JP5451175B2 - 露光装置 - Google Patents

露光装置 Download PDF

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Publication number
JP5451175B2
JP5451175B2 JP2009119103A JP2009119103A JP5451175B2 JP 5451175 B2 JP5451175 B2 JP 5451175B2 JP 2009119103 A JP2009119103 A JP 2009119103A JP 2009119103 A JP2009119103 A JP 2009119103A JP 5451175 B2 JP5451175 B2 JP 5451175B2
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JP
Japan
Prior art keywords
exposure
light source
pair
substrate
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009119103A
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English (en)
Japanese (ja)
Other versions
JP2010266763A (ja
Inventor
健 三宅
俊博 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanei Giken Co Ltd
Original Assignee
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Priority to JP2009119103A priority Critical patent/JP5451175B2/ja
Priority to TW099112976A priority patent/TWI485528B/zh
Priority to KR1020100041828A priority patent/KR101635962B1/ko
Priority to CN201010176146.3A priority patent/CN101887217B/zh
Publication of JP2010266763A publication Critical patent/JP2010266763A/ja
Application granted granted Critical
Publication of JP5451175B2 publication Critical patent/JP5451175B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/065—Etching masks applied by electrographic, electrophotographic or magnetographic methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2009119103A 2009-05-15 2009-05-15 露光装置 Active JP5451175B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009119103A JP5451175B2 (ja) 2009-05-15 2009-05-15 露光装置
TW099112976A TWI485528B (zh) 2009-05-15 2010-04-23 Exposure device
KR1020100041828A KR101635962B1 (ko) 2009-05-15 2010-05-04 노광 장치
CN201010176146.3A CN101887217B (zh) 2009-05-15 2010-05-05 曝光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009119103A JP5451175B2 (ja) 2009-05-15 2009-05-15 露光装置

Publications (2)

Publication Number Publication Date
JP2010266763A JP2010266763A (ja) 2010-11-25
JP5451175B2 true JP5451175B2 (ja) 2014-03-26

Family

ID=43073184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009119103A Active JP5451175B2 (ja) 2009-05-15 2009-05-15 露光装置

Country Status (4)

Country Link
JP (1) JP5451175B2 (ko)
KR (1) KR101635962B1 (ko)
CN (1) CN101887217B (ko)
TW (1) TWI485528B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102402131A (zh) * 2011-11-11 2012-04-04 深南电路有限公司 一种曝光系统
US8802333B2 (en) * 2012-03-15 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Reflective lithography masks and systems and methods
DE102012108211A1 (de) * 2012-09-04 2014-03-06 Kleo Halbleitertechnik Gmbh Belichtungsanlage
KR101510156B1 (ko) * 2014-11-10 2015-04-08 (주)프리테크 리드프레임 제조용 노광장치
CN112859396B (zh) * 2015-09-01 2024-01-05 株式会社尼康 光罩保持装置、曝光装置、光罩保持方法、曝光方法
JP7040981B2 (ja) * 2018-03-29 2022-03-23 株式会社オーク製作所 露光装置
CN112188747B (zh) * 2020-10-13 2021-09-07 合肥泽延微电子有限公司 一种集成电路板布线用智能定位系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121048A (ja) * 1982-12-27 1984-07-12 Ibiden Co Ltd プリント配線基板の製造装置
JPH0778630B2 (ja) * 1986-07-15 1995-08-23 サンエ−技研株式会社 露光装置
JP2891769B2 (ja) * 1990-11-30 1999-05-17 ウシオ電機株式会社 フィルム露光装置
JP3559999B2 (ja) * 1994-07-29 2004-09-02 株式会社オーク製作所 マスク整合機構付露光装置およびワークの整合、露光、ならびに搬送方法。
JP2000066418A (ja) * 1998-08-17 2000-03-03 Ono Sokki Co Ltd 露光装置及び露光方法
JP2000114159A (ja) 1998-10-07 2000-04-21 Canon Inc 投影露光装置およびデバイス製造方法
JP2003207902A (ja) * 2002-01-11 2003-07-25 Pentax Corp 露光装置
JP2004094142A (ja) * 2002-09-04 2004-03-25 Toray Eng Co Ltd 幅広露光機
JP4218418B2 (ja) * 2003-05-23 2009-02-04 ウシオ電機株式会社 帯状ワークの両面投影露光装置
JP2005326550A (ja) * 2004-05-13 2005-11-24 Sanee Giken Kk 露光装置
JP2006098718A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 描画装置
JP2006301170A (ja) * 2005-04-19 2006-11-02 Fujikura Ltd 露光装置およびその方法
JP4861778B2 (ja) * 2005-09-08 2012-01-25 富士フイルム株式会社 パターン露光方法及び装置
JP4775076B2 (ja) * 2006-03-31 2011-09-21 住友金属鉱山株式会社 露光方法及び装置
JP2007292933A (ja) * 2006-04-24 2007-11-08 Nsk Ltd 露光装置
TW200745781A (en) * 2006-04-24 2007-12-16 Nsk Ltd Exposure apparatus
US8264666B2 (en) * 2009-03-13 2012-09-11 Nikon Corporation Exposure apparatus, exposure method, and method of manufacturing device

Also Published As

Publication number Publication date
KR20100123611A (ko) 2010-11-24
CN101887217A (zh) 2010-11-17
CN101887217B (zh) 2014-09-24
JP2010266763A (ja) 2010-11-25
KR101635962B1 (ko) 2016-07-04
TWI485528B (zh) 2015-05-21
TW201107894A (en) 2011-03-01

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