JP5445490B2 - 封止用エポキシ樹脂成形材料及び電子部品装置 - Google Patents
封止用エポキシ樹脂成形材料及び電子部品装置 Download PDFInfo
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- JP5445490B2 JP5445490B2 JP2011049682A JP2011049682A JP5445490B2 JP 5445490 B2 JP5445490 B2 JP 5445490B2 JP 2011049682 A JP2011049682 A JP 2011049682A JP 2011049682 A JP2011049682 A JP 2011049682A JP 5445490 B2 JP5445490 B2 JP 5445490B2
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- epoxy resin
- molding material
- resin molding
- sealing
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- 229920000647 polyepoxide Polymers 0.000 title claims description 200
- 239000003822 epoxy resin Substances 0.000 title claims description 195
- 239000012778 molding material Substances 0.000 title claims description 102
- 238000007789 sealing Methods 0.000 title claims description 96
- 150000001875 compounds Chemical class 0.000 claims description 91
- -1 phosphine compound Chemical class 0.000 claims description 80
- 125000004432 carbon atom Chemical group C* 0.000 claims description 62
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 38
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 34
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 32
- 239000003795 chemical substances by application Substances 0.000 claims description 30
- 125000000217 alkyl group Chemical group 0.000 claims description 25
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 22
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 21
- 125000003545 alkoxy group Chemical group 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 16
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 14
- 239000011256 inorganic filler Substances 0.000 claims description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 14
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical group C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 claims description 14
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 12
- 239000007822 coupling agent Substances 0.000 claims description 10
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 125000000962 organic group Chemical group 0.000 claims description 5
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 5
- 125000000524 functional group Chemical group 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 67
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- 239000011347 resin Substances 0.000 description 49
- 239000005011 phenolic resin Substances 0.000 description 36
- 125000003172 aldehyde group Chemical group 0.000 description 32
- 238000000034 method Methods 0.000 description 29
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 25
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 description 24
- 239000000047 product Substances 0.000 description 23
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- 239000000203 mixture Substances 0.000 description 21
- 125000003118 aryl group Chemical group 0.000 description 19
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- 239000004065 semiconductor Substances 0.000 description 17
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 16
- 125000003710 aryl alkyl group Chemical group 0.000 description 16
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 16
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 16
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- 238000006243 chemical reaction Methods 0.000 description 15
- 239000003063 flame retardant Substances 0.000 description 14
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- 239000000758 substrate Substances 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 10
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 9
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- 238000003860 storage Methods 0.000 description 9
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
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- 230000000052 comparative effect Effects 0.000 description 8
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- 230000000694 effects Effects 0.000 description 8
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000011777 magnesium Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 229910052787 antimony Inorganic materials 0.000 description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 6
- 238000013329 compounding Methods 0.000 description 6
- 229930003836 cresol Natural products 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 6
- 150000004780 naphthols Chemical class 0.000 description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 5
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 150000003014 phosphoric acid esters Chemical class 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 125000004434 sulfur atom Chemical group 0.000 description 5
- 125000003944 tolyl group Chemical group 0.000 description 5
- 125000005023 xylyl group Chemical group 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- 0 Cc(cccc1C)c1O*(Oc1cccc(O*(Oc2c(C)cccc2C)Oc2c(C)cccc2C)c1)Oc1c(C)cccc1C Chemical compound Cc(cccc1C)c1O*(Oc1cccc(O*(Oc2c(C)cccc2C)Oc2c(C)cccc2C)c1)Oc1c(C)cccc1C 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
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- 125000000732 arylene group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
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- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 4
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- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 4
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- 229910052757 nitrogen Inorganic materials 0.000 description 4
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- 125000001424 substituent group Chemical group 0.000 description 4
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- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical group C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 4
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 4
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 4
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 3
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- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
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- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 3
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- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 3
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- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
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- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical group C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- IDXDWPWXHTXJMZ-UHFFFAOYSA-N tris(2,4,6-trimethylphenyl)phosphane Chemical group CC1=CC(C)=CC(C)=C1P(C=1C(=CC(C)=CC=1C)C)C1=C(C)C=C(C)C=C1C IDXDWPWXHTXJMZ-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- XDHRVAHAGMMFMC-UHFFFAOYSA-N tris(2,4-dimethylphenyl)phosphane Chemical group CC1=CC(C)=CC=C1P(C=1C(=CC(C)=CC=1)C)C1=CC=C(C)C=C1C XDHRVAHAGMMFMC-UHFFFAOYSA-N 0.000 description 1
- QLORRTLBSJTMSN-UHFFFAOYSA-N tris(2,6-dimethylphenyl) phosphate Chemical compound CC1=CC=CC(C)=C1OP(=O)(OC=1C(=CC=CC=1C)C)OC1=C(C)C=CC=C1C QLORRTLBSJTMSN-UHFFFAOYSA-N 0.000 description 1
- RERMPCBBVZEPBS-UHFFFAOYSA-N tris(2,6-dimethylphenyl)phosphane Chemical group CC1=CC=CC(C)=C1P(C=1C(=CC=CC=1C)C)C1=C(C)C=CC=C1C RERMPCBBVZEPBS-UHFFFAOYSA-N 0.000 description 1
- CKKFLUXMIUUGAW-UHFFFAOYSA-N tris(2-propan-2-ylphenyl)phosphane Chemical group CC(C)C1=CC=CC=C1P(C=1C(=CC=CC=1)C(C)C)C1=CC=CC=C1C(C)C CKKFLUXMIUUGAW-UHFFFAOYSA-N 0.000 description 1
- GDKAFTKCUOBEDW-UHFFFAOYSA-N tris(2-tert-butylphenyl)phosphane Chemical group CC(C)(C)C1=CC=CC=C1P(C=1C(=CC=CC=1)C(C)(C)C)C1=CC=CC=C1C(C)(C)C GDKAFTKCUOBEDW-UHFFFAOYSA-N 0.000 description 1
- RYXYUARTMQUYKV-UHFFFAOYSA-N tris(4-butylphenyl)phosphane Chemical group C1=CC(CCCC)=CC=C1P(C=1C=CC(CCCC)=CC=1)C1=CC=C(CCCC)C=C1 RYXYUARTMQUYKV-UHFFFAOYSA-N 0.000 description 1
- SPNVODOGUAUMCA-UHFFFAOYSA-N tris(4-ethoxy-2,6-dimethylphenyl)phosphane Chemical group CC1=CC(OCC)=CC(C)=C1P(C=1C(=CC(OCC)=CC=1C)C)C1=C(C)C=C(OCC)C=C1C SPNVODOGUAUMCA-UHFFFAOYSA-N 0.000 description 1
- LQEKTSMTEYLBLJ-UHFFFAOYSA-N tris(4-ethoxyphenyl)phosphane Chemical group C1=CC(OCC)=CC=C1P(C=1C=CC(OCC)=CC=1)C1=CC=C(OCC)C=C1 LQEKTSMTEYLBLJ-UHFFFAOYSA-N 0.000 description 1
- PCCAGZSOGFNURV-UHFFFAOYSA-N tris(4-ethylphenyl)phosphane Chemical group C1=CC(CC)=CC=C1P(C=1C=CC(CC)=CC=1)C1=CC=C(CC)C=C1 PCCAGZSOGFNURV-UHFFFAOYSA-N 0.000 description 1
- UYUUAUOYLFIRJG-UHFFFAOYSA-N tris(4-methoxyphenyl)phosphane Chemical compound C1=CC(OC)=CC=C1P(C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 UYUUAUOYLFIRJG-UHFFFAOYSA-N 0.000 description 1
- JTOQWGJGVSYTTN-UHFFFAOYSA-N tris(4-propylphenyl)phosphane Chemical group C1=CC(CCC)=CC=C1P(C=1C=CC(CCC)=CC=1)C1=CC=C(CCC)C=C1 JTOQWGJGVSYTTN-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Chemical & Material Sciences (AREA)
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(1)(A)エポキシ樹脂、(B)硬化剤を含有し、(A)エポキシ樹脂が下記一般式(I)で示される化合物を含有する封止用エポキシ樹脂成形材料。
(4)(C)硬化促進剤がトリフェニルホスフィンである上記(3)記載の封止用エポキシ樹脂成形材料。
(5)(C)硬化促進剤が第三ホスフィン化合物とキノン化合物との付加物である上記(3)記載の封止用エポキシ樹脂成形材料。
(7)(D)無機充填剤の含有量が封止用エポキシ樹脂成形材料に対して60〜95質量%である上記(6)記載の封止用エポキシ樹脂成形材料。
(8)(D)無機充填剤の含有量が封止用エポキシ樹脂成形材料に対して70〜90質量%である上記(6)又は(7)いずれか記載の封止用エポキシ樹脂成形材料。
(10)(E)カップリング剤が2級アミノ基を有するシランカップリング剤を含有する上記(9)記載の封止用エポキシ樹脂成形材料。
(11)2級アミノ基を有するシランカップリング剤が下記一般式(III)で示される化合物を含有する上記(10)記載の封止用エポキシ樹脂成形材料。
(14)(F)ケイ素含有重合物がさらに結合(e)を有する上記(13)記載の封止用エポキシ樹脂成形材料。
(15)(F)ケイ素含有重合物の軟化点が40℃以上120℃以下である上記(13)又は(14)記載の封止用エポキシ樹脂成形材料。
(16)(F)ケイ素含有重合物中のR1が置換または非置換のフェニル基及びメチル基の少なくともいずれか一方である上記(13)〜(15)のいずれかに記載の封止用エポキシ樹脂成形材料。
(17)(F)ケイ素含有重合物中の全R1における炭素数1〜12の置換または非置換のフェニル基の割合が60モル%〜100モル%である上記(13)〜(16)のいずれかに記載の封止用エポキシ樹脂成形材料。
(化6)
Mg1−XAlX(OH)2(CO3)X/2・mH2O (XXXXIX)
(0<X≦0.5、mは正の数。)
(化7)
BiOx(OH)y(NO3)z (XXXXXIX)
(0.9≦x≦1.1 0.6≦y≦0.8 0.2≦z≦0.4)
(化37)
p(M1 aOb)・q(M2 cOd)・r(M3 eOf)・mH2O (XXXXVII)
(ここで、M1、M2及びM3は互いに異なる金属元素を示し、a、b、c、d、e、f、p、q及びmは正の数、rは0又は正の数を示す。)
なかでも、上記組成式(XXXXVII)中のrが0である化合物、すなわち、下記組成式(XXXXVIII)で示される化合物がさらに好ましい。
(化38)
m(M1 aOb)・n(M2 cOd)・l(H2O) (XXXXVIII)
(ここで、M1及びM2は互いに異なる金属元素を示し、a、b、c、d、m、n及びlは正の数を示す。)
(化40)
Mg1−XAlX(OH)2(CO3)X/2・mH2O (XXXXIX)
(0<X≦0.5、mは正の数。)
(化41)
BiOx(OH)y(NO3)z (XXXXXIX)
(0.9≦x≦1.1 0.6≦y≦0.8 0.2≦z≦0.4)
(実施例1〜31、比較例1〜14)
エポキシ樹脂として、エポキシ当量180、融点105℃の上記一般式(IV)で示されるエポキシ樹脂(ジャパンエポキシレジン株式会社製商品名エピコートYL−7172、エポキシ樹脂1)、エポキシ当量273、軟化点58℃のビフェニレン型エポキシ樹脂(日本化薬株式会社製商品名NC−3000、エポキシ樹脂2)、エポキシ当量196、融点106℃のビフェニル型エポキシ樹脂(ジャパンエポキシレジン株式会社製商品名エピコートYX−4000H、エポキシ樹脂3)、エポキシ当量245、融点110℃の硫黄原子含有エポキシ樹脂(東都化成株式会社製商品名YSLV−120TE、エポキシ樹脂4)及びエポキシ当量195、軟化点65℃のo−クレゾールノボラック型エポキシ樹脂(住友化学工業株式会社製商品名ESCN−190、エポキシ樹脂5)を用意した。
攪拌棒、温度計、窒素導入管及び冷却管を備えた500mLのセパラブルフラスコに上記YL−7172(エポキシ樹脂1)を150g、上記XLC−3L(硬化剤1)を146g加え、オイルバスにて130℃に加熱し、混合した。混合物が溶融した後、30分間攪拌し、混融物をバット上に取り出して混融物1を得た。
撹拌機、還流冷却器及び温度計の付いたフラスコにフェノール94g(1モル)、37%ホルマリン水32.4g(0.4モル)を入れ、10%蓚酸を用い、pHを2に調整後、還流脱水させながら120℃まで8時間で昇温させ、次いで120℃で6時間反応させた。その後、120℃にて60mmHgの減圧下で未反応フェノール、未反応ホルムアルデヒド及び水を除去し、フェノール樹脂21.7gを得た。更にメラミン8.0g(0.064モル)、37%ホルマリン水24.3g(0.3モル)を入れ、100℃で8時間反応させて共縮重合体を得た。その後、140℃にて60mmHgの減圧下で未反応フェノール、未反応アルデヒド及び水を除去した。精製した共縮重合体の量は35.6gであった。
(1)スパイラルフロー
EMMI−1−66に準じたスパイラルフロー測定用金型を用いて、封止用エポキシ樹脂成形材料をトランスファ成形機により、金型温度180℃、成形圧力6.9MPa、硬化時間90秒の条件で成形し、流動距離(cm)を求めた。
封止用エポキシ樹脂成形材料を上記(1)の成形条件で直径50mm×厚さ3mmの円板に成形し、成形後直ちにショアD型硬度計を用いて測定した。
厚さ1/16インチの試験片を成形する金型を用いて、封止用エポキシ樹脂成形材料を上記(1)の成形条件で成形して、さらに180℃で5時間後硬化を行い、UL−94試験法に従って難燃性を評価した。
8mm×10mm×0.4mmのシリコンチップを搭載した外形寸法20mm×14mm×2mmの80ピンフラットパッケージ(QFP)(リードフレーム材質:銅合金、リード先端銀メッキ処理品)を、封止用エポキシ樹脂成形材料を用いて上記(3)の条件で成形、後硬化して作製し、85℃、85%RHの条件で加湿して所定時間毎に240℃、10秒の条件でリフロー処理を行い、クラックの有無を観察し、試験パッケージ数(5個)に対するクラック発生パッケージ数で評価した。
5μm厚の酸化膜上に線幅10μm、厚さ1μmのアルミ配線を施した6mm×6mm×0.4mmのテスト用シリコンチップを搭載した外形寸法20mm×14mm×2.7mmの80ピンフラットパッケージ(QFP)を、封止用エポキシ樹脂成形材料を用いて上記(3)の条件で成形、後硬化して作製し、前処理を行った後、加湿して所定時間毎にアルミ配線腐食による断線不良を調べ、試験パッケージ数(10個)に対する不良パッケージ数で評価した。
なお、前処理は85℃、85%RH、72時間の条件でフラットパッケージを加湿後、215℃、90秒間のベーパーフェーズリフロー処理を行った。その後の加湿は0.2MPa、121℃の条件で行った。
5μm厚の酸化膜上に線幅10μm、厚さ1μmのアルミ配線を施した5mm×9mm×0.4mmのテスト用シリコンチップを、部分銀メッキを施した42アロイのリードフレーム上に銀ペーストを用いて搭載し、サーモニック型ワイヤボンダにより、200℃でチップのボンディングパッドとインナリードをAu線にて接続した16ピン型DIP(Dual Inline Package)を、封止用エポキシ樹脂成形材料を用いて上記(3)の条件で成形、後硬化して作製して、200℃の高温槽中に保管し、所定時間毎に取り出して導通試験を行い、試験パッケージ数(10個)に対する導通不良パッケージ数で、高温放置特性を評価した。
長さ127mm×厚さ6.4mm×幅12.7mmの板状に成形できる試験片作成用金型を使用し、本金型を180℃に加熱した。金型が180℃になった事を確認した後、金型みぞの長さ方向の左右端の寸法をノギスにより0.01mmまで正確に測り記録した。この金型により、試験片を上記(1)成形条件にて成形後直ちに取り出し、室温まで自然冷却した。その後、試験片の長さ方向の左右端の寸法をノギスにより0.01mmまで正確に測り記録し、次の式によって、成形収縮率を算出した。
成形収縮率(%)=100×((D1−d1)/D1+(D2−d2)/D2)/2
(ここで、d1及びd2は試験片の長さ方向の左右端の長さ(mm)、D1及びD2は180℃で測定したd1及びd2に対応する金型のみぞの長さ(mm))
・一括モールド型(MAP型)BGAの作製
縦60mm×横90mm×厚さ0.4mmの絶縁ベース基材(ガラス布−エポキシ樹脂積層板、日立化成工業株式会社製、商品名E−679)に、ダイボンドフィルム(日立化成工業株式会社製商品名DF−400)を裏面に貼付した、チップサイズ8.0mm×8.0mm×0.3mm厚(面積64mm2)、パッドピッチ80μmの半導体チップを縦に4個、横に6個、計24個を配置し、圧着温度200℃、荷重1.96N、圧着時間10秒の条件で圧着し、さらに180℃で1時間ベークを行った後、直径30μm、長さ2mmの金ワイヤでワイヤボンディングし、次に封止用エポキシ樹脂成形材料を用いて、半導体チップ搭載面を縦53mm×横83mm×厚さ0.8mmの寸法に上記(1)条件でトランスファ成形し、パッケージ厚1.2mmの半導体装置(一括モールド型(MAP型)BGA)を作製した。
ソフトX線測定装置(ソフテックス社製PRO−TEST 100型)を用いて、電圧100kV、電流1.5mAの条件で、半導体装置の透視観察を行ってワイヤ変形量を求め、ワイヤ流れを評価した。観察はチップ面に対し垂直方向から行い、ワイヤボンディングの最短距離L及びワイヤの最大変位量Xを測定し、X/L×100をワイヤ変形量(%)とした。
上記(8)で作製したのと同型のMAP型BGAを、上記(3)の条件で封止用エポキシ樹脂成形材料を用いて成形した後、非接触形状測定機(ソニー・プレシジョン・テクノロジー株式会社製YP10−10G1(J1))を用いて、パッケージ端部と最大変形部との差(mm)を測定し、反り性を評価した。
Claims (17)
- (A)エポキシ樹脂、(B)硬化剤、及び(F)下記の結合(c)及び(d)を有し、末端がR1、水酸基及びアルコキシ基から選ばれた官能基であり、エポキシ当量が500〜4000であるケイ素含有重合物を含有し、(A)エポキシ樹脂が下記一般式(I)で示される化合物を含有する封止用エポキシ樹脂成形材料。
(ここで、R1は炭素数1〜12の置換または非置換の1価の炭化水素基から選ばれ、ケイ素含有重合物中の全R1はすべてが同一でも異なっていてもよく、但し全R 1 の60モル%以上がフェニル基である。Xはエポキシ基を含む1価の有機基を示す。)
(一般式(I)中のR1は、置換又は非置換の炭素数1〜12の炭化水素基及び置換又は非置換の炭素数1〜12のアルコキシ基から選ばれ、全てが同一でも異なっていてもよい。nは0〜4の整数を示す。またR2は、置換又は非置換の炭素数1〜12の炭化水素基及び置換又は非置換の炭素数1〜12のアルコキシ基から選ばれ、全てが同一でも異なっていてもよい。mは0〜6の整数を示す。) - さらに(C)硬化促進剤を含有する請求項1又は2いずれか記載の封止用エポキシ樹脂成形材料。
- (C)硬化促進剤がトリフェニルホスフィンである請求項3記載の封止用エポキシ樹脂成形材料。
- (C)硬化促進剤が第三ホスフィン化合物とキノン化合物との付加物である請求項3記載の封止用エポキシ樹脂成形材料。
- さらに(D)無機充填剤を含有する請求項1〜5いずれか記載の封止用エポキシ樹脂成形材料。
- (D)無機充填剤の含有量が封止用エポキシ樹脂成形材料に対して60〜95質量%である請求項6記載の封止用エポキシ樹脂成形材料。
- (D)無機充填剤の含有量が封止用エポキシ樹脂成形材料に対して70〜90質量%である請求項6又は7いずれか記載の封止用エポキシ樹脂成形材料。
- さらに(E)カップリング剤を含有する請求項1〜8いずれか記載の封止用エポキシ樹脂成形材料。
- (E)カップリング剤が2級アミノ基を有するシランカップリング剤を含有する請求項9記載の封止用エポキシ樹脂成形材料。
- (A)エポキシ樹脂、(B)硬化剤を予め溶融混合する請求項1〜11いずれか記載の封止用エポキシ樹脂成形材料。
- (F)ケイ素含有重合物の軟化点が40℃以上120℃以下である請求項1〜13のいずれか記載の封止用エポキシ樹脂成形材料。
- (F)ケイ素含有重合物中のR1が置換または非置換のフェニル基及びメチル基の少なくとも一方である請求項1〜14のいずれか記載の封止用エポキシ樹脂成形材料。
- さらに下記組成式(XXXXIX)で表される化合物(G)及び(XXXXXIX)で表される化合物(H)の少なくとも一方を含有する請求項1〜15のいずれか記載の封止用エポキシ樹脂成形材料。
(化6)
Mg1−XAlX(OH)2(CO3)X/2・mH2O (XXXXIX)
(0<X≦0.5、mは正の数。)
(化7)
BiOx(OH)y(NO3)z (XXXXXIX)
(0.9≦x≦1.1 0.6≦y≦0.8 0.2≦z≦0.4) - 請求項1〜16のいずれか記載の封止用エポキシ樹脂成形材料で封止された素子を備えた電子部品装置。
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Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4973177B2 (ja) * | 2006-01-20 | 2012-07-11 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物及び半導体装置 |
JP5205907B2 (ja) * | 2006-10-12 | 2013-06-05 | 日立化成株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
KR100833567B1 (ko) * | 2006-12-15 | 2008-05-30 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한반도체소자 |
JP5347223B2 (ja) * | 2007-02-08 | 2013-11-20 | 日立化成株式会社 | 電子素子封止用樹脂被覆無機粉末組成物およびそれを用いて得られる電子素子封止用タブレット、並びに電子素子装置 |
US7982137B2 (en) * | 2007-06-27 | 2011-07-19 | Hamilton Sundstrand Corporation | Circuit board with an attached die and intermediate interposer |
JP5080881B2 (ja) * | 2007-06-27 | 2012-11-21 | ナミックス株式会社 | 発光ダイオードチップの封止体の製造方法 |
JP2009105276A (ja) * | 2007-10-24 | 2009-05-14 | Omron Corp | 半導体チップの実装方法及び半導体搭載用配線基板 |
JP2010031233A (ja) * | 2008-06-25 | 2010-02-12 | Panasonic Electric Works Co Ltd | 半導体封止用エポキシ樹脂組成物、及び該組成物を用いて半導体素子を封止して得られる片面封止型半導体装置 |
WO2011052157A1 (ja) * | 2009-10-26 | 2011-05-05 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物およびこれを用いた半導体装置 |
WO2011125624A1 (ja) * | 2010-03-31 | 2011-10-13 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
BR112012026240B1 (pt) | 2010-04-16 | 2021-08-03 | Swimc Llc | Artigo, método, e, composição de revestimento |
JP2013525550A (ja) * | 2010-04-30 | 2013-06-20 | ダウ グローバル テクノロジーズ エルエルシー | エポキシ樹脂用の潜在性触媒としてのホスファゼンブロックドアゾール化合物 |
WO2011148627A1 (ja) * | 2010-05-28 | 2011-12-01 | 住友ベークライト株式会社 | エステル化物の製造方法 |
JP5491295B2 (ja) * | 2010-06-25 | 2014-05-14 | パナソニック株式会社 | 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置 |
JP2012036240A (ja) * | 2010-08-04 | 2012-02-23 | Three M Innovative Properties Co | 封止用樹脂組成物 |
JP2012111844A (ja) * | 2010-11-24 | 2012-06-14 | Panasonic Corp | 封止用エポキシ樹脂組成物及びこれを用いて封止した半導体装置 |
CN102540306B (zh) | 2010-12-31 | 2015-03-25 | 北京京东方光电科技有限公司 | 光栅片、液晶显示装置及光栅片、液晶面板的制造方法 |
EP3425011B1 (en) | 2011-02-07 | 2021-01-06 | Swimc Llc | Coating compositions for containers and other articles and methods of coating |
WO2012157529A1 (ja) * | 2011-05-13 | 2012-11-22 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2012241177A (ja) * | 2011-05-24 | 2012-12-10 | Panasonic Corp | 圧縮成形用エポキシ樹脂組成物と半導体装置 |
EP2826777B1 (en) | 2012-03-14 | 2020-08-05 | Korea Institute of Industrial Technology | Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group |
CN102675601B (zh) * | 2012-05-17 | 2014-06-25 | 江苏华海诚科新材料有限公司 | 用于qfn的低翘曲环氧树脂组合物 |
EP2882658B1 (en) | 2012-08-09 | 2021-09-08 | Swimc Llc | Container coating system |
WO2014025997A1 (en) | 2012-08-09 | 2014-02-13 | Valspar Sourcing, Inc. | Compositions for containers and other articles and methods of using same |
EP3131965B1 (en) | 2014-04-14 | 2024-06-12 | Swimc Llc | Methods of preparing compositions for containers and other articles and methods of using same |
CN107531885B (zh) * | 2015-04-28 | 2020-01-10 | Tdk株式会社 | 树脂组合物、树脂片、树脂固化物和树脂基板 |
TWI614275B (zh) | 2015-11-03 | 2018-02-11 | Valspar Sourcing Inc | 用於製備聚合物的液體環氧樹脂組合物 |
JP6267261B2 (ja) * | 2016-03-30 | 2018-01-24 | 旭化成株式会社 | 熱硬化性樹脂組成物 |
CN106244069B (zh) * | 2016-08-23 | 2020-08-07 | 宜兴市普利泰电子材料有限公司 | 一种汽车电容用环氧树脂胶粘剂及其制备方法 |
KR102232340B1 (ko) | 2019-11-15 | 2021-03-26 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체 |
WO2023238951A1 (ja) * | 2022-06-10 | 2023-12-14 | 株式会社レゾナック | 成形用樹脂組成物及び電子部品装置 |
CN115232589B (zh) * | 2022-08-05 | 2023-05-02 | 东莞市德聚胶接技术有限公司 | 一种耐高低温单组分半导体用导电胶及其制备方法 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54122263A (en) * | 1978-03-13 | 1979-09-21 | Kawasaki Kasei Chem Ltd | Preparation of 1,4-dihydro-9,10-dihydroxyanthracene |
JPH03115424A (ja) * | 1989-09-29 | 1991-05-16 | Toshiba Corp | エポキシ樹脂組成物、その製造方法および樹脂封止型半導体装置 |
JPH05283560A (ja) * | 1991-10-04 | 1993-10-29 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JPH06107758A (ja) * | 1992-09-30 | 1994-04-19 | Nitto Denko Corp | ノボラック体、エポキシ樹脂およびそれを用いた半導体封止用エポキシ樹脂組成物ならびに半導体装置 |
JPH06128362A (ja) * | 1992-10-15 | 1994-05-10 | Nitto Denko Corp | 封止剤用化合物およびそれを用いた半導体封止用エポキシ樹脂組成物ならびに半導体装置 |
JPH0782343A (ja) | 1993-07-19 | 1995-03-28 | Toray Ind Inc | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP3288185B2 (ja) * | 1994-10-07 | 2002-06-04 | 日立化成工業株式会社 | 電子部品封止用エポキシ樹脂成形材料及びそれを用いた半導体装置 |
JP3821870B2 (ja) | 1994-10-07 | 2006-09-13 | スリーエム カンパニー | 難燃性熱硬化性樹脂組成物 |
JPH09100337A (ja) | 1995-10-04 | 1997-04-15 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物及びこれを用いた半導体装置 |
JPH09227765A (ja) | 1995-12-22 | 1997-09-02 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物 |
JPH09235449A (ja) | 1995-12-28 | 1997-09-09 | Toray Ind Inc | エポキシ樹脂組成物 |
JPH09216933A (ja) * | 1996-02-07 | 1997-08-19 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
JPH09241483A (ja) | 1996-03-13 | 1997-09-16 | Toray Ind Inc | エポキシ樹脂組成物 |
JP3527369B2 (ja) * | 1996-09-04 | 2004-05-17 | 東レ・ダウコーニング・シリコーン株式会社 | 電気部品およびその製造方法 |
JP3206449B2 (ja) * | 1996-09-20 | 2001-09-10 | 株式会社日立製作所 | 樹脂封止型半導体装置 |
JPH10114815A (ja) | 1996-10-11 | 1998-05-06 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
JPH10310629A (ja) | 1997-05-09 | 1998-11-24 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
JPH11140277A (ja) | 1997-11-10 | 1999-05-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びこれを用いた半導体装置 |
JPH11158353A (ja) | 1997-11-25 | 1999-06-15 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
JP3295643B2 (ja) * | 1998-03-19 | 2002-06-24 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JPH11269349A (ja) | 1998-03-23 | 1999-10-05 | Hitachi Chem Co Ltd | 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
JP3511136B2 (ja) * | 2000-09-25 | 2004-03-29 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び半導体装置 |
JP4172177B2 (ja) * | 2001-05-09 | 2008-10-29 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2002363251A (ja) * | 2001-05-31 | 2002-12-18 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP2003064242A (ja) * | 2001-08-28 | 2003-03-05 | Sumitomo Bakelite Co Ltd | 難燃性エポキシ樹脂組成物、半導体封止材料及び半導体装置 |
JP2003192876A (ja) * | 2001-12-27 | 2003-07-09 | Nitto Denko Corp | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
JP2003321533A (ja) * | 2002-02-27 | 2003-11-14 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP3870825B2 (ja) * | 2002-02-27 | 2007-01-24 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
AU2003202139A1 (en) * | 2002-02-27 | 2003-09-09 | Hitachi Chemical Co., Ltd. | Encapsulating epoxy resin composition, and electronic parts device using the same |
JP2003327791A (ja) * | 2002-05-16 | 2003-11-19 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP4206701B2 (ja) * | 2002-07-12 | 2009-01-14 | 日立化成工業株式会社 | エポキシ樹脂組成物及び電子部品装置 |
JP4329426B2 (ja) * | 2003-06-24 | 2009-09-09 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP4237600B2 (ja) | 2003-10-10 | 2009-03-11 | ジャパンエポキシレジン株式会社 | 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置 |
SG110189A1 (en) * | 2003-09-26 | 2005-04-28 | Japan Epoxy Resins Co Ltd | Epoxy compound, preparation method thereof, and use thereof |
JP4354242B2 (ja) * | 2003-09-26 | 2009-10-28 | ジャパンエポキシレジン株式会社 | 新規結晶性エポキシ樹脂、硬化性エポキシ樹脂組成物およびその硬化体 |
KR100840065B1 (ko) * | 2004-07-13 | 2008-06-19 | 히다치 가세고교 가부시끼가이샤 | 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치 |
KR100846547B1 (ko) * | 2004-07-13 | 2008-07-15 | 히다치 가세고교 가부시끼가이샤 | 밀봉용 에폭시 수지 성형 재료 및 전자 부품 장치 |
US7217102B2 (en) * | 2005-06-30 | 2007-05-15 | General Electric Campany | Countering laser shock peening induced airfoil twist using shot peening |
JP2007009831A (ja) * | 2005-07-01 | 2007-01-18 | Matsushita Electric Ind Co Ltd | インペラ及びそれを備えた送風ファン |
KR101413822B1 (ko) * | 2005-07-13 | 2014-07-01 | 히타치가세이가부시끼가이샤 | 밀봉용 에폭시 수지 조성물 및 전자 부품 장치 |
JP5400267B2 (ja) * | 2005-12-13 | 2014-01-29 | 日立化成株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
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2005
- 2005-03-03 US US10/598,515 patent/US7846998B2/en not_active Expired - Fee Related
- 2005-03-03 WO PCT/JP2005/003592 patent/WO2005085316A1/ja active Application Filing
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- 2005-03-03 KR KR1020067020334A patent/KR100870809B1/ko active IP Right Grant
- 2005-03-03 CN CNB2005800043985A patent/CN100523046C/zh not_active Expired - Fee Related
- 2005-03-03 JP JP2006510715A patent/JPWO2005085316A1/ja not_active Withdrawn
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US20080234409A1 (en) | 2008-09-25 |
CN1918207A (zh) | 2007-02-21 |
KR20060129517A (ko) | 2006-12-15 |
US7846998B2 (en) | 2010-12-07 |
JP2011144385A (ja) | 2011-07-28 |
TW200602374A (en) | 2006-01-16 |
JPWO2005085316A1 (ja) | 2007-08-09 |
KR100870809B1 (ko) | 2008-11-27 |
CN100523046C (zh) | 2009-08-05 |
WO2005085316A1 (ja) | 2005-09-15 |
TWI381003B (zh) | 2013-01-01 |
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