JP5386769B2 - 検査治具 - Google Patents

検査治具 Download PDF

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Publication number
JP5386769B2
JP5386769B2 JP2008251320A JP2008251320A JP5386769B2 JP 5386769 B2 JP5386769 B2 JP 5386769B2 JP 2008251320 A JP2008251320 A JP 2008251320A JP 2008251320 A JP2008251320 A JP 2008251320A JP 5386769 B2 JP5386769 B2 JP 5386769B2
Authority
JP
Japan
Prior art keywords
electrode
contact
electrode portion
contactor
inspection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008251320A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010085107A (ja
Inventor
清 沼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Read Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2008251320A priority Critical patent/JP5386769B2/ja
Priority to CN2009101750786A priority patent/CN101713790B/zh
Priority to KR1020090091587A priority patent/KR101098320B1/ko
Priority to TW098132897A priority patent/TWI422829B/zh
Publication of JP2010085107A publication Critical patent/JP2010085107A/ja
Application granted granted Critical
Publication of JP5386769B2 publication Critical patent/JP5386769B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
JP2008251320A 2008-09-29 2008-09-29 検査治具 Expired - Fee Related JP5386769B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008251320A JP5386769B2 (ja) 2008-09-29 2008-09-29 検査治具
CN2009101750786A CN101713790B (zh) 2008-09-29 2009-09-27 检查治具、电极结构及电极结构的制造方法
KR1020090091587A KR101098320B1 (ko) 2008-09-29 2009-09-28 검사치구, 전극구조 및 전극구조의 제조방법
TW098132897A TWI422829B (zh) 2008-09-29 2009-09-29 檢查治具、電極構造及電極構造之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008251320A JP5386769B2 (ja) 2008-09-29 2008-09-29 検査治具

Publications (2)

Publication Number Publication Date
JP2010085107A JP2010085107A (ja) 2010-04-15
JP5386769B2 true JP5386769B2 (ja) 2014-01-15

Family

ID=42213872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008251320A Expired - Fee Related JP5386769B2 (ja) 2008-09-29 2008-09-29 検査治具

Country Status (4)

Country Link
JP (1) JP5386769B2 (zh)
KR (1) KR101098320B1 (zh)
CN (1) CN101713790B (zh)
TW (1) TWI422829B (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540971B2 (ja) * 2010-07-30 2014-07-02 日本電産リード株式会社 接触子、接続治具及び接触子の製造方法
WO2012014905A1 (ja) * 2010-07-30 2012-02-02 日本電産リード株式会社 接触子及び接触子の製造方法
JP2012083234A (ja) * 2010-10-13 2012-04-26 Hioki Ee Corp プローブおよび測定装置
JP5804237B2 (ja) * 2011-01-24 2015-11-04 日本電産リード株式会社 検査用治具
JP6033130B2 (ja) * 2013-03-13 2016-11-30 新光電気工業株式会社 プローブガイド板及びその製造方法
KR101565992B1 (ko) 2014-07-16 2015-11-06 주식회사 새한마이크로텍 동축형 프로브 핀을 포함하는 다층기판 검사용 지그
US10006939B2 (en) 2014-10-30 2018-06-26 Tongfu Microelectronics Co., Ltd. Testing probe and semiconductor testing fixture, and fabrication methods thereof
CN104316864B (zh) * 2014-10-30 2018-06-22 通富微电子股份有限公司 半导体测试治具
CN104280677B (zh) * 2014-10-30 2017-11-10 通富微电子股份有限公司 半导体测试治具
CN104282585B (zh) * 2014-10-30 2017-05-24 通富微电子股份有限公司 测试针头和半导体测试夹具的形成方法
CN104347448B (zh) * 2014-10-30 2018-08-10 通富微电子股份有限公司 半导体测试治具的形成方法
US10006943B2 (en) 2014-10-30 2018-06-26 Tongfu Microelectronics Co., Ltd. Semiconductor testing fixture and fabrication method thereof
CN104280581B (zh) * 2014-10-30 2018-01-30 通富微电子股份有限公司 测试针头和半导体测试治具
CN104280678B (zh) * 2014-10-30 2018-11-27 通富微电子股份有限公司 半导体测试治具
CN104319247B (zh) * 2014-10-30 2018-05-18 通富微电子股份有限公司 测试针头和半导体测试夹具
CN104280580B (zh) * 2014-10-30 2018-01-30 通富微电子股份有限公司 测试针头和半导体测试治具
US10067162B2 (en) 2014-10-30 2018-09-04 Tongfu Microelectronics Co., Ltd. Testing probe, semiconductor testing fixture and fabrication method thereof
CN104282596B (zh) * 2014-10-30 2017-12-08 通富微电子股份有限公司 半导体测试治具的形成方法
CN104407183B (zh) * 2014-10-30 2018-10-23 通富微电子股份有限公司 测试针头和半导体测试治具的形成方法
US10119993B2 (en) 2014-10-30 2018-11-06 Tongfu Microelectronics Co., Ltd. Testing probe and semiconductor testing fixture, and fabrication methods thereof
CN104407182B (zh) * 2014-10-30 2018-09-21 通富微电子股份有限公司 半导体测试治具
CN104319248B (zh) * 2014-10-30 2018-04-13 通富微电子股份有限公司 半导体测试治具的形成方法
US10001509B2 (en) 2014-10-30 2018-06-19 Tongfu Microelectronics Co., Ltd. Semiconductor testing fixture and fabrication method thereof
CN104330593B (zh) * 2014-10-30 2017-09-29 通富微电子股份有限公司 测试针头和半导体测试治具
CN104360112B (zh) * 2014-10-30 2018-04-06 通富微电子股份有限公司 半导体测试治具及其形成方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0829475A (ja) * 1994-07-12 1996-02-02 Fuji Photo Film Co Ltd 実装基板検査装置のコンタクトプローブ
JP2002228682A (ja) * 2001-02-02 2002-08-14 Tokyo Electron Ltd プローブ
JP3690796B2 (ja) * 2002-01-31 2005-08-31 株式会社コーヨーテクノス 検査冶具及びその製造方法並びに回路基板の製造方法
JP4251855B2 (ja) * 2002-11-19 2009-04-08 株式会社ヨコオ 高周波・高速用デバイスの検査治具の製法
JP2005030878A (ja) * 2003-07-11 2005-02-03 Yokowo Co Ltd 検査用プローブ
JP2005315775A (ja) 2004-04-30 2005-11-10 Fujitsu Autom Ltd 片面移動式プローブを用いた４端子検査方法及び４端子検査用治具
KR20070070069A (ko) * 2005-12-28 2007-07-03 니혼덴산리드가부시키가이샤 기판 검사 장치 및 기판 검사 방법

Also Published As

Publication number Publication date
CN101713790A (zh) 2010-05-26
KR20100036197A (ko) 2010-04-07
KR101098320B1 (ko) 2011-12-26
TW201013192A (en) 2010-04-01
CN101713790B (zh) 2012-05-30
TWI422829B (zh) 2014-01-11
JP2010085107A (ja) 2010-04-15

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