JP5462936B2 - シリコン太陽電池の個別化方法 - Google Patents

シリコン太陽電池の個別化方法 Download PDF

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Publication number
JP5462936B2
JP5462936B2 JP2012511246A JP2012511246A JP5462936B2 JP 5462936 B2 JP5462936 B2 JP 5462936B2 JP 2012511246 A JP2012511246 A JP 2012511246A JP 2012511246 A JP2012511246 A JP 2012511246A JP 5462936 B2 JP5462936 B2 JP 5462936B2
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Prior art keywords
laser beam
silicon wafer
cutting
solar cells
silicon
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JP2012511246A
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English (en)
Japanese (ja)
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JP2012527753A (ja
JP2012527753A5 (enExample
Inventor
マイヤーホーファー、ローラント
Original Assignee
ロフィンーバーゼル ラゼルテヒ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニ コマンディートゲゼルシャフト
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Publication of JP2012527753A5 publication Critical patent/JP2012527753A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/121—The active layers comprising only Group IV materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Laser Beam Processing (AREA)
JP2012511246A 2009-05-20 2010-05-17 シリコン太陽電池の個別化方法 Active JP5462936B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009026410A DE102009026410A1 (de) 2009-05-20 2009-05-20 Verfahren zum Vereinzeln von Silizium-Solarzellen
DE102009026410.8 2009-05-20
PCT/EP2010/056708 WO2010133536A1 (de) 2009-05-20 2010-05-17 Verfahren zum vereinzeln von silizium-solarzellen

Publications (3)

Publication Number Publication Date
JP2012527753A JP2012527753A (ja) 2012-11-08
JP2012527753A5 JP2012527753A5 (enExample) 2013-06-13
JP5462936B2 true JP5462936B2 (ja) 2014-04-02

Family

ID=42309524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012511246A Active JP5462936B2 (ja) 2009-05-20 2010-05-17 シリコン太陽電池の個別化方法

Country Status (5)

Country Link
US (1) US20110124147A1 (enExample)
EP (1) EP2291867B1 (enExample)
JP (1) JP5462936B2 (enExample)
DE (1) DE102009026410A1 (enExample)
WO (1) WO2010133536A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011012275A1 (de) * 2011-02-24 2012-08-30 Ritek Corp. Verfahren zum Schneiden eines Solarzellenpanels und Ausrüstung dafür
DE102012214335A1 (de) * 2012-08-10 2014-02-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Ablation einer Schicht
DE102012217766B4 (de) * 2012-09-28 2016-06-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zum Dampfdruck-Abtragschneiden eines metallischen Werkstücks
JP5492354B1 (ja) * 2012-10-02 2014-05-14 株式会社カネカ 結晶シリコン太陽電池の製造方法、太陽電池モジュールの製造方法、結晶シリコン太陽電池並びに太陽電池モジュール
JP2014194977A (ja) * 2013-03-28 2014-10-09 Kaneka Corp 結晶シリコン系太陽電池およびその製造方法
JP6181979B2 (ja) * 2013-05-29 2017-08-16 株式会社カネカ 太陽電池およびその製造方法、ならびに太陽電池モジュール
JP6313086B2 (ja) * 2014-03-27 2018-04-18 株式会社カネカ 結晶シリコン太陽電池およびその製造方法、太陽電池モジュールの製造方法、集光型太陽電池モジュールの製造方法
US9776906B2 (en) * 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
DE102018123485B4 (de) 2018-09-24 2021-04-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Auftrennen eines Halbleiterbauelements mit einem pn-Übergang
DE102018123484A1 (de) * 2018-09-24 2020-03-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Vereinzeln eines Halbleiterbauelementes mit einem pn-Übergang und Halbleiterbauelement mit einem pn-Übergang
ES2997232T3 (en) * 2019-05-08 2025-02-14 Wsoptics Tech Gmbh Method and device for laser processing a workpiece
WO2020246697A1 (ko) 2019-06-04 2020-12-10 주성엔지니어링(주) 태양전지용 기판, 태양전지, 및 태양전지 제조방법
EP4059060A1 (en) 2019-11-13 2022-09-21 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method for creating shunt free translucent flexible thin-film photovoltaic module
CN113555463A (zh) * 2020-04-23 2021-10-26 苏州阿特斯阳光电力科技有限公司 太阳能电池的制备方法与太阳能电池
US11764315B2 (en) * 2020-09-16 2023-09-19 Maxeon Solar Pte. Ltd. Solar cell separation with edge coating
CN112054096A (zh) * 2020-09-29 2020-12-08 天合光能股份有限公司 一种切片单晶硅电池的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120646B2 (ja) * 1990-05-16 1995-12-20 株式会社東芝 メサ型半導体ペレットの製造方法
DE19624677A1 (de) * 1996-06-20 1998-01-02 Siemens Ag Verfahren zur Vereinzelung von optoelektrischen Bauelementen
JP3516156B2 (ja) * 1997-12-16 2004-04-05 シャープ株式会社 太陽電池の製造方法および保護カバー用素材板
US6420245B1 (en) * 1999-06-08 2002-07-16 Kulicke & Soffa Investments, Inc. Method for singulating semiconductor wafers
JP4786010B2 (ja) * 2000-03-23 2011-10-05 株式会社カネカ 集積型ハイブリッド薄膜太陽電池の製造方法
JP2003151921A (ja) * 2001-11-09 2003-05-23 Sanyo Electric Co Ltd 化合物半導体とその製造方法
ATE316691T1 (de) * 2002-04-19 2006-02-15 Xsil Technology Ltd Laser-behandlung
GB2402230B (en) * 2003-05-30 2006-05-03 Xsil Technology Ltd Focusing an optical beam to two foci
JP4369259B2 (ja) * 2004-02-19 2009-11-18 シャープ株式会社 太陽電池セルの製造方法
JP2006027025A (ja) * 2004-07-14 2006-02-02 Seiko Epson Corp 基板の切断方法、および半導体チップの製造方法
JP4439477B2 (ja) * 2005-03-29 2010-03-24 三洋電機株式会社 光起電力素子及びその製造方法
JP4717545B2 (ja) * 2005-08-01 2011-07-06 シャープ株式会社 光電変換素子の製造方法
ATE503603T1 (de) * 2007-01-08 2011-04-15 Spi Lasers Uk Ltd Verfahren zum laserschneiden eines nichtmetallischen materials

Also Published As

Publication number Publication date
US20110124147A1 (en) 2011-05-26
EP2291867A1 (de) 2011-03-09
DE102009026410A1 (de) 2011-03-17
JP2012527753A (ja) 2012-11-08
EP2291867B1 (de) 2012-05-16
WO2010133536A1 (de) 2010-11-25

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