JP5401203B2 - 半導体受光装置及びその製造方法 - Google Patents
半導体受光装置及びその製造方法 Download PDFInfo
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- JP5401203B2 JP5401203B2 JP2009184003A JP2009184003A JP5401203B2 JP 5401203 B2 JP5401203 B2 JP 5401203B2 JP 2009184003 A JP2009184003 A JP 2009184003A JP 2009184003 A JP2009184003 A JP 2009184003A JP 5401203 B2 JP5401203 B2 JP 5401203B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02502—Layer structure consisting of two layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/221—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/28—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices being characterised by field-effect operation, e.g. junction field-effect phototransistors
- H10F30/285—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices being characterised by field-effect operation, e.g. junction field-effect phototransistors the devices having PN homojunction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
- H10F71/1212—The active layers comprising only Group IV materials consisting of germanium
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/122—Active materials comprising only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Light Receiving Elements (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009184003A JP5401203B2 (ja) | 2009-08-07 | 2009-08-07 | 半導体受光装置及びその製造方法 |
| US12/838,444 US8350301B2 (en) | 2009-08-07 | 2010-07-17 | Semiconductor photodiode device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009184003A JP5401203B2 (ja) | 2009-08-07 | 2009-08-07 | 半導体受光装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011040445A JP2011040445A (ja) | 2011-02-24 |
| JP2011040445A5 JP2011040445A5 (OSRAM) | 2012-04-19 |
| JP5401203B2 true JP5401203B2 (ja) | 2014-01-29 |
Family
ID=43534174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009184003A Expired - Fee Related JP5401203B2 (ja) | 2009-08-07 | 2009-08-07 | 半導体受光装置及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8350301B2 (OSRAM) |
| JP (1) | JP5401203B2 (OSRAM) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2316848C1 (ru) * | 2006-06-01 | 2008-02-10 | Садыгов Зираддин Якуб-оглы | Микроканальный лавинный фотодиод |
| JP5414415B2 (ja) * | 2009-08-06 | 2014-02-12 | 株式会社日立製作所 | 半導体受光素子及びその製造方法 |
| JP2013168605A (ja) * | 2012-02-17 | 2013-08-29 | Sharp Corp | 太陽電池の製造方法 |
| WO2013133005A1 (ja) * | 2012-03-08 | 2013-09-12 | 三洋電機株式会社 | 半導体装置の製造方法 |
| US9397243B2 (en) * | 2013-07-23 | 2016-07-19 | Sifotonics Technologies Co., Ltd. | Ge—Si avalanche photodiode with silicon carrier-energy-relaxation layer and edge electric field buffer region |
| US10553633B2 (en) * | 2014-05-30 | 2020-02-04 | Klaus Y.J. Hsu | Phototransistor with body-strapped base |
| KR102284657B1 (ko) * | 2015-01-05 | 2021-08-02 | 삼성전자 주식회사 | 포토 다이오드 및 이를 포함하는 광통신 시스템 |
| JP5957102B2 (ja) * | 2015-01-21 | 2016-07-27 | シャープ株式会社 | 太陽電池の製造方法 |
| EP3734661A3 (en) | 2015-07-23 | 2021-03-03 | Artilux Inc. | High efficiency wide spectrum sensor |
| US10761599B2 (en) | 2015-08-04 | 2020-09-01 | Artilux, Inc. | Eye gesture tracking |
| US10707260B2 (en) | 2015-08-04 | 2020-07-07 | Artilux, Inc. | Circuit for operating a multi-gate VIS/IR photodiode |
| US10861888B2 (en) | 2015-08-04 | 2020-12-08 | Artilux, Inc. | Silicon germanium imager with photodiode in trench |
| US9954016B2 (en) | 2015-08-04 | 2018-04-24 | Artilux Corporation | Germanium-silicon light sensing apparatus |
| CN115824395B (zh) | 2015-08-27 | 2023-08-15 | 光程研创股份有限公司 | 宽频谱光学传感器 |
| US10254389B2 (en) | 2015-11-06 | 2019-04-09 | Artilux Corporation | High-speed light sensing apparatus |
| US10418407B2 (en) | 2015-11-06 | 2019-09-17 | Artilux, Inc. | High-speed light sensing apparatus III |
| US10886309B2 (en) | 2015-11-06 | 2021-01-05 | Artilux, Inc. | High-speed light sensing apparatus II |
| US10739443B2 (en) | 2015-11-06 | 2020-08-11 | Artilux, Inc. | High-speed light sensing apparatus II |
| US10741598B2 (en) | 2015-11-06 | 2020-08-11 | Atrilux, Inc. | High-speed light sensing apparatus II |
| US9659989B1 (en) * | 2016-04-19 | 2017-05-23 | Omnivision Technologies, Inc. | Image sensor with semiconductor trench isolation |
| EP3548193B1 (en) | 2016-11-29 | 2023-05-10 | Sanger, Jeremy | Hot water pressure washer |
| CN108110081B (zh) * | 2018-02-01 | 2023-12-08 | 北京一径科技有限公司 | 异质结雪崩光电二极管 |
| US11482553B2 (en) | 2018-02-23 | 2022-10-25 | Artilux, Inc. | Photo-detecting apparatus with subpixels |
| US11105928B2 (en) | 2018-02-23 | 2021-08-31 | Artilux, Inc. | Light-sensing apparatus and light-sensing method thereof |
| TWI788246B (zh) | 2018-02-23 | 2022-12-21 | 美商光程研創股份有限公司 | 光偵測裝置 |
| JP7212062B2 (ja) | 2018-04-08 | 2023-01-24 | アーティラックス・インコーポレイテッド | 光検出装置 |
| US10854770B2 (en) | 2018-05-07 | 2020-12-01 | Artilux, Inc. | Avalanche photo-transistor |
| US10969877B2 (en) | 2018-05-08 | 2021-04-06 | Artilux, Inc. | Display apparatus |
| US11574942B2 (en) | 2018-12-12 | 2023-02-07 | Artilux, Inc. | Semiconductor device with low dark noise |
| US11652184B2 (en) | 2019-08-28 | 2023-05-16 | Artilux, Inc. | Photo-detecting apparatus with low dark current |
| US12278252B2 (en) | 2019-08-28 | 2025-04-15 | Artilux, Inc. | Photo-detecting apparatus with low dark current |
| US12477856B2 (en) | 2019-08-28 | 2025-11-18 | Artilux, Inc. | Photo-detecting apparatus with low dark current |
| CN112750847B (zh) * | 2019-10-31 | 2024-10-18 | 台湾积体电路制造股份有限公司 | 半导体装置及其形成方法 |
| US11749762B2 (en) * | 2019-10-31 | 2023-09-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device comprising a photodetector with reduced dark current |
| US11742451B2 (en) * | 2020-11-24 | 2023-08-29 | Cisco Technology, Inc. | Integrate stressor with Ge photodiode using a substrate removal process |
| WO2022169501A1 (en) | 2021-02-03 | 2022-08-11 | Chowdhury Asif Jahangir | Silicon nitride waveguide coupled photodiode |
| US12457823B2 (en) | 2022-08-19 | 2025-10-28 | Globalfoundries U.S. Inc. | Photodetector structure with air gap and related methods |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5513924A (en) * | 1978-07-14 | 1980-01-31 | Semiconductor Res Found | Semiconductor photoelectronic conversion device |
| JPS57207383A (en) | 1981-06-15 | 1982-12-20 | Nippon Telegr & Teleph Corp <Ntt> | Phototransistor |
| JPH077844B2 (ja) * | 1981-11-30 | 1995-01-30 | 財団法人半導体研究振興会 | 静電誘導型半導体光電変換装置 |
| JPS5895877A (ja) * | 1981-12-01 | 1983-06-07 | Semiconductor Res Found | 半導体光電変換装置 |
| JPS63122285A (ja) * | 1986-11-12 | 1988-05-26 | Tokuzo Sukegawa | 半導体受光素子用材料 |
| US5686734A (en) * | 1993-01-22 | 1997-11-11 | Canon Kabushiki Kaisha | Thin film semiconductor device and photoelectric conversion device using the thin film semiconductor device |
| JPH09181349A (ja) * | 1995-12-27 | 1997-07-11 | Mitsubishi Electric Corp | 半導体デバイスの製造方法 |
| EP0818829A1 (en) * | 1996-07-12 | 1998-01-14 | Hitachi, Ltd. | Bipolar transistor and method of fabricating it |
| JP2001077400A (ja) * | 1999-08-31 | 2001-03-23 | Tokai Rika Co Ltd | 半導体フォトデバイス |
| US7138697B2 (en) | 2004-02-24 | 2006-11-21 | International Business Machines Corporation | Structure for and method of fabricating a high-speed CMOS-compatible Ge-on-insulator photodetector |
| US7638842B2 (en) * | 2005-09-07 | 2009-12-29 | Amberwave Systems Corporation | Lattice-mismatched semiconductor structures on insulators |
| JP2009033043A (ja) * | 2007-07-30 | 2009-02-12 | Panasonic Corp | 光半導体装置 |
| JP2009218457A (ja) * | 2008-03-12 | 2009-09-24 | Panasonic Corp | 光半導体装置 |
-
2009
- 2009-08-07 JP JP2009184003A patent/JP5401203B2/ja not_active Expired - Fee Related
-
2010
- 2010-07-17 US US12/838,444 patent/US8350301B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011040445A (ja) | 2011-02-24 |
| US8350301B2 (en) | 2013-01-08 |
| US20110031578A1 (en) | 2011-02-10 |
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