JP5460322B2 - 熱硬化性樹脂組成物及びその硬化物 - Google Patents

熱硬化性樹脂組成物及びその硬化物 Download PDF

Info

Publication number
JP5460322B2
JP5460322B2 JP2009529985A JP2009529985A JP5460322B2 JP 5460322 B2 JP5460322 B2 JP 5460322B2 JP 2009529985 A JP2009529985 A JP 2009529985A JP 2009529985 A JP2009529985 A JP 2009529985A JP 5460322 B2 JP5460322 B2 JP 5460322B2
Authority
JP
Japan
Prior art keywords
resin composition
thermosetting resin
mass
formula
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009529985A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2009028170A1 (ja
Inventor
繁 茂木
誠 内田
宏一 川井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Priority to JP2009529985A priority Critical patent/JP5460322B2/ja
Publication of JPWO2009028170A1 publication Critical patent/JPWO2009028170A1/ja
Application granted granted Critical
Publication of JP5460322B2 publication Critical patent/JP5460322B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
JP2009529985A 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物 Expired - Fee Related JP5460322B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009529985A JP5460322B2 (ja) 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007219545 2007-08-27
JP2007219545 2007-08-27
JP2009529985A JP5460322B2 (ja) 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物
PCT/JP2008/002306 WO2009028170A1 (ja) 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物

Publications (2)

Publication Number Publication Date
JPWO2009028170A1 JPWO2009028170A1 (ja) 2010-11-25
JP5460322B2 true JP5460322B2 (ja) 2014-04-02

Family

ID=40386911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009529985A Expired - Fee Related JP5460322B2 (ja) 2007-08-27 2008-08-26 熱硬化性樹脂組成物及びその硬化物

Country Status (5)

Country Link
JP (1) JP5460322B2 (zh)
KR (1) KR20100057777A (zh)
CN (1) CN101784580A (zh)
TW (1) TW200909519A (zh)
WO (1) WO2009028170A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2614648A1 (en) 2005-07-21 2007-01-25 Nippon Kayaku Kabushiki Kaisha Polyamide resin, epoxy resin compositions, and cured articles thereof
JP5738274B2 (ja) * 2010-03-15 2015-06-24 日本化薬株式会社 耐熱用接着剤
JP5323780B2 (ja) * 2010-07-28 2013-10-23 ナン ヤ プラスティクス コーポレーション 積層基板用低誘導電率樹脂ワニス組成物及びその製法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106769A (ja) * 1999-10-06 2001-04-17 Nippon Kayaku Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2007204598A (ja) * 2006-02-01 2007-08-16 Nippon Kayaku Co Ltd 樹脂組成物およびその硬化物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001049082A (ja) * 1999-06-04 2001-02-20 Nippon Kayaku Co Ltd エポキシ樹脂組成物、そのワニス、それを用いたフィルム状接着剤及びその硬化物
JP4095381B2 (ja) * 2002-09-03 2008-06-04 群栄化学工業株式会社 芳香族ポリアミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
TWI306867B (en) * 2002-11-28 2009-03-01 Nippon Kayaku Kk Flame-retardant epoxy resin and its cured product
JP2004269615A (ja) * 2003-03-06 2004-09-30 Nippon Kayaku Co Ltd エポキシ樹脂組成物、及びその硬化物
JP2008138191A (ja) * 2006-11-07 2008-06-19 Nippon Kayaku Co Ltd ポリアミド樹脂ワニス、その硬化物、および物品。

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001106769A (ja) * 1999-10-06 2001-04-17 Nippon Kayaku Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2007204598A (ja) * 2006-02-01 2007-08-16 Nippon Kayaku Co Ltd 樹脂組成物およびその硬化物

Also Published As

Publication number Publication date
CN101784580A (zh) 2010-07-21
KR20100057777A (ko) 2010-06-01
WO2009028170A1 (ja) 2009-03-05
JPWO2009028170A1 (ja) 2010-11-25
TW200909519A (en) 2009-03-01

Similar Documents

Publication Publication Date Title
US20030166796A1 (en) Epoxy resin composition and cured object obtained therefrom
TWI716967B (zh) 樹脂組合物、預浸料、層壓板、覆金屬箔層壓板以及印刷電路板
TW201823335A (zh) 環氧樹脂組合物、預浸料、層壓板和印刷電路板
JP4616771B2 (ja) 難燃性エポキシ樹脂組成物及びその硬化物
JP5097349B2 (ja) エポキシ樹脂組成物及びこれを用いたエポキシ樹脂ワニス、ボンディングシート、カバーレイフィルム
JP2002069270A (ja) 難燃性非ハロゲンエポキシ樹脂組成物及びその用途
EP3412722B1 (en) Halogen-free thermosetting resin composition, prepreg containing same, laminate, and printed circuit board
JP5771186B2 (ja) フィルム用組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム
JP2005036126A (ja) エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。
JP2014122339A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板、及び実装基板、並びに熱硬化性樹脂組成物の製造方法
JP2009167396A (ja) 接着剤組成物、それを用いた銅張り積層板、カバーレイフィルムおよび接着剤シート
JP5460322B2 (ja) 熱硬化性樹脂組成物及びその硬化物
WO2019189811A1 (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂付き金属箔、積層体、プリント配線板及び半導体パッケージ
KR101177774B1 (ko) 회로기판용 접착제 조성물 및 고탄성율의 접착 필름
JP2003026773A (ja) エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料
JP4968770B2 (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2013075440A (ja) 積層体の製造方法及び積層構造体
JP6043151B2 (ja) 熱可塑性ポリヒドロキシポリエーテル樹脂及びそれから成形した絶縁性フィルム
JP4042886B2 (ja) エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料
JP4969931B2 (ja) エポキシ樹脂、その製造方法及びその用途
JP2001119129A (ja) カバーレイフィルム
JP2014062249A (ja) 絶縁用エポキシ樹脂組成物、絶縁フィルム、プリプレグ及びプリント回路基板
JP4509539B2 (ja) エポキシ樹脂組成物シート
TWI837297B (zh) 酯化合物、樹脂組成物、硬化物、及增層膜
JP2005015553A (ja) エポキシ樹脂組成物及びそれを用いた接着シート

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110330

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130716

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130905

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140114

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5460322

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees