JP5502483B2 - 加工装置及び半導体ストリップ加工システム - Google Patents

加工装置及び半導体ストリップ加工システム Download PDF

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Publication number
JP5502483B2
JP5502483B2 JP2009532285A JP2009532285A JP5502483B2 JP 5502483 B2 JP5502483 B2 JP 5502483B2 JP 2009532285 A JP2009532285 A JP 2009532285A JP 2009532285 A JP2009532285 A JP 2009532285A JP 5502483 B2 JP5502483 B2 JP 5502483B2
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JP
Japan
Prior art keywords
unit
semiconductor strip
semiconductor
transfer
chuck table
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JP2009532285A
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English (en)
Japanese (ja)
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JP2010506422A (ja
Inventor
キュ ナ，イク
グォン チョン，ヒョン
ファン ユン，ウン
Original Assignee
ハンミ セミコンダクター カンパニー リミテッド
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Priority claimed from KR1020060098091A external-priority patent/KR20080032413A/ko
Priority claimed from KR1020060128282A external-priority patent/KR100814890B1/ko
Application filed by ハンミ セミコンダクター カンパニー リミテッド filed Critical ハンミ セミコンダクター カンパニー リミテッド
Publication of JP2010506422A publication Critical patent/JP2010506422A/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/30—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor to form contours, i.e. curved surfaces, irrespective of the method of working used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2009532285A 2006-10-09 2007-10-05 加工装置及び半導体ストリップ加工システム Active JP5502483B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR1020060098091A KR20080032413A (ko) 2006-10-09 2006-10-09 반도체 제조장치
KR10-2006-0098091 2006-10-09
KR1020060128282A KR100814890B1 (ko) 2006-12-15 2006-12-15 가공장치 및 반도체스트립 가공시스템
KR10-2006-0128282 2006-12-15
PCT/KR2007/004871 WO2008044840A2 (fr) 2006-10-09 2007-10-05 Appareil à usiner et système d'usinage d'une plaquette semiconductrice utilisant l'appareil

Publications (2)

Publication Number Publication Date
JP2010506422A JP2010506422A (ja) 2010-02-25
JP5502483B2 true JP5502483B2 (ja) 2014-05-28

Family

ID=39283280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009532285A Active JP5502483B2 (ja) 2006-10-09 2007-10-05 加工装置及び半導体ストリップ加工システム

Country Status (3)

Country Link
JP (1) JP5502483B2 (fr)
TW (1) TWI364087B (fr)
WO (1) WO2008044840A2 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5457660B2 (ja) * 2008-11-07 2014-04-02 アピックヤマダ株式会社 切断方法及び切断装置
JP5420226B2 (ja) * 2008-11-07 2014-02-19 アピックヤマダ株式会社 切断装置
JP5298157B2 (ja) * 2011-04-21 2013-09-25 西進商事株式会社 レーザー加工装置、レーザー加工方法及びレーザー加工物
KR101635113B1 (ko) * 2014-11-20 2016-06-30 서우테크놀로지 주식회사 반도체 스트립 그라인더
JP6388547B2 (ja) * 2015-01-26 2018-09-12 株式会社ディスコ 切削装置
KR101757150B1 (ko) * 2016-07-07 2017-07-12 주식회사 영진하이텍 Ssd용 라우터 절단경로 보정 시스템
KR101945039B1 (ko) * 2017-07-11 2019-02-01 주식회사 영진하이텍 분진제거 기능을 포함하는 ssd용 라우터 절단경로 보정 시스템 및 그의 보정방법
JP7300846B2 (ja) * 2019-02-19 2023-06-30 株式会社ディスコ 切削装置及び半導体パッケージの製造方法
KR102027238B1 (ko) * 2019-03-14 2019-11-04 인세미텍 주식회사 분할 기판 제조용 연삭 가공장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384949A (ja) * 1989-08-29 1991-04-10 Nitto Denko Corp ウエハと粘着テープの貼り合わせ方法
JP3930087B2 (ja) * 1996-01-12 2007-06-13 株式会社東芝 リッド装着装置及び固体撮像装置の製造方法
JP3388697B2 (ja) * 1996-10-31 2003-03-24 株式会社日平トヤマ レーザ加工装置
JP2001340986A (ja) * 2000-05-31 2001-12-11 Nippei Toyama Corp レーザ加工システム及びレーザ加工方法
JP3530483B2 (ja) * 2000-11-22 2004-05-24 Ｎｅｃマシナリー株式会社 基板切断装置
JP3898624B2 (ja) * 2002-11-08 2007-03-28 株式会社日平トヤマ レーザ加工機のワーク搬送装置
KR100479417B1 (ko) * 2003-03-31 2005-03-25 한미반도체 주식회사 반도체 패키지 제조공정용 쏘잉 장치 및 그 제어방법
KR100497506B1 (ko) * 2003-04-08 2005-07-01 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
WO2006025622A1 (fr) * 2004-08-31 2006-03-09 Hanmi Semiconductor Co., Ltd. Appareil de sciage et procede de commande pour processus de fabrication de boitier semi-conducteur
JP4527559B2 (ja) * 2005-01-31 2010-08-18 株式会社ディスコ 露光装置
JP4676288B2 (ja) * 2005-09-14 2011-04-27 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
WO2008044840A3 (fr) 2008-07-24
TWI364087B (en) 2012-05-11
JP2010506422A (ja) 2010-02-25
WO2008044840A2 (fr) 2008-04-17
TW200822265A (en) 2008-05-16

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