JP5416492B2 - レーザ光によるガラス基板加工装置 - Google Patents

レーザ光によるガラス基板加工装置 Download PDF

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Publication number
JP5416492B2
JP5416492B2 JP2009154578A JP2009154578A JP5416492B2 JP 5416492 B2 JP5416492 B2 JP 5416492B2 JP 2009154578 A JP2009154578 A JP 2009154578A JP 2009154578 A JP2009154578 A JP 2009154578A JP 5416492 B2 JP5416492 B2 JP 5416492B2
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Japan
Prior art keywords
glass substrate
laser beam
condensing
laser light
processing apparatus
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JP2009154578A
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English (en)
Japanese (ja)
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JP2011011212A5 (enExample
JP2011011212A (ja
Inventor
政二 清水
一星 熊谷
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2009154578A priority Critical patent/JP5416492B2/ja
Priority to TW099120760A priority patent/TWI395630B/zh
Priority to KR1020100061831A priority patent/KR101226200B1/ko
Priority to EP10167689.8A priority patent/EP2275223B1/en
Priority to US12/827,267 priority patent/US8448471B2/en
Priority to CN2010102211704A priority patent/CN101935156A/zh
Publication of JP2011011212A publication Critical patent/JP2011011212A/ja
Publication of JP2011011212A5 publication Critical patent/JP2011011212A5/ja
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  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
JP2009154578A 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置 Expired - Fee Related JP5416492B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009154578A JP5416492B2 (ja) 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置
TW099120760A TWI395630B (zh) 2009-06-30 2010-06-25 使用雷射光之玻璃基板加工裝置
EP10167689.8A EP2275223B1 (en) 2009-06-30 2010-06-29 Glass substrate processing device using laser beam with rotation of multi-spot focused beams
KR1020100061831A KR101226200B1 (ko) 2009-06-30 2010-06-29 레이저광에 의한 유리 기판 가공 장치
US12/827,267 US8448471B2 (en) 2009-06-30 2010-06-30 Glass substrate processing device using laser beam
CN2010102211704A CN101935156A (zh) 2009-06-30 2010-06-30 利用激光的玻璃基板加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009154578A JP5416492B2 (ja) 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置

Publications (3)

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JP2011011212A JP2011011212A (ja) 2011-01-20
JP2011011212A5 JP2011011212A5 (enExample) 2012-03-22
JP5416492B2 true JP5416492B2 (ja) 2014-02-12

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JP2009154578A Expired - Fee Related JP5416492B2 (ja) 2009-06-30 2009-06-30 レーザ光によるガラス基板加工装置

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EP2478990B1 (de) * 2011-01-21 2019-04-17 Leister Technologies AG Verfahren zum Einstellen eines Laserlichtspots zur Laserbearbeitung von Werkstücken sowie Laseranordnung zur Durchführung des Verfahrens
CN102218605A (zh) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 激光旋切钻孔装置
JP5409711B2 (ja) * 2011-06-29 2014-02-05 三星ダイヤモンド工業株式会社 レーザ光によるワーク加工装置
JP5824916B2 (ja) * 2011-06-30 2015-12-02 株式会社レーザックス レーザ加工機
KR101291381B1 (ko) 2011-10-10 2013-08-07 김장주 레이저 드릴링을 이용한 기판의 제조 장치
JP5922906B2 (ja) * 2011-10-18 2016-05-24 三星ダイヤモンド工業株式会社 レーザビームによるガラス基板加工装置
JP2013107124A (ja) * 2011-11-24 2013-06-06 Mitsuboshi Diamond Industrial Co Ltd レーザ加工方法及びレーザ加工装置
JP5189684B1 (ja) 2012-03-07 2013-04-24 三菱重工業株式会社 加工装置、加工ユニット及び加工方法
JP5574354B2 (ja) * 2012-03-09 2014-08-20 株式会社トヨコー 塗膜除去方法及びレーザー塗膜除去装置
JP5983933B2 (ja) * 2012-10-12 2016-09-06 株式会社トヨコー 塗膜除去方法及びレーザー照射装置
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
JP5496375B2 (ja) * 2013-01-23 2014-05-21 三菱重工業株式会社 加工装置、加工ユニット及び加工方法
JP5364856B1 (ja) 2013-02-27 2013-12-11 三菱重工業株式会社 加工装置、加工方法
EP2781296B1 (de) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
WO2015129249A1 (ja) 2014-02-25 2015-09-03 パナソニックＩｐマネジメント株式会社 レーザ加工ヘッドおよびレーザ加工システム
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
CN104325211B (zh) * 2014-10-14 2016-08-24 陈卡丹 一种制鞋用焊接机
US10047001B2 (en) * 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3274306B1 (en) 2015-03-24 2021-04-14 Corning Incorporated Laser cutting and processing of display glass compositions
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
US11008244B2 (en) 2015-11-25 2021-05-18 Corning Incorporated Methods of separating a glass web
JP2017109226A (ja) * 2015-12-17 2017-06-22 三星ダイヤモンド工業株式会社 レーザ加工装置及びレーザ加工方法
JP6030747B2 (ja) * 2015-12-25 2016-11-24 三星ダイヤモンド工業株式会社 レーザビームによるガラス基板加工装置
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
JP6923284B2 (ja) 2016-09-30 2021-08-18 コーニング インコーポレイテッド 非軸対称ビームスポットを用いて透明被加工物をレーザ加工するための装置及び方法
CN110167891A (zh) 2016-10-24 2019-08-23 康宁股份有限公司 用于对片状玻璃基材进行基于激光的机械加工的基材处理工位
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
JP7041543B2 (ja) * 2018-02-16 2022-03-24 株式会社トヨコー レーザ加工方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
WO2020062301A1 (zh) 2018-09-30 2020-04-02 深圳市大疆创新科技有限公司 距离探测装置
CN112789542A (zh) * 2018-09-30 2021-05-11 深圳市大疆创新科技有限公司 具有束压缩和扩展的光学扫描装置
CN109365414A (zh) * 2018-11-29 2019-02-22 华核（天津）新技术开发有限公司 直线轨迹型同步异向双楔形棱镜式激光清洗头及清洗方法
CN109365413A (zh) * 2018-11-29 2019-02-22 华核（天津）新技术开发有限公司 基于圆楔形棱镜旋转的激光清洗头及使用方法
KR102636043B1 (ko) * 2019-01-21 2024-02-14 삼성디스플레이 주식회사 레이저 에칭 장치와 그것을 이용한 레이저 에칭 방법
CN112358199B (zh) * 2020-09-30 2022-12-23 浙江圣石激光科技股份有限公司 一种弧面玻璃的除膜方法
CN113231739B (zh) * 2021-07-13 2021-09-28 岗春激光科技（江苏）有限公司 一种镜头组件及激光焊接头

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JPH0857585A (ja) * 1994-08-18 1996-03-05 Nippon Steel Corp エッジシーム疵の少ないステンレス鋳片の製造方法
JP2000197982A (ja) * 1998-12-28 2000-07-18 Nippei Toyama Corp レ―ザ溶接方法及び溶接装置
JP2001259878A (ja) * 2000-03-15 2001-09-25 Hitachi Ltd レーザ加工装置
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
JP2003305585A (ja) * 2001-09-11 2003-10-28 Seiko Epson Corp レーザー加工方法および加工装置
JP2004268144A (ja) * 2003-02-21 2004-09-30 Seishin Shoji Kk レーザ加工装置
US7321114B2 (en) * 2005-03-10 2008-01-22 Hitachi Via Mechanics, Ltd. Apparatus and method for beam drift compensation
JP4645892B2 (ja) * 2005-03-29 2011-03-09 アイシン精機株式会社 レーザ加工装置及び方法
JP2007118054A (ja) * 2005-10-28 2007-05-17 Aisin Seiki Co Ltd レーザ加工方法及びレーザ加工装置
JP2007253203A (ja) * 2006-03-24 2007-10-04 Sumitomo Electric Ind Ltd レーザ加工用光学装置
JP2008087000A (ja) * 2006-09-29 2008-04-17 Mitsubishi Electric Corp レーザ加工装置

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