導体装置及び積層半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010123696A JP2010123696A (ja) 2010-06-03
JP2010123696A5 JP2010123696A5 (enExample) 2012-12-06
JP5526529B2 true JP5526529B2 (ja) 2014-06-18

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3099906B2 (ja) 1990-04-27 2000-10-16 日本ビクター株式会社 光ピックアップ

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5533398B2 (ja) * 2010-07-27 2014-06-25 富士通セミコンダクター株式会社 半導体装置の製造方法
JP2014207252A (ja) * 2011-08-17 2014-10-30 株式会社村田製作所 半導体装置およびその製造方法ならびに携帯電話機
US20230026676A1 (en) * 2021-07-23 2023-01-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device structure and method of formation

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098654A (ja) * 1983-11-02 1985-06-01 Nec Corp 半導体装置の製造方法
JP3770631B2 (ja) * 1994-10-24 2006-04-26 株式会社ルネサステクノロジ 半導体装置の製造方法
TW473914B (en) * 2000-01-12 2002-01-21 Ibm Buried metal body contact structure and method for fabricating SOI MOSFET devices
JP2002026283A (ja) * 2000-06-30 2002-01-25 Seiko Epson Corp 多層構造のメモリ装置及びその製造方法
KR100418089B1 (ko) * 2001-06-21 2004-02-11 주식회사 하이닉스반도체 반도체 소자의 박막 트랜지스터 제조 방법
JP4869546B2 (ja) * 2003-05-23 2012-02-08 ルネサスエレクトロニクス株式会社 半導体装置
JP4606006B2 (ja) * 2003-09-11 2011-01-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN101048868B (zh) * 2004-08-20 2010-06-09 佐伊科比株式会社 具有三维层叠结构的半导体器件的制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3099906B2 (ja) 1990-04-27 2000-10-16 日本ビクター株式会社 光ピックアップ

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Publication number Publication date
JP2010123696A (ja) 2010-06-03

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