JP5474500B2 - 印刷回路基板及びその製造方法 - Google Patents
印刷回路基板及びその製造方法 Download PDFInfo
- Publication number
- JP5474500B2 JP5474500B2 JP2009258564A JP2009258564A JP5474500B2 JP 5474500 B2 JP5474500 B2 JP 5474500B2 JP 2009258564 A JP2009258564 A JP 2009258564A JP 2009258564 A JP2009258564 A JP 2009258564A JP 5474500 B2 JP5474500 B2 JP 5474500B2
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- circuit board
- printed circuit
- nickel
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 156
- 239000002184 metal Substances 0.000 claims description 156
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 61
- 229920006254 polymer film Polymers 0.000 claims description 51
- 238000007747 plating Methods 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 37
- 229910052759 nickel Inorganic materials 0.000 claims description 30
- 230000003746 surface roughness Effects 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 238000009713 electroplating Methods 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 6
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 6
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 6
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 239000010408 film Substances 0.000 description 123
- 239000010410 layer Substances 0.000 description 20
- 239000011889 copper foil Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000013078 crystal Substances 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000002952 polymeric resin Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 2
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 2
- 235000011130 ammonium sulphate Nutrition 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229920006112 polar polymer Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
- Y10T428/12514—One component Cu-based
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Description
20,20’ 第2の金属膜
21,21’ 第1の面
22,22’ 第2の面
30 第3の金属膜
40 ポリマー膜
Claims (6)
- 印刷回路基板であって、
銅又は銅合金からなる第1の金属膜と、
前記第1の金属膜の少なくとも一方の表面に形成され、前記第1の金属膜に接する第1の面及び該第1の面の反対側の該第1の面よりも表面粗さが大きい第2の面を有し、ニッケルからなる第2の金属膜と、
前記第2の金属膜の第2の面に形成されたポリマー膜とを含み、
前記第2の金属膜の第2の面の表面粗さは、電気めっき法により前記ニッケルを前記第1の金属膜上で成長させることにより得られ、前記第2の金属膜の厚さは、0.1乃至0.5μmであることを特徴とする印刷回路基板。 - 印刷回路基板であって、
銅又は銅合金からなる第1の金属膜と、
前記第1の金属膜の少なくとも一方の表面に形成され、前記第1の金属膜に接する第1の面及び該第1の面の反対側の該第1の面よりも表面粗さが大きい第2の面を有し、ニッケルからなる第2の金属膜と、
前記第2の金属膜の第2の面に形成された第3の金属膜と、
前記第3の金属膜の面に形成されたポリマー膜とを含み、
前記第2の金属膜の第2の面の表面粗さは、電気めっき法により前記ニッケルを成長させることにより形成され、前記第2の金属膜の厚さは、0.1乃至0.5μmであり、
前記第3の金属膜は、前記第2の面の表面粗さが該第3の金属膜の前記ポリマー膜側の面にも現れるような厚さで形成され、前記第3の金属膜が、ニッケル、パラジウム、金またはそれらの合金からなることを特徴とする印刷回路基板。 - 印刷回路基板の製造方法であって、
銅又は銅合金からなる第1の金属膜を準備する段階と、
前記第1の金属膜の少なくとも一方の表面上に、前記第1の金属膜に接する第1の面、及び該第1の面の反対側の該第1の面よりも表面粗さが大きい第2の面を有し、ニッケルからなる第2の金属膜を形成する段階と、
前記第2の金属膜の前記第2の面上にポリマー膜を形成する段階とを含み、
前記第2の金属膜の第2の面の表面粗さは、電気めっき法により前記ニッケルを0.1乃至0.5μmの厚さに成長させることにより形成され、
前記第2の金属膜を形成する前記段階は、10A/dm 2 以上の電流密度で、電気めっき法により3秒ないし20秒間行われることを特徴とする印刷回路基板の製造方法。 - 前記第2の金属膜を形成する前記段階は、
2.5g/Lないし3.5g/Lの硫酸ニッケルまたは塩化ニッケルを含むめっき液を貯留しためっき浴槽を使用して電気めっき法により行われることを特徴とする請求項3に記載の印刷回路基板の製造方法。 - 前記ポリマー膜を形成する前に前記第2の金属膜の前記第2の面上に第3の金属膜を形成する段階をさらに含み、前記第3の金属膜上に前記ポリマー膜を形成するようにしたことを特徴とする請求項3に記載の印刷回路基板の製造方法。
- 前記第3の金属膜が、ニッケル、パラジウム、金またはそれらの合金から成ることを特徴とする請求項5に記載の印刷回路基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080112865A KR101426038B1 (ko) | 2008-11-13 | 2008-11-13 | 인쇄회로기판 및 그 제조방법 |
KR10-2008-0112865 | 2008-11-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010118662A JP2010118662A (ja) | 2010-05-27 |
JP5474500B2 true JP5474500B2 (ja) | 2014-04-16 |
Family
ID=42164147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009258564A Active JP5474500B2 (ja) | 2008-11-13 | 2009-11-12 | 印刷回路基板及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8409726B2 (ja) |
JP (1) | JP5474500B2 (ja) |
KR (1) | KR101426038B1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012043182A1 (ja) * | 2010-09-27 | 2012-04-05 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔、その製造方法、プリント配線板用樹脂基板及びプリント配線板 |
WO2013069947A1 (en) * | 2011-11-09 | 2013-05-16 | Lg Innotek Co., Ltd. | Tape carrier package and method of manufacturing the same |
CN103635009A (zh) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | 印刷电路板用黄色聚酰胺酰亚胺保护膜及其制造方法 |
CN103813616A (zh) * | 2012-11-13 | 2014-05-21 | 昆山雅森电子材料科技有限公司 | 复合式叠构覆盖膜及具有该覆盖膜的电路板及其制法 |
JP6310193B2 (ja) * | 2013-07-02 | 2018-04-11 | Jx金属株式会社 | キャリア付銅箔、その製造方法、銅張積層板の製造方法及びプリント配線板の製造方法 |
JP6310192B2 (ja) * | 2013-07-02 | 2018-04-11 | Jx金属株式会社 | キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法 |
JP6310191B2 (ja) * | 2013-07-02 | 2018-04-11 | Jx金属株式会社 | キャリア付銅箔及びその製造方法、銅張積層板の製造方法及びプリント配線板の製造方法 |
JP5758557B1 (ja) | 2013-10-25 | 2015-08-05 | オーエム産業株式会社 | めっき品の製造方法 |
DE102014210483A1 (de) * | 2014-06-03 | 2015-12-03 | Conti Temic Microelectronic Gmbh | Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung |
US20170334170A1 (en) * | 2016-03-23 | 2017-11-23 | Atieh Haghdoost | Articles including adhesion enhancing coatings and methods of producing them |
KR102462505B1 (ko) | 2016-04-22 | 2022-11-02 | 삼성전자주식회사 | 인쇄회로기판 및 반도체 패키지 |
CN110996546A (zh) * | 2019-12-31 | 2020-04-10 | 华宇华源电子科技(深圳)有限公司 | 一种增强pcb板表面耐压能力的方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517507B2 (ja) * | 1972-06-29 | 1980-05-12 | ||
US3984907A (en) * | 1975-07-25 | 1976-10-12 | Rca Corporation | Adherence of metal films to polymeric materials |
JPS5856758B2 (ja) * | 1975-12-17 | 1983-12-16 | ミツイアナコンダドウハク カブシキガイシヤ | ドウハクヒヨウメンシヨリホウホウ |
JPS56155592A (en) * | 1980-04-03 | 1981-12-01 | Furukawa Circuit Foil | Copper foil for printed circuit and method of manufacturing same |
JPS61110794A (ja) * | 1984-11-06 | 1986-05-29 | Mitsui Mining & Smelting Co Ltd | 銅箔の表面処理方法 |
US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
JPH04359518A (ja) * | 1991-06-06 | 1992-12-11 | Nec Corp | 半導体装置の製造方法 |
US5403672A (en) * | 1992-08-17 | 1995-04-04 | Hitachi Chemical Co., Ltd. | Metal foil for printed wiring board and production thereof |
TW317575B (ja) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
JP3000877B2 (ja) * | 1995-02-20 | 2000-01-17 | 松下電器産業株式会社 | 金メッキ電極の形成方法、基板及びワイヤボンディング方法 |
US6171714B1 (en) * | 1996-04-18 | 2001-01-09 | Gould Electronics Inc. | Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
US6359233B1 (en) * | 1999-10-26 | 2002-03-19 | Intel Corporation | Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof |
US6497806B1 (en) * | 2000-04-25 | 2002-12-24 | Nippon Denkai, Ltd. | Method of producing a roughening-treated copper foil |
US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
US6622374B1 (en) * | 2000-09-22 | 2003-09-23 | Gould Electronics Inc. | Resistor component with multiple layers of resistive material |
JP2003051673A (ja) * | 2001-08-06 | 2003-02-21 | Mitsui Mining & Smelting Co Ltd | プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板 |
KR100401340B1 (ko) | 2001-11-16 | 2003-10-10 | 엘지전선 주식회사 | Pcb용 전해동박의 표면처리방법 |
JP4178415B2 (ja) * | 2002-07-04 | 2008-11-12 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔 |
JP4115293B2 (ja) * | 2003-02-17 | 2008-07-09 | 古河サーキットフォイル株式会社 | チップオンフィルム用銅箔 |
US6994918B2 (en) * | 2003-08-12 | 2006-02-07 | Johnson Morgan T | Selective application of conductive material to circuit boards by pick and place |
JP3977790B2 (ja) * | 2003-09-01 | 2007-09-19 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板 |
JP2005353918A (ja) | 2004-06-11 | 2005-12-22 | Hitachi Cable Ltd | プリント配線板用銅箔及びその製造方法 |
KR100819800B1 (ko) | 2005-04-15 | 2008-04-07 | 삼성테크윈 주식회사 | 반도체 패키지용 리드 프레임 |
JP4626390B2 (ja) * | 2005-05-16 | 2011-02-09 | 日立電線株式会社 | 環境保護を配慮したプリント配線板用銅箔 |
WO2007145164A1 (ja) * | 2006-06-12 | 2007-12-21 | Nippon Mining & Metals Co., Ltd. | 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法 |
-
2008
- 2008-11-13 KR KR1020080112865A patent/KR101426038B1/ko active IP Right Grant
-
2009
- 2009-06-01 US US12/475,764 patent/US8409726B2/en active Active
- 2009-11-12 JP JP2009258564A patent/JP5474500B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010118662A (ja) | 2010-05-27 |
KR101426038B1 (ko) | 2014-08-01 |
KR20100053964A (ko) | 2010-05-24 |
US8409726B2 (en) | 2013-04-02 |
US20100116528A1 (en) | 2010-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5474500B2 (ja) | 印刷回路基板及びその製造方法 | |
US7954234B2 (en) | Method of manufacturing a wiring board | |
JP5602584B2 (ja) | 配線基板及びその製造方法 | |
TW201218323A (en) | Method for manufacturing package substrate for semiconductor element mounting | |
KR100874172B1 (ko) | 연성인쇄회로기판의 제조방법 및 이를 이용하여 형성된연성 인쇄회로기판의 금속 배선패턴 | |
JP2006196656A (ja) | 配線板及び配線板の製造方法 | |
JP5248684B2 (ja) | 電子回路及びその形成方法並びに電子回路形成用銅張積層板 | |
TWI486487B (zh) | The formation of electronic circuits | |
JP5738964B2 (ja) | 電子回路及びその形成方法並びに電子回路形成用銅張積層板 | |
TWI593830B (zh) | With a carrier of ultra-thin copper foil, copper-clad laminate and coreless substrate | |
JP2009252952A (ja) | 銅充填めっき方法及びその方法で製造されたプリント配線基板 | |
WO2010018790A1 (ja) | マルチ導通部を有する多層積層回路基板 | |
US9867288B2 (en) | Semiconductor memory card, printed circuit board for memory card and method of fabricating the same | |
JP4345742B2 (ja) | 配線基板及びその製造方法 | |
JP6457881B2 (ja) | 配線基板及びその製造方法 | |
JP4520665B2 (ja) | プリント配線板及びその製造方法並びに部品実装構造 | |
JP2008263026A (ja) | Cof配線基板およびその製造方法 | |
KR101324225B1 (ko) | 인쇄회로기판의 제조방법 | |
WO2012124424A1 (ja) | 電子回路形成方法、電子回路及び電子回路形成用銅張積層板 | |
JP7412735B2 (ja) | 半導体パッケージの製造方法 | |
JP2011216528A (ja) | 電子回路形成方法、電子回路及び電子回路形成用銅張積層板 | |
JP5222663B2 (ja) | 配線基板及び半導体パッケージ | |
JP2006019321A (ja) | 回路基板及びその製造方法 | |
JP6760683B2 (ja) | 電極構造体 | |
JP2008091596A (ja) | 表面平滑性を有する銅被覆ポリイミド基板とその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110107 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20120223 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120629 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120703 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121002 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130423 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130723 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140121 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140205 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5474500 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |