KR101098320B1 - 검사치구, 전극구조 및 전극구조의 제조방법 - Google Patents

검사치구, 전극구조 및 전극구조의 제조방법 Download PDF

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Publication number
KR101098320B1
KR101098320B1 KR1020090091587A KR20090091587A KR101098320B1 KR 101098320 B1 KR101098320 B1 KR 101098320B1 KR 1020090091587 A KR1020090091587 A KR 1020090091587A KR 20090091587 A KR20090091587 A KR 20090091587A KR 101098320 B1 KR101098320 B1 KR 101098320B1
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KR
South Korea
Prior art keywords
electrode
electrode portion
contact
contactor
inspection
Prior art date
Application number
KR1020090091587A
Other languages
English (en)
Korean (ko)
Other versions
KR20100036197A (ko
Inventor
기요시 누마타
Original Assignee
니혼덴산리드가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 니혼덴산리드가부시키가이샤 filed Critical 니혼덴산리드가부시키가이샤
Publication of KR20100036197A publication Critical patent/KR20100036197A/ko
Application granted granted Critical
Publication of KR101098320B1 publication Critical patent/KR101098320B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
KR1020090091587A 2008-09-29 2009-09-28 검사치구, 전극구조 및 전극구조의 제조방법 KR101098320B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008251320A JP5386769B2 (ja) 2008-09-29 2008-09-29 検査治具
JPJP-P-2008-251320 2008-09-29

Publications (2)

Publication Number Publication Date
KR20100036197A KR20100036197A (ko) 2010-04-07
KR101098320B1 true KR101098320B1 (ko) 2011-12-26

Family

ID=42213872

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090091587A KR101098320B1 (ko) 2008-09-29 2009-09-28 검사치구, 전극구조 및 전극구조의 제조방법

Country Status (4)

Country Link
JP (1) JP5386769B2 (zh)
KR (1) KR101098320B1 (zh)
CN (1) CN101713790B (zh)
TW (1) TWI422829B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101565992B1 (ko) 2014-07-16 2015-11-06 주식회사 새한마이크로텍 동축형 프로브 핀을 포함하는 다층기판 검사용 지그

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540971B2 (ja) * 2010-07-30 2014-07-02 日本電産リード株式会社 接触子、接続治具及び接触子の製造方法
WO2012014905A1 (ja) * 2010-07-30 2012-02-02 日本電産リード株式会社 接触子及び接触子の製造方法
JP2012083234A (ja) * 2010-10-13 2012-04-26 Hioki Ee Corp プローブおよび測定装置
JP5804237B2 (ja) * 2011-01-24 2015-11-04 日本電産リード株式会社 検査用治具
JP6033130B2 (ja) * 2013-03-13 2016-11-30 新光電気工業株式会社 プローブガイド板及びその製造方法
US10006939B2 (en) 2014-10-30 2018-06-26 Tongfu Microelectronics Co., Ltd. Testing probe and semiconductor testing fixture, and fabrication methods thereof
CN104316864B (zh) * 2014-10-30 2018-06-22 通富微电子股份有限公司 半导体测试治具
CN104280677B (zh) * 2014-10-30 2017-11-10 通富微电子股份有限公司 半导体测试治具
CN104282585B (zh) * 2014-10-30 2017-05-24 通富微电子股份有限公司 测试针头和半导体测试夹具的形成方法
CN104347448B (zh) * 2014-10-30 2018-08-10 通富微电子股份有限公司 半导体测试治具的形成方法
US10006943B2 (en) 2014-10-30 2018-06-26 Tongfu Microelectronics Co., Ltd. Semiconductor testing fixture and fabrication method thereof
CN104280581B (zh) * 2014-10-30 2018-01-30 通富微电子股份有限公司 测试针头和半导体测试治具
CN104280678B (zh) * 2014-10-30 2018-11-27 通富微电子股份有限公司 半导体测试治具
CN104319247B (zh) * 2014-10-30 2018-05-18 通富微电子股份有限公司 测试针头和半导体测试夹具
CN104280580B (zh) * 2014-10-30 2018-01-30 通富微电子股份有限公司 测试针头和半导体测试治具
US10067162B2 (en) 2014-10-30 2018-09-04 Tongfu Microelectronics Co., Ltd. Testing probe, semiconductor testing fixture and fabrication method thereof
CN104282596B (zh) * 2014-10-30 2017-12-08 通富微电子股份有限公司 半导体测试治具的形成方法
CN104407183B (zh) * 2014-10-30 2018-10-23 通富微电子股份有限公司 测试针头和半导体测试治具的形成方法
US10119993B2 (en) 2014-10-30 2018-11-06 Tongfu Microelectronics Co., Ltd. Testing probe and semiconductor testing fixture, and fabrication methods thereof
CN104407182B (zh) * 2014-10-30 2018-09-21 通富微电子股份有限公司 半导体测试治具
CN104319248B (zh) * 2014-10-30 2018-04-13 通富微电子股份有限公司 半导体测试治具的形成方法
US10001509B2 (en) 2014-10-30 2018-06-19 Tongfu Microelectronics Co., Ltd. Semiconductor testing fixture and fabrication method thereof
CN104330593B (zh) * 2014-10-30 2017-09-29 通富微电子股份有限公司 测试针头和半导体测试治具
CN104360112B (zh) * 2014-10-30 2018-04-06 通富微电子股份有限公司 半导体测试治具及其形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228682A (ja) 2001-02-02 2002-08-14 Tokyo Electron Ltd プローブ
JP2005315775A (ja) 2004-04-30 2005-11-10 Fujitsu Autom Ltd 片面移動式プローブを用いた４端子検査方法及び４端子検査用治具

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0829475A (ja) * 1994-07-12 1996-02-02 Fuji Photo Film Co Ltd 実装基板検査装置のコンタクトプローブ
JP3690796B2 (ja) * 2002-01-31 2005-08-31 株式会社コーヨーテクノス 検査冶具及びその製造方法並びに回路基板の製造方法
JP4251855B2 (ja) * 2002-11-19 2009-04-08 株式会社ヨコオ 高周波・高速用デバイスの検査治具の製法
JP2005030878A (ja) * 2003-07-11 2005-02-03 Yokowo Co Ltd 検査用プローブ
KR20070070069A (ko) * 2005-12-28 2007-07-03 니혼덴산리드가부시키가이샤 기판 검사 장치 및 기판 검사 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228682A (ja) 2001-02-02 2002-08-14 Tokyo Electron Ltd プローブ
JP2005315775A (ja) 2004-04-30 2005-11-10 Fujitsu Autom Ltd 片面移動式プローブを用いた４端子検査方法及び４端子検査用治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101565992B1 (ko) 2014-07-16 2015-11-06 주식회사 새한마이크로텍 동축형 프로브 핀을 포함하는 다층기판 검사용 지그

Also Published As

Publication number Publication date
CN101713790A (zh) 2010-05-26
KR20100036197A (ko) 2010-04-07
TW201013192A (en) 2010-04-01
CN101713790B (zh) 2012-05-30
TWI422829B (zh) 2014-01-11
JP2010085107A (ja) 2010-04-15
JP5386769B2 (ja) 2014-01-15

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