JP5377401B2 - 硬化性オルガノポリシロキサン組成物 - Google Patents

硬化性オルガノポリシロキサン組成物 Download PDF

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Publication number
JP5377401B2
JP5377401B2 JP2010096738A JP2010096738A JP5377401B2 JP 5377401 B2 JP5377401 B2 JP 5377401B2 JP 2010096738 A JP2010096738 A JP 2010096738A JP 2010096738 A JP2010096738 A JP 2010096738A JP 5377401 B2 JP5377401 B2 JP 5377401B2
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bonded
group
silicon
mol
composition
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JP2010096738A
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English (en)
Japanese (ja)
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JP2011225715A (ja
Inventor
正行 池野
中 小林
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2010096738A priority Critical patent/JP5377401B2/ja
Priority to CN2011100983860A priority patent/CN102234430A/zh
Priority to KR1020110035969A priority patent/KR101768228B1/ko
Priority to TW100113557A priority patent/TWI498382B/zh
Publication of JP2011225715A publication Critical patent/JP2011225715A/ja
Application granted granted Critical
Publication of JP5377401B2 publication Critical patent/JP5377401B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polymers & Plastics (AREA)
  • Led Device Packages (AREA)
  • Medicinal Chemistry (AREA)
JP2010096738A 2010-04-20 2010-04-20 硬化性オルガノポリシロキサン組成物 Active JP5377401B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010096738A JP5377401B2 (ja) 2010-04-20 2010-04-20 硬化性オルガノポリシロキサン組成物
CN2011100983860A CN102234430A (zh) 2010-04-20 2011-04-18 固化性有机聚硅氧烷组合物
KR1020110035969A KR101768228B1 (ko) 2010-04-20 2011-04-19 경화성 오르가노폴리실록산 조성물
TW100113557A TWI498382B (zh) 2010-04-20 2011-04-19 Hardened organopolysiloxane composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010096738A JP5377401B2 (ja) 2010-04-20 2010-04-20 硬化性オルガノポリシロキサン組成物

Publications (2)

Publication Number Publication Date
JP2011225715A JP2011225715A (ja) 2011-11-10
JP5377401B2 true JP5377401B2 (ja) 2013-12-25

Family

ID=44885581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010096738A Active JP5377401B2 (ja) 2010-04-20 2010-04-20 硬化性オルガノポリシロキサン組成物

Country Status (4)

Country Link
JP (1) JP5377401B2 (ko)
KR (1) KR101768228B1 (ko)
CN (1) CN102234430A (ko)
TW (1) TWI498382B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101493131B1 (ko) * 2011-11-25 2015-02-13 주식회사 엘지화학 오가노폴리실록산
JP6237880B2 (ja) * 2013-04-04 2017-11-29 エルジー・ケム・リミテッド 硬化性組成物
CN105102542B (zh) * 2013-04-04 2017-07-04 株式会社Lg化学 可固化组合物
WO2014163439A1 (ko) * 2013-04-04 2014-10-09 주식회사 엘지화학 경화성 조성물
CN103951984B (zh) * 2014-04-23 2016-07-13 明基材料有限公司 可固化硅树脂组成物及使用其的光学半导体装置
JP6519305B2 (ja) * 2015-05-11 2019-05-29 富士電機株式会社 封止材用シリコーン樹脂組成物及び該組成物を用いたパワー半導体モジュール
WO2017043328A1 (ja) * 2015-09-11 2017-03-16 ケイ素材料開発株式会社 架橋性オルガノポリシロキサン組成物およびその硬化物
CN109790385B (zh) * 2016-09-30 2021-09-21 日产化学株式会社 交联性有机聚硅氧烷组合物、其固化物及led装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0762244A (ja) * 1993-08-27 1995-03-07 Toshiba Silicone Co Ltd ポリオルガノシロキサン組成物
JP4409160B2 (ja) * 2002-10-28 2010-02-03 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP2009527622A (ja) * 2006-02-24 2009-07-30 ダウ・コーニング・コーポレイション シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物
JP5202822B2 (ja) * 2006-06-23 2013-06-05 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
TWI434890B (zh) * 2007-04-06 2014-04-21 Shinetsu Chemical Co 加成可硬化聚矽氧樹脂組成物及使用彼之聚矽氧鏡片

Also Published As

Publication number Publication date
CN102234430A (zh) 2011-11-09
JP2011225715A (ja) 2011-11-10
TW201204786A (en) 2012-02-01
TWI498382B (zh) 2015-09-01
KR101768228B1 (ko) 2017-08-14
KR20110117003A (ko) 2011-10-26

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