TWI505756B - 印刷電路板及其製造方法 - Google Patents

印刷電路板及其製造方法 Download PDF

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Publication number
TWI505756B
TWI505756B TW101105323A TW101105323A TWI505756B TW I505756 B TWI505756 B TW I505756B TW 101105323 A TW101105323 A TW 101105323A TW 101105323 A TW101105323 A TW 101105323A TW I505756 B TWI505756 B TW I505756B
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Taiwan
Prior art keywords
opening
layer
pillar
metal
diameter
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TW101105323A
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English (en)
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TW201328447A (zh
Inventor
Hueng Jae Oh
Boo Yang Jung
Dae Young Lee
Jin Won Choi
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Samsung Electro Mech
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Publication of TW201328447A publication Critical patent/TW201328447A/zh
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Publication of TWI505756B publication Critical patent/TWI505756B/zh

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    • H—ELECTRICITY
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H01—ELECTRIC ELEMENTS
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Description

印刷電路板及其製造方法
本發明係關於一種印刷電路板及其製造方法。
隨著電子工業的發展，對於高效能、多功能，以及小尺寸之電子元件的需求大增。由於這樣的趨勢，出現了對於在系統封裝(SIP)、三維封裝等之中用於表面固定元件的基板，高度整合、薄化並具有微小電路圖案的需求。
在用於固定半導體晶片等外部元件的表面固定技術中，打線接合方法(wire bonding scheme)及覆晶接合方法(flip chip bonding scheme)被用於電性連接半導體晶片及印刷電路板(PCB)。然而，在打線接合方法中，由於半導體晶片是經由導線來連接至印刷電路板，因此模組的尺寸增加，需要額外的製程，並且對於細間距(fine pitch)的實施產生限制。因此，覆晶接合方法取代了打線接合方法而被廣泛地應用。
在覆晶接合方法中，凸塊係由金、焊料，或是任何其他金屬製成，其尺寸介於數十到數百微米之間，而形成在半導體晶片或是用來固定半導體晶片的印刷電路板上。而半導體晶片係固定至印刷電路板之上(請參照韓國專利公開號2001-0107767)。
然而，隨著印刷電路板變得更為微小，用於形成凸塊之焊墊的開口減小，造成了印刷電路板和凸塊間的接合強 度降低、固定穩定度降低及底部填充缺陷等問題。
本發明係用以提供一種具有強化外部元件固定穩定度功能的印刷電路板(PCB)以及其製造方法。
本發明並用以提供一種包含具有強化接合強度之金屬柱的印刷電路板以及其製造方法。
本發明另用以提供一種在底部填充製程中避免孔洞(void)形成的印刷電路板以及其製造方法。
根據本發明一較佳實施例，提供一種印刷電路板，包含一基板、一電路層、一阻焊層、一金屬柱及一種子層。電路層係形成於一基板上，並具有一連接墊。阻焊層係形成於基板之上方部位，並具有暴露出連接墊的一開口。金屬柱係形成於阻焊層及暴露出來之連接墊的上方部位，且金屬柱具有多個直徑。種子層係沿著金屬柱的界面，形成於阻焊層之上方部位及開口的內壁上。
金屬柱可包含形成於開口中的第一柱體部份，形成於第一柱體部份及阻焊層之上方部位的第二柱體部份，以及形成於第二柱體部份之上方部位的第三柱體部份。
金屬柱之第三柱體部份的直徑可大於第二柱體部份的直徑。
金屬柱之第三柱體部份的直徑可小於第二柱體部份的直徑。
種子層可透過無電電鍍形成。
金屬柱可透過電鍍形成。
根據本發明另一較佳實施例，提供一種印刷電路板的製造方法。包含預備具有包含一連接墊之一電路層形成在其上的一基板。形成具有暴露出連接墊之一第一開口的一阻焊層於基板之上方部位。形成一第一阻鍍層於阻焊層之上方部位，第一阻鍍層係具有暴露出第一開口的一第二開口，第二開口具有大於第一開口的直徑。形成一種子層於第一阻鍍層之上方部位、第一開口的內壁和第二開口的內壁上。形成一第二阻鍍層於種子層之上方部位，第二阻鍍層係具有暴露出第一開口的一第三開口。電鍍第一開口至第三開口的內壁以形成一金屬柱。除去第二阻鍍層。除去因除去第二阻鍍層而暴露出的種子層。並除去因除去種子層而暴露出的第一阻鍍層。
在形成第二阻鍍層的步驟中，可形成具有直徑大於第二開口直徑的第三開口。
在形成第二阻鍍層的步驟中，可形成具有直徑小於第二開口直徑的第三開口。
在形成種子層的步驟中，可透過無電電鍍形成種子層。
在形成金屬柱的步驟中，可透過電鍍形成金屬柱。
此一製造方法可更包含在除去第二阻鍍層後平坦化金屬柱。
平坦化金屬柱的步驟中，可透過拋光製程平坦化金屬柱。
以下將配合所附圖式進行敘述，以更加清楚地揭露本發明的各種特徵以及優點。
本發明說明書及申請專利範圍中所用的字詞，並不侷限於以其通常意義或字典中之定義的方式進行解釋，而應基於發明者可適當定義術語之概念來以最佳方式描述其發明的法則，解釋為具有關於本發明技術領域之意義及概念。
關於本發明的目的、特徵及優點，將配合圖式於以下內容中作進一步地闡述。在說明書與圖式中，即使是繪示於不同圖中，相似的元件符號係用以指示相似的元件。
另外，若對於本發明相關之習知技術進行詳述會導致閱讀重點失焦，則詳細的敘述說明便會自說明書省略。在說明書中，第一、第二等用語僅為分辨不同元件之用，而非用以限定各元件。
以下將配合所附圖式，對於根據本發明較佳實施例之印刷電路板及其製造方法進行詳細說明。
第1圖為繪示根據本發明一較佳實施例之印刷電路板的剖面圖。
請參照第1圖，印刷電路板(PCB)100可包括一基板(base substrate)110、一電路層(circuit layer)120、一阻焊層(solder resist layer)130、一種子層(seed layer)150及一金屬柱(metal post)170。
基板110可例如為一銅箔基板(copper clad laminate，CCL)。銅箔基板用以作為製造封裝基板的母材板(raw material plate)，意指藉由在阻焊層上塗佈一層薄銅而形成 的層板(laminate)。依據目的，銅箔基板可包含玻璃/環氧樹脂銅箔基板(glass/epoxy CCL)、耐熱銅箔基板(heat-resistant CCL)、紙/酚銅箔基板(paper/phenol CCL)、高頻銅箔基板(high frequency CCL)，軟性銅箔基板(聚亞醯胺膜)及複合銅箔基板等等。其中，玻璃/環氧樹脂銅箔基板被廣泛地應用在雙面封裝基板及多層封裝基板中。
電路層120形成於基板110之上方部位(upper portion)。電路層120係傳輸電子訊號，可包括一電路圖案、一貫孔及一連接墊。電路層120可由具有絕佳導電性之銅、金、銀或鎳等製成。根據本發明一較佳實施例，電路層120可形成於最外層。
根據本發明一較佳實施例，電路層120以單層形式形成於基板110之上方部位，但本發明並不限定於此。亦即，可於基板110上形成多層電路層。並且，單層電路層或是多層電路層可形成於基板110之一面或雙面上。
阻焊層130可形成於電路層120之上方部位。為避免作為最外層的電路層120因使用焊料之焊接製程等受到損壞，可形成阻焊層130於電路層120之上方部位。阻焊層130可具有一開口，以允許電路層120的連接墊121暴露出來。
金屬柱170可形成於種子層150之上方部位。金屬柱170之形成可藉由以一導電金屬填充(或是裝料)於阻焊層130開口的內部，此開口係用來暴露出連接墊121。舉例來說，金屬柱170可由具有絕佳導電性之金屬製成，例如銅、金、銀或鎳等等。金屬柱170可形成於種子層150的 上方部位，使得金屬柱170之下方部位具有類似階梯的形狀。亦即金屬柱170可具有多個直徑。金屬柱170可包括一第一柱體部位171、一第二柱體部位172以及一第三柱體部位173。
第一柱體部位171可形成於阻焊層130之開口中。
第二柱體部位172可形成於第一柱體部位171之上方部位與阻焊層130上。
第三柱體部位173可形成於第二柱體部位172之上方部位。
在如此形成的金屬柱170中，第一柱體部位171至第三柱體部位173之至少一者可具有一不同尺寸的直徑。
根據本發明一較佳實施例，金屬柱170中，第三柱體部位173的直徑可大於第二柱體部位172的直徑。
第三柱體部位173直徑大於第二柱體部位172直徑的金屬柱170能增進外部元件(external element，未示於此)固定(mount)在印刷電路板100上方部位的固定穩定度，此外部元件例如是半導體元件或者類似元件。此外，由於金屬柱170之第二柱體部位172形成於阻焊層130之上方部位，金屬柱170和阻焊層130之間的接合面積(bonding area)可因此增加。由於金屬柱170和阻焊層130之間的接合面積增加，金屬柱170和印刷電路板100之間的接合強度(bonding strength)可被強化。
種子層150可形成於阻焊層130和連接墊121的上方部位與金屬柱170的下方部位之間。種子層150可形成於金屬柱170之第一柱體部位171、第二柱體部位172及第 三柱體部位173的下表面上。據此，由於種子層150形成於金屬柱170之第一柱體部位171、第二柱體部位172及第三柱體部位173的下表面上，種子層150可具有階梯形狀。
在根據本發明另一較佳實施例之印刷電路板及其製造方法中，由於金屬柱中間部位的直徑大，金屬柱及阻焊層間的接合面積能夠增加，以強化金屬柱及阻焊層間的接合強度。
第2至11圖為依序繪示根據本發明一較佳實施例之印刷電路板的製造方法的剖面圖。
請參照第2圖，可提供具有電路層120形成於上之基板110。
基板110可例如為一銅箔基板(CCL)。銅箔基板用以作為製造封裝基板的母材板，意指藉由在阻焊層上塗佈一層薄銅而形成的層板。依據目的，銅箔基板可包含玻璃/環氧樹脂銅箔基板、耐熱銅箔基板、紙/酚銅箔基板、高頻銅箔基板、軟性銅箔基板(聚亞醯胺膜)及複合銅箔基板等等。其中，玻璃/環氧樹脂銅箔基板被廣泛地應用在雙面封裝基板及多層封裝基板中。
電路層120形成於基板110的上方部位。電路層120係傳輸電子訊號，可包括一電路圖案、一貫孔及一連接墊。電路層120可由具有絕佳導電性之銅、金、銀或鎳等製成。根據本發明一較佳實施例，電路層120可形成於最外層。
根據本發明一較佳實施例，電路層120以單層形式形 成於基板110之上方部位，但本發明並不限定於此。亦即，可於基板110上形成多層電路層。並且，單層電路層或是多層電路層可形成於基板110之一面或雙面上。
請參照第3圖，阻焊層130可形成於基板110之上方部位。
當電路層120為最外層時，阻焊層130可形成於電路層120之上方部位，以避免電路層120因使用焊料之焊接製程等受到損壞。阻焊層130可具有一第一開口131，第一開口131將電路層120之連接墊121暴露於外。
請參照第4圖，一第一阻鍍層(plated resist layer)140可形成於阻焊層130之上方部位。第一阻鍍層140可包括暴露出第一開口131的第二開口141。在此，第二開口141可形成於第一開口131之上方部位。並且，第一阻鍍層140之第二開口141的直徑可大於第一開口131的直徑。亦即第一阻鍍層140可形成於阻焊層130之上方部位，而暴露出第一開口131及一部份的阻焊層130。
請參照第5圖，種子層150可形成於第一阻鍍層140之上方部位。種子層150可形成於第一開口131及第二開口141之內壁上以及第一阻鍍層140的上方部位。種子層150可透過無電電鍍形成。並且，種子層150可由導電材料製成。
請參照第6圖，一第二阻鍍層160可形成於種子層150之上方部位。第二阻鍍層160可包括暴露出第二開口141的第三開口161。在此，第三開口161可形成於第二開口141之上方部位。並且，第二阻鍍層160之第三開口161 的直徑可大於第二開口141的直徑。
請參照第7圖，可形成金屬柱170。金屬柱170之形成可藉由以導電金屬填充於形成在連接墊121上方部位之第一開口131到第三開口161的內部。金屬柱170可透過電鍍來形成。並且，金屬柱170可由具有絕佳導電性之金屬製成，例如銅、金、銀或鎳等等。透過填充第一開口131至第三開口161的內部而形成之金屬柱170，可包括第一柱體部位171、第二柱體部位172及第三柱體部位173。
第一柱體部位171可形成於第一開口131中。第二柱體部位172可形成於第二開口141中。第三柱體部位173可形成於第三開口161中。亦即，由於第三開口161的直徑大於第二開口141的直徑，金屬柱170可以第三柱體部位173之直徑大於第二柱體部位172之直徑的形態形成。
請參照第8圖，可除去第二阻鍍層160。
在金屬柱170形成後，可除去包含第三開口161的第二阻鍍層160。可藉由一般除去阻鍍層的方法除去第二阻鍍層160。
請參照第9圖，可平坦化金屬柱170。
在除去第二阻鍍層160後，可對於金屬柱170的上方部位施以拋光製程。透過拋光製程，金屬柱170上方部位的一部份係受到拋光，以使得金屬柱170具有一預定的高度。根據本發明一較佳實施例，除去第二阻鍍層160之後，係平坦化金屬柱170，但施行平坦化(planarizing)的製程並不限定於此。亦即，本發明所屬技術領域中具有通常知識者，可以在任何除去種子層150及第一阻鍍層140的製程 之後平坦化金屬柱170。
請參照第10圖，可除去種子層150。
種子層150的一部份可藉由除去第二阻鍍層160而暴露出來。因此，可除去暴露出的種子層150。可透過一般的蝕刻製程除去種子層150。舉例來說，可透過閃蝕(flash etch)製程除去種子層150。
請參照第11圖，可除去第一阻鍍層140。
除去種子層150之後，可除去第一阻鍍層140。可透過一般除去阻鍍層之方法除去第一阻鍍層140。
當第一阻鍍層140被除去，根據本發明較佳實施例最終得到之結構的下方部位具有類似階梯的形狀，並且可形成包含具有多個直徑之金屬柱170的印刷電路板。第三柱體部位173直徑大於第二柱體部位172直徑的金屬柱170能增進一外部元件(未示於此)固定在印刷電路板上方部位的固定穩定度，此外部元件例如是半導體元件或者類似元件。此外，由於金屬柱170之第二柱體部位172形成於阻焊層130的上方部位，金屬柱170和阻焊層130的接合面積可因此增加。由於金屬柱170和阻焊層130間的接合面積增加，金屬柱170和印刷電路板100之間的接合強度可被強化。
第12圖為繪示根據本發明另一較佳實施例之印刷電路板的剖面圖。
請參照第12圖，印刷電路板200可包括一基板210、一電路層220、一阻焊層230、一種子層250及一金屬柱270。
基板210可例如為一銅箔基板(CCL)。銅箔基板用以作為製造封裝基板的母材板，意指藉由在阻焊層上塗佈一層薄銅而形成的層板。依據目的，銅箔基板可包含玻璃/環氧樹脂銅箔基板，耐熱銅箔基板、紙/酚銅箔基板、高頻銅箔基板、軟性銅箔基板(聚亞醯胺膜)及複合銅箔基板等等。其中，玻璃/環氧樹脂銅箔基板被廣泛地應用在雙面封裝基板及多層封裝基板中。
電路層220形成於基板210之上方部位。電路層220係傳輸電子訊號，可包括一電路圖案、一貫孔及一連接墊。電路層220可由具有絕佳導電性之銅、金、銀或鎳等製成。根據本發明一較佳實施例，電路層220可形成於最外層。
根據本發明一較佳實施例，電路層220以單層形式形成於基板210之上方部位，但本發明並不限定於此。亦即，可於基板210上形成多層電路層。並且，單層電路層或是多層電路層可形成於基板210之一面或是雙面上。
阻焊層230可形成於電路層220的上方部位。為避免作為最外層的電路層220因使用焊料之焊接製程等受到損壞，可形成阻焊層230於電路層220之上方部位。阻焊層230可具有一開口，以允許電路層220之連接墊221暴露出來。
金屬柱270可形成於種子層250的上方部位。金屬柱270可透過填充(或是裝料)一導電金屬於阻焊層230之用來暴露出連接墊221的開口中而形成。舉例來說，金屬柱270可由具有絕佳導電性之金屬製成，例如銅、金、銀或 鎳等等。金屬柱270可形成於種子層250的上方部位，使得金屬柱270的下方部位具有類似階梯的形狀。亦即金屬柱270可具有多個直徑。金屬柱270可包括一第一柱體部位271、一第二柱體部位272及一第三柱體部位273。
第一柱體部位271可形成於阻焊層230之開口中。
第二柱體部位272可形成於第一柱體部位271之上方部位與阻焊層230上。
第三柱體部位273可形成於第二柱體部位272之上方部位。
在如此形成的金屬柱270中，第一柱體部位271至第三柱體部位273之至少一者可具有一不同尺寸的直徑。
根據本發明一較佳實施例，金屬柱270中，第二柱體部位272之直徑可大於第三柱體部位273之直徑。
此一情形下，在金屬柱270中，由於第二柱體部位272係形成於阻焊層230之上方部位，金屬柱270和阻焊層230之間的接合面積可因此增加。如此一來，由於金屬柱270和阻焊層230之間的接合面積增加，金屬柱270和印刷電路板200之間的接合強度可被強化。並且，由於金屬柱270之第二柱體部位272的直徑大於第三柱體部位273之直徑，可避免在底部填充製程(underfill process)中，於印刷電路板200和外部元件(未示於此)之間形成孔洞。
種子層250可形成於阻焊層230和連接墊221的上方部位和金屬柱270的下方部位之間。種子層250可形成於金屬柱270之第一柱體部位271及第二柱體部位272的下表面。因此，由於種子層250形成於金屬柱270之第一柱 體部位271及第二柱體部位272的下表面，種子層250可具有類似階梯的形狀。
第13至22圖為依序繪示根據本發明另一較佳實施例之印刷電路板的製造方法的剖面圖。
請參照第13圖，可提供具有電路層220形成於上之基板210。
基板210可例如為一銅箔基板(CCL)。銅箔基板用以作為製造封裝基板的母材板，意指藉由在阻焊層上塗佈一層薄銅而形成的層板。依據目的，銅箔基板可包含玻璃/環氧樹脂銅箔基板，耐熱銅箔基板、紙/酚銅箔基板、高頻銅箔基板、軟性銅箔基板(聚亞醯胺膜)及複合銅箔基板等等。其中，玻璃/環氧樹脂銅箔基板被廣泛地應用在雙面封裝基板及多層封裝基板中。
電路層220形成於基板210之上方部位。電路層220係傳輸電子訊號，可包括一電路圖案、一貫孔及一連接墊。電路層220可由具有絕佳導電性之銅、金、銀或鎳等製成。根據本發明一較佳實施例，電路層220可形成於最外層。
根據本發明一較佳實施例，電路層220以單層形式形成於基板210之上方部位，但本發明並不限定於此。亦即，可於基板210上形成多層電路層。並且，單層電路層或是多層電路層可形成於基板210之一面或是雙面上。
請參照第14圖，阻焊層230可形成於基板210之上方部位。
當電路層220為最外層時，阻焊層230可形成於電路 層220之上方部位，以避免電路層220因使用焊料之焊接製程等受到損壞。阻焊層230可具有第一開口231，第一開口231將電路層220之連接墊221暴露於外。
請參照第15圖，一第一阻鍍層240可形成於阻焊層230之上方部位。第一阻鍍層240可包括第二開口241，第二開口241暴露出第一開口231。在此，第二開口241可形成於第一開口231之上方部位。並且，第一阻鍍層240之第二開口241的直徑可大於第一開口231的直徑。亦即第一阻鍍層240可形成於阻焊層230之上方部位，而暴露出第一開口231及一部份的阻焊層230。
請參照第16圖，種子層250可形成於第一阻鍍層240之上方部位。種子層250可形成於第一開口231及第二開口241之內壁上以及第一阻鍍層240之上方部位。種子層250可透過無電電鍍形成。並且，種子層250可由導電材料製成。
請參照第17圖，第二阻鍍層260可形成於種子層250之上方部位。第二阻鍍層260可包括第三開口261，第三開口261暴露出第二開口241。在此，第三開口261可形成於第二開口241之上方部位。並且，第二開口241的直徑可大於第二阻鍍層260之第三開口261的直徑。
請參照第18圖，可形成金屬柱270。金屬柱270可透過填充導電金屬於連接墊221上方部位之第一開口231到第三開口261的內部而形成。金屬柱270可透過電鍍形成。並且，金屬柱270可由具有絕佳導電性之金屬製成，例如是銅、金、銀或鎳等等。透過填充第一開口231到第 三開口261內部形成的金屬柱270可包括第一柱體部位271、第二柱體部位272及第三柱體部位273。由第18圖可知，第一柱體部位271、第二柱體部位272及第三柱體部位273係共軸。此外，本步驟一次形成包含第一柱體部位271、第二柱體部位272及第三柱體部位273的金屬柱270，因此第一柱體部位271、第二柱體部位272及第三柱體部位273之間並未有明顯介面。
第一柱體部位271可形成於第一開口231中。第二柱體部位272可形成於第二開口241中。第三柱體部位273可形成於第三開口261中。亦即，由於第二開口241的直徑大於第三開口261的直徑，金屬柱270可以第二柱體部位272之直徑大於第三柱體部位273之直徑的形態形成。
請參照第19圖，可除去第二阻鍍層260。
形成金屬柱270之後，具有第三開口261的第二阻鍍層260可被除去。第二阻鍍層260可透過一般除去阻鍍層的方法除去。
請參照第20圖，可平坦化金屬柱270。
在除去第二阻鍍層260後，可對於金屬柱270的上方部位施以拋光製程。透過拋光製程，金屬柱270上方部位的一部份係受到拋光，以使得金屬柱270具有一預定的高度。根據本發明一較佳實施例，除去第二阻鍍層260之後，平坦化金屬柱270，但施行平坦化的製程並不限定於此。亦即，本發明所屬技術領域中具有通常知識者，可在任何除去種子層250及第一阻鍍層240的製程之後平坦化金屬柱270。
請參照第21圖，可除去種子層250。
種子層250的一部份可藉由除去第二阻鍍層260而暴露出來。因此，可除去暴露出的種子層250。可透過一般蝕刻製程除去種子層250。舉例來說，可透過閃蝕製程除去種子層250。
請參照第22圖中，可除去第一阻鍍層240。
在除去種子層250後，可除去第一阻鍍層240。可透過一般阻鍍層除去方法除去第一阻鍍層240。
當第一阻鍍層240被除去，根據本發明較佳實施例最終得到之結構的下方部位具有類似階梯的形狀，並且可形成包含具有多個直徑之金屬柱270的印刷電路板(第12圖中之印刷電路板200)。如此一來，由於金屬柱270之第二柱體部位272形成於阻焊層230的上方部位，金屬柱270和阻焊層230之間的接合面積可因此增加。且由於金屬柱270和阻焊層230之間的接合面積增加，金屬柱270和印刷電路板(第12圖中之印刷電路板200)間的接合強度可被強化。並且，由於第二柱體部位272的直徑大於第三柱體部位273的直徑，可避免於底部填充製程中在印刷電路板200和外部元件(未示於此)之間形成孔洞。
根據本發明之較佳實施例，在印刷電路板及其製造方法中，由於具有多種直徑之金屬柱，其上部的直徑(upper diameter)大，外部元件的固定穩定度可被強化。
根據本發明之較佳實施例，在印刷電路板及其製造方法中，由於金屬柱中間部位的直徑大，金屬柱及阻焊層之間的接合面積增加，以從而強化金屬柱及阻焊層之間的接 合強度。
根據本發明之較佳實施例，在印刷電路板及其製造方法中，由於具有多種直徑之金屬柱，其中間部位的直徑大，在底部填充製程中形成的孔洞可以被避免。
綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。
100、200‧‧‧印刷電路板
110、210‧‧‧基板
120、220‧‧‧電路層
121、221‧‧‧連接墊
130、230‧‧‧阻焊層
131、231‧‧‧第一開口
140、240‧‧‧第一阻鍍層
141、241‧‧‧第二開口
150、250‧‧‧種子層
160、260‧‧‧第二阻鍍層
161、261‧‧‧第三開口
170、270‧‧‧金屬柱
171、271‧‧‧第一柱體部位
172、272‧‧‧第二柱體部位
173、273‧‧‧第三柱體部位
第1圖為繪示根據本發明一較佳實施例之印刷電路板的剖面圖。
第2至11圖為依序繪示根據本發明一較佳實施例之印刷電路板的製造方法的剖面圖。
第12圖為繪示根據本發明另一較佳實施例之印刷電路板的剖面圖。
第13至22圖為依序繪示根據本發明另一較佳實施例之印刷電路板的製造方法的剖面圖。
100‧‧‧印刷電路板
110‧‧‧基板
120‧‧‧電路層
121‧‧‧連接墊
130‧‧‧阻焊層
150‧‧‧種子層
170‧‧‧金屬柱
171‧‧‧第一柱體部位
172‧‧‧第二柱體部位
173‧‧‧第三柱體部位

Claims (8)

  1. 一種印刷電路板，包括：一基板；一電路層，形成於該基板上，該電路層包含一連接墊；一阻焊層，形成於該基板之上方部位，該阻焊層具有暴露出該連接墊的一開口；一金屬柱，形成於暴露出之該連接墊及該阻焊層的上方部位，該金屬柱具有複數個直徑；以及一種子層，係沿著該金屬柱之一界面形成於該阻焊層的上方部位及該開口之內壁；其中該金屬柱包括：一第一柱體部位，形成於該開口中；一第二柱體部位，形成於該第一柱體部位與該阻焊層之上方部位；以及一第三柱體部位，形成於該第二柱體部位之上方部位；其中，該金屬柱之該第一柱體部位、該第二柱體部位及該第三柱體部位係共軸，且該第一柱體部位、該第二柱體部位與該第三柱體部位之間無明顯界面，且該金屬柱之該第二柱體部位的直徑大於該第一柱體部位的直徑及該第三柱體部位的直徑。
  2. 如申請專利範圍第1項所述之印刷電路板，其中該種子層係透過無電電鍍而形成。
  3. 如申請專利範圍第1項所述之印刷電路板，其中該 金屬柱係透過電鍍而形成。
  4. 一種製造印刷電路板的方法，該方法包括：預備一基板，在該基板之上有包含一連接墊之一電路層形成；形成一阻焊層於該基板之上方部位，該阻焊層具有一第一開口，該第一開口暴露出該連接墊；形成一第一阻鍍層於該阻焊層之上方部位，該第一阻鍍層具有一第二開口，該第二開口暴露出該第一開口，該第二開口的直徑大於該第一開口的直徑；形成一種子層於該第一阻鍍層之上方部位、該第一開口之一內壁及該第二開口之一內壁上；形成一第二阻鍍層於該種子層之上方部位，該第二阻鍍層具有一第三開口，該第三開口暴露出該第二開口，該第二開口的直徑大於該第三開口的直徑；電鍍該第一開口至該第三開口的內部以形成一金屬柱，其中該金屬柱包括一形成於該第一開口的第一第一柱體部位、一形成於該第二開口的第二柱體部位及一形成於該第三開口的第三柱體部位，該第一柱體部位、該第二柱體部位及該第三柱體部位係共軸，且該第一柱體部位、該第二柱體部位與該第三柱體部位之間無明顯界面，且該第二柱體部位的直徑大於該第一柱體部位的直徑及該第三柱體部位的直徑；除去該第二阻鍍層；除去因除去該第二阻鍍層而暴露出的該種子層；以及除去因除去該種子層而暴露出的該第一阻鍍層。
  5. 如申請專利範圍第4項所述之方法，其中形成該種子層的步驟中，係透過無電電鍍形成該種子層。
  6. 如申請專利範圍第4項所述之方法，其中形成該金屬柱的步驟中，係透過電鍍形成該金屬柱。
  7. 如申請專利範圍第4項所述之方法，更包括：在除去該第二阻鍍層後，平坦化該金屬柱。
  8. 如申請專利範圍第7項所述之方法，其中平坦化該金屬柱的步驟中，係透過拋光製程平坦化該金屬柱。
TW101105323A 2011-12-22 2012-02-17 印刷電路板及其製造方法 TWI505756B (zh)

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