JP5526458B2 - 無電解金めっき浴及び無電解金めっき方法 - Google Patents

無電解金めっき浴及び無電解金めっき方法 Download PDF

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Publication number
JP5526458B2
JP5526458B2 JP2006328891A JP2006328891A JP5526458B2 JP 5526458 B2 JP5526458 B2 JP 5526458B2 JP 2006328891 A JP2006328891 A JP 2006328891A JP 2006328891 A JP2006328891 A JP 2006328891A JP 5526458 B2 JP5526458 B2 JP 5526458B2
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JP
Japan
Prior art keywords
electroless
gold
gold plating
nickel
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006328891A
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English (en)
Japanese (ja)
Other versions
JP2008144187A5 (enExample
JP2008144187A (ja
Inventor
雅之 木曽
幸典 小田
成吾 黒坂
徹 上玉利
義司 西條
克久 田辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Priority to JP2006328891A priority Critical patent/JP5526458B2/ja
Priority to TW096146102A priority patent/TWI457462B/zh
Priority to US11/987,880 priority patent/US7985285B2/en
Priority to CN2007103076303A priority patent/CN101319319B/zh
Priority to KR1020070126329A priority patent/KR101393478B1/ko
Publication of JP2008144187A publication Critical patent/JP2008144187A/ja
Publication of JP2008144187A5 publication Critical patent/JP2008144187A5/ja
Application granted granted Critical
Publication of JP5526458B2 publication Critical patent/JP5526458B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2006328891A 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法 Active JP5526458B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006328891A JP5526458B2 (ja) 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法
TW096146102A TWI457462B (zh) 2006-12-06 2007-12-04 無電式鍍金浴，無電式鍍金方法及電子零件
US11/987,880 US7985285B2 (en) 2006-12-06 2007-12-05 Electroless gold plating bath, electroless gold plating method and electronic parts
CN2007103076303A CN101319319B (zh) 2006-12-06 2007-12-06 无电镀金浴、无电镀金方法及电子部件
KR1020070126329A KR101393478B1 (ko) 2006-12-06 2007-12-06 무전해 금도금욕, 무전해 금도금 방법 및 전자 부품

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006328891A JP5526458B2 (ja) 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法

Publications (3)

Publication Number Publication Date
JP2008144187A JP2008144187A (ja) 2008-06-26
JP2008144187A5 JP2008144187A5 (enExample) 2010-11-11
JP5526458B2 true JP5526458B2 (ja) 2014-06-18

Family

ID=39498391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006328891A Active JP5526458B2 (ja) 2006-12-06 2006-12-06 無電解金めっき浴及び無電解金めっき方法

Country Status (5)

Country Link
US (1) US7985285B2 (enExample)
JP (1) JP5526458B2 (enExample)
KR (1) KR101393478B1 (enExample)
CN (1) CN101319319B (enExample)
TW (1) TWI457462B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526440B2 (ja) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
JP5371465B2 (ja) * 2009-02-09 2013-12-18 メタローテクノロジーズジャパン株式会社 非シアン無電解金めっき液及び導体パターンのめっき方法
TW201038766A (en) * 2010-07-08 2010-11-01 Rong yi chemical co ltd Method of electroless gold plating over miniature circuits on substrate
KR101444687B1 (ko) 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
JP6619563B2 (ja) * 2015-04-30 2019-12-11 日本高純度化学株式会社 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜
JP6722037B2 (ja) * 2016-05-12 2020-07-15 上村工業株式会社 無電解金めっき浴のめっき能維持管理方法
JP6901847B2 (ja) * 2016-05-12 2021-07-14 上村工業株式会社 無電解金めっき浴
JP6329589B2 (ja) * 2016-06-13 2018-05-23 上村工業株式会社 皮膜形成方法
EP3517651B1 (en) * 2018-01-26 2020-09-02 ATOTECH Deutschland GmbH Electroless gold plating bath

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
SE8302798L (sv) * 1982-06-07 1983-12-08 Occidental Chem Co Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet
JPS60121274A (ja) * 1983-12-06 1985-06-28 Electroplating Eng Of Japan Co 自己触媒型無電解金めっき液
JPS6299477A (ja) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd 無電解金めつき液
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
JP3051683B2 (ja) * 1996-12-10 2000-06-12 栄電子工業株式会社 無電解金めっき方法
JP2000017448A (ja) * 1998-07-01 2000-01-18 Nippon Riironaaru Kk 無電解金めっき液及び無電解金めっき方法
JP2003518552A (ja) * 1999-11-05 2003-06-10 シップレーカンパニー エル エル シー 無電解金めっき組成物及びその使用方法
JP4599599B2 (ja) * 2001-02-01 2010-12-15 奥野製薬工業株式会社 無電解金めっき液
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
JP3831842B2 (ja) * 2002-03-25 2006-10-11 奥野製薬工業株式会社 無電解金めっき液
JP3994279B2 (ja) * 2002-10-21 2007-10-17 奥野製薬工業株式会社 無電解金めっき液
CN100510174C (zh) * 2003-06-10 2009-07-08 日矿金属株式会社 化学镀金液
JP2005054267A (ja) * 2003-07-24 2005-03-03 Electroplating Eng Of Japan Co 無電解金めっき方法
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品

Also Published As

Publication number Publication date
TWI457462B (zh) 2014-10-21
CN101319319A (zh) 2008-12-10
US7985285B2 (en) 2011-07-26
JP2008144187A (ja) 2008-06-26
KR20080052479A (ko) 2008-06-11
TW200902757A (en) 2009-01-16
CN101319319B (zh) 2012-04-25
US20080138506A1 (en) 2008-06-12
KR101393478B1 (ko) 2014-05-13

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