JP5364905B2 - ミクロンサイズおよびナノサイズの炭素繊維を共含有する金属基複合材料 - Google Patents

ミクロンサイズおよびナノサイズの炭素繊維を共含有する金属基複合材料 Download PDF

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Publication number
JP5364905B2
JP5364905B2 JP2007547911A JP2007547911A JP5364905B2 JP 5364905 B2 JP5364905 B2 JP 5364905B2 JP 2007547911 A JP2007547911 A JP 2007547911A JP 2007547911 A JP2007547911 A JP 2007547911A JP 5364905 B2 JP5364905 B2 JP 5364905B2
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carbon fiber
metal
composite material
nano
sized
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JPWO2007063764A1 (ja
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敏之 上野
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Shimane Prefecture
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Shimane Prefecture
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/02—Pretreatment of the fibres or filaments
    • C22C47/04—Pretreatment of the fibres or filaments by coating, e.g. with a protective or activated covering
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
    • C22C47/14—Making alloys containing metallic or non-metallic fibres or filaments by powder metallurgy, i.e. by processing mixtures of metal powder and fibres or filaments
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
    • C22C49/02—Alloys containing metallic or non-metallic fibres or filaments characterised by the matrix material
    • C22C49/04—Light metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
    • C22C2026/002—Carbon nanotubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
    • Y10T428/24124—Fibers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007547911A 2005-11-30 2006-11-24 ミクロンサイズおよびナノサイズの炭素繊維を共含有する金属基複合材料 Expired - Fee Related JP5364905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007547911A JP5364905B2 (ja) 2005-11-30 2006-11-24 ミクロンサイズおよびナノサイズの炭素繊維を共含有する金属基複合材料

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005346367 2005-11-30
JP2005346367 2005-11-30
PCT/JP2006/323399 WO2007063764A1 (ja) 2005-11-30 2006-11-24 ミクロンサイズおよびナノサイズの炭素繊維を共含有する金属基複合材料
JP2007547911A JP5364905B2 (ja) 2005-11-30 2006-11-24 ミクロンサイズおよびナノサイズの炭素繊維を共含有する金属基複合材料

Publications (2)

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JPWO2007063764A1 JPWO2007063764A1 (ja) 2009-05-07
JP5364905B2 true JP5364905B2 (ja) 2013-12-11

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JP2007547911A Expired - Fee Related JP5364905B2 (ja) 2005-11-30 2006-11-24 ミクロンサイズおよびナノサイズの炭素繊維を共含有する金属基複合材料

Country Status (7)

Country Link
US (1) US8206815B2 (de)
EP (1) EP1956110B1 (de)
JP (1) JP5364905B2 (de)
KR (1) KR101007621B1 (de)
CN (1) CN101321887A (de)
DE (1) DE602006018188D1 (de)
WO (1) WO2007063764A1 (de)

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CN103079805B (zh) 2009-12-14 2015-02-11 应用纳米结构方案公司 含有碳纳米管并入的纤维材料的防火复合材料和制品
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Also Published As

Publication number Publication date
JPWO2007063764A1 (ja) 2009-05-07
WO2007063764A1 (ja) 2007-06-07
EP1956110A1 (de) 2008-08-13
US20090136707A1 (en) 2009-05-28
US8206815B2 (en) 2012-06-26
CN101321887A (zh) 2008-12-10
EP1956110B1 (de) 2010-11-10
KR20080066833A (ko) 2008-07-16
KR101007621B1 (ko) 2011-01-12
DE602006018188D1 (de) 2010-12-23
EP1956110A4 (de) 2009-09-02

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