JP5416711B2 - メタルラップスルーと改良されたパッシベーションを有する光電池 - Google Patents
メタルラップスルーと改良されたパッシベーションを有する光電池 Download PDFInfo
- Publication number
- JP5416711B2 JP5416711B2 JP2010536432A JP2010536432A JP5416711B2 JP 5416711 B2 JP5416711 B2 JP 5416711B2 JP 2010536432 A JP2010536432 A JP 2010536432A JP 2010536432 A JP2010536432 A JP 2010536432A JP 5416711 B2 JP5416711 B2 JP 5416711B2
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- layer
- semiconductor layer
- oxide
- dielectric
- dielectric layer
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- Expired - Fee Related
Links
- 238000002161 passivation Methods 0.000 title claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 title description 23
- 239000002184 metal Substances 0.000 title description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims description 60
- 238000009792 diffusion process Methods 0.000 claims description 37
- 238000000151 deposition Methods 0.000 claims description 32
- 238000010304 firing Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 claims description 10
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 5
- 229910002056 binary alloy Inorganic materials 0.000 claims description 3
- 238000011049 filling Methods 0.000 claims description 2
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 claims 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 40
- 238000005215 recombination Methods 0.000 abstract description 7
- 230000006798 recombination Effects 0.000 abstract description 7
- 230000000873 masking effect Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 166
- 210000004027 cell Anatomy 0.000 description 55
- 230000008569 process Effects 0.000 description 42
- 230000008021 deposition Effects 0.000 description 24
- 229910052710 silicon Inorganic materials 0.000 description 22
- 239000010703 silicon Substances 0.000 description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 17
- 229910004205 SiNX Inorganic materials 0.000 description 16
- 229910052581 Si3N4 Inorganic materials 0.000 description 15
- 230000036961 partial effect Effects 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- 238000001465 metallisation Methods 0.000 description 9
- 230000006378 damage Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000005553 drilling Methods 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000010344 co-firing Methods 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-OUBTZVSYSA-N silicon-29 atom Chemical compound [29Si] XUIMIQQOPSSXEZ-OUBTZVSYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000009279 wet oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/219—Arrangements for electrodes of back-contact photovoltaic cells
- H10F77/223—Arrangements for electrodes of back-contact photovoltaic cells for metallisation wrap-through [MWT] photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/219—Arrangements for electrodes of back-contact photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Photovoltaic Devices (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07122152A EP2068369A1 (en) | 2007-12-03 | 2007-12-03 | Photovoltaic cells having metal wrap through and improved passivation |
| EP07122152.7 | 2007-12-03 | ||
| US99229807P | 2007-12-04 | 2007-12-04 | |
| US60/992,298 | 2007-12-04 | ||
| PCT/EP2008/066662 WO2009071561A2 (en) | 2007-12-03 | 2008-12-02 | Photovoltaic cells having metal wrap through and improved passivation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011505704A JP2011505704A (ja) | 2011-02-24 |
| JP2011505704A5 JP2011505704A5 (enExample) | 2011-07-28 |
| JP5416711B2 true JP5416711B2 (ja) | 2014-02-12 |
Family
ID=39683568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010536432A Expired - Fee Related JP5416711B2 (ja) | 2007-12-03 | 2008-12-02 | メタルラップスルーと改良されたパッシベーションを有する光電池 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9246044B2 (enExample) |
| EP (2) | EP2068369A1 (enExample) |
| JP (1) | JP5416711B2 (enExample) |
| CN (1) | CN101889349A (enExample) |
| AT (1) | ATE511215T1 (enExample) |
| ES (1) | ES2365679T5 (enExample) |
| WO (1) | WO2009071561A2 (enExample) |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8481357B2 (en) | 2008-03-08 | 2013-07-09 | Crystal Solar Incorporated | Thin film solar cell with ceramic handling layer |
| KR101573934B1 (ko) * | 2009-03-02 | 2015-12-11 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
| KR101627217B1 (ko) * | 2009-03-25 | 2016-06-03 | 엘지전자 주식회사 | 태양전지 및 그 제조방법 |
| KR100984700B1 (ko) | 2009-06-04 | 2010-10-01 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
| KR100990110B1 (ko) * | 2009-08-18 | 2010-10-29 | 엘지전자 주식회사 | 태양 전지 |
| DE102009029373A1 (de) * | 2009-09-11 | 2011-04-07 | Carl Zeiss Smt Gmbh | Beschichtungsverfahren für die Mikrolithographie |
| DE102009029374A1 (de) * | 2009-09-11 | 2011-04-07 | Carl Zeiss Smt Gmbh | Beschichtungsverfahren für die Mikrolithographie |
| US20110083735A1 (en) * | 2009-10-13 | 2011-04-14 | Ips Ltd. | Solar cell and method of fabricating the same |
| CN102576764A (zh) * | 2009-10-15 | 2012-07-11 | Lg伊诺特有限公司 | 太阳能电池设备及其制造方法 |
| KR101146734B1 (ko) * | 2009-10-26 | 2012-05-17 | 엘지전자 주식회사 | 태양 전지 셀 및 이를 구비한 태양 전지 모듈 |
| US8115097B2 (en) * | 2009-11-19 | 2012-02-14 | International Business Machines Corporation | Grid-line-free contact for a photovoltaic cell |
| CN102640231A (zh) * | 2009-11-25 | 2012-08-15 | E·I·内穆尔杜邦公司 | 用于形成钝化发射极的银背面电极以及形成背面接触硅太阳能电池的方法 |
| DE102010025983A1 (de) * | 2010-03-03 | 2011-09-08 | Centrotherm Photovoltaics Ag | Solarzelle mit dielektrischer Rückseitenverspiegelung und Verfahren zu deren Herstellung |
| DE102010028187A1 (de) * | 2010-04-26 | 2011-10-27 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Metal-Wrap-Through-Solarzelle sowie eine nach diesem Verfahren hergestellte Metal-Wrap-Through-Solarzelle |
| KR101125435B1 (ko) | 2010-05-07 | 2012-03-27 | 현대중공업 주식회사 | Mwt형 태양전지 |
| NL2004698C2 (en) * | 2010-05-11 | 2011-11-15 | Stichting Energie | Solar cell and method of manufacturing such a solar cell. |
| KR101823709B1 (ko) * | 2010-05-11 | 2018-02-01 | 쉬티흐틴크 에네르지온데르조크 센트룸 네델란드 | 태양전지 및 그 태양전지의 제조방법 |
| WO2011145731A1 (ja) * | 2010-05-20 | 2011-11-24 | 京セラ株式会社 | 太陽電池素子およびその製造方法ならびに太陽電池モジュール |
| DE102010026960A1 (de) * | 2010-07-12 | 2012-01-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Photovoltaische Solarzelle und Verfahren zur Herstellung einer photovoltaischen Solarzelle |
| US8883552B2 (en) | 2010-08-11 | 2014-11-11 | Crystal Solar Inc. | MWT architecture for thin SI solar cells |
| NL2005261C2 (en) * | 2010-08-24 | 2012-02-27 | Solland Solar Cells B V | Back contacted photovoltaic cell with an improved shunt resistance. |
| EP2423981B1 (en) * | 2010-08-27 | 2018-11-28 | LG Electronics Inc. | Method of manufacturing solar cell electrodes by paste firing |
| JP5496354B2 (ja) * | 2010-10-05 | 2014-05-21 | 三菱電機株式会社 | 光起電力装置およびその製造方法 |
| WO2012051626A2 (en) * | 2010-10-15 | 2012-04-19 | Nanosolar, Inc. | Solar cell architecture having a plurality of vias with shaped foil via interior |
| DE112010005950T5 (de) * | 2010-10-20 | 2013-08-14 | Mitsubishi Electric Corporation | Photovoltaikvorrichtung und Herstellungsverfahren für diese |
| DE102010060303A1 (de) | 2010-11-02 | 2012-05-03 | Solarworld Innovations Gmbh | Verfahren zum Herstellen einer Solarzelle |
| CN102468365B (zh) * | 2010-11-18 | 2014-07-16 | 台湾茂矽电子股份有限公司 | 双面太阳能电池的制造方法 |
| IT1403828B1 (it) | 2010-12-02 | 2013-10-31 | Applied Materials Italia Srl | Procedimento per la stampa di un substrato |
| KR101699310B1 (ko) * | 2010-12-17 | 2017-02-13 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
| DE102011010077A1 (de) * | 2011-02-01 | 2012-08-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Photovoltaische Solarzelle sowie Verfahren zu deren Herstellung |
| NL2006160C2 (en) * | 2011-02-08 | 2012-08-09 | Tsc Solar B V | A method of manufacturing a solar cell and a solar cell. |
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| WO2012129184A1 (en) | 2011-03-18 | 2012-09-27 | Crystal Solar, Inc. | Insitu epitaxial deposition of front and back junctions in single crystal silicon solar cells |
| CN103430319B (zh) * | 2011-03-31 | 2016-01-20 | 京瓷株式会社 | 太阳能电池元件及太阳能电池模块 |
| CN102157576A (zh) * | 2011-03-31 | 2011-08-17 | 镇江大全太阳能有限公司 | 高效晶体硅太阳能电池结构及其制造方法 |
| CN202196801U (zh) * | 2011-05-27 | 2012-04-18 | 苏州阿特斯阳光电力科技有限公司 | 光电转换装置 |
| US9153713B2 (en) | 2011-04-02 | 2015-10-06 | Csi Cells Co., Ltd | Solar cell modules and methods of manufacturing the same |
| CN102800742B (zh) * | 2011-05-27 | 2016-04-13 | 苏州阿特斯阳光电力科技有限公司 | 背接触晶体硅太阳能电池片制造方法 |
| CN202196784U (zh) * | 2011-05-27 | 2012-04-18 | 苏州阿特斯阳光电力科技有限公司 | 光电转换装置 |
| KR101563412B1 (ko) * | 2011-04-04 | 2015-10-26 | 미쓰비시덴키 가부시키가이샤 | 태양전지 및 그 제조 방법, 태양전지 모듈 |
| DE112012001787A5 (de) | 2011-04-19 | 2014-01-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer Solarzelle |
| CN102201460A (zh) * | 2011-05-09 | 2011-09-28 | 马鞍山优异光伏有限公司 | 一种新型的晶体硅太阳能电池及其制备方法 |
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| US9281435B2 (en) | 2011-05-27 | 2016-03-08 | Csi Cells Co., Ltd | Light to current converter devices and methods of manufacturing the same |
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| CN102386249B (zh) * | 2011-10-31 | 2013-08-14 | 北京吉阳技术股份有限公司 | 一种下一代结构高效率晶体硅电池及制作方法 |
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| AU2012362505B2 (en) * | 2011-12-26 | 2015-08-20 | Solexel, Inc. | Systems and methods for enhanced light trapping in solar cells |
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| US9246044B2 (en) | 2016-01-26 |
| US20110005582A1 (en) | 2011-01-13 |
| EP2068369A1 (en) | 2009-06-10 |
| ES2365679T3 (es) | 2011-10-10 |
| CN101889349A (zh) | 2010-11-17 |
| WO2009071561A3 (en) | 2009-12-10 |
| EP2215663A2 (en) | 2010-08-11 |
| ATE511215T1 (de) | 2011-06-15 |
| ES2365679T5 (es) | 2017-02-24 |
| EP2215663B1 (en) | 2011-05-25 |
| WO2009071561A2 (en) | 2009-06-11 |
| JP2011505704A (ja) | 2011-02-24 |
| EP2215663B2 (en) | 2016-08-17 |
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