JP5372579B2 - 半導体装置及びその製造方法、並びに電子装置 - Google Patents

半導体装置及びその製造方法、並びに電子装置 Download PDF

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JP5372579B2
JP5372579B2 JP2009096024A JP2009096024A JP5372579B2 JP 5372579 B2 JP5372579 B2 JP 5372579B2 JP 2009096024 A JP2009096024 A JP 2009096024A JP 2009096024 A JP2009096024 A JP 2009096024A JP 5372579 B2 JP5372579 B2 JP 5372579B2
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electrode
reinforcing plate
connection
electronic component
semiconductor device
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JP2010251367A (ja
JP2010251367A5 (enExample
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健太 内山
昭彦 立岩
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to US12/748,545 priority patent/US8169072B2/en
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