FR3014596B1 - Film thermiquement conducteur permettant d'evacuer la chaleur preferentiellement dans une ou plusieurs directions de son plan - Google Patents

Film thermiquement conducteur permettant d'evacuer la chaleur preferentiellement dans une ou plusieurs directions de son plan

Info

Publication number
FR3014596B1
FR3014596B1 FR1362413A FR1362413A FR3014596B1 FR 3014596 B1 FR3014596 B1 FR 3014596B1 FR 1362413 A FR1362413 A FR 1362413A FR 1362413 A FR1362413 A FR 1362413A FR 3014596 B1 FR3014596 B1 FR 3014596B1
Authority
FR
France
Prior art keywords
plan
directions
conductive film
thermally conductive
discharging heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1362413A
Other languages
English (en)
Other versions
FR3014596A1 (fr
Inventor
Jamaa Haykel Ben
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1362413A priority Critical patent/FR3014596B1/fr
Publication of FR3014596A1 publication Critical patent/FR3014596A1/fr
Application granted granted Critical
Publication of FR3014596B1 publication Critical patent/FR3014596B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Carbon And Carbon Compounds (AREA)
FR1362413A 2013-12-11 2013-12-11 Film thermiquement conducteur permettant d'evacuer la chaleur preferentiellement dans une ou plusieurs directions de son plan Expired - Fee Related FR3014596B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1362413A FR3014596B1 (fr) 2013-12-11 2013-12-11 Film thermiquement conducteur permettant d'evacuer la chaleur preferentiellement dans une ou plusieurs directions de son plan

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1362413A FR3014596B1 (fr) 2013-12-11 2013-12-11 Film thermiquement conducteur permettant d'evacuer la chaleur preferentiellement dans une ou plusieurs directions de son plan

Publications (2)

Publication Number Publication Date
FR3014596A1 FR3014596A1 (fr) 2015-06-12
FR3014596B1 true FR3014596B1 (fr) 2017-04-21

Family

ID=50473433

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1362413A Expired - Fee Related FR3014596B1 (fr) 2013-12-11 2013-12-11 Film thermiquement conducteur permettant d'evacuer la chaleur preferentiellement dans une ou plusieurs directions de son plan

Country Status (1)

Country Link
FR (1) FR3014596B1 (fr)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110505A (en) * 1976-12-17 1978-08-29 United Technologies Corp. Quick bond composite and process
JP4431679B2 (ja) * 2004-01-13 2010-03-17 島根県 複合材およびその製造方法
JP2005272164A (ja) * 2004-03-23 2005-10-06 Matsushita Electric Ind Co Ltd 高熱伝導性部材及びその製造方法、並びにそれを用いた放熱システム
JP5145591B2 (ja) * 2004-11-09 2013-02-20 島根県 金属基炭素繊維複合材料の製造方法
KR101007621B1 (ko) * 2005-11-30 2011-01-12 시마네켄 미크론 사이즈 및 나노 사이즈의 탄소섬유를 모두 함유하는금속기 복합재료
CN101652382B (zh) * 2006-12-04 2016-04-06 特拉维夫大学拉莫特有限公司 有机纳米结构阵列的形成
FR2924861B1 (fr) * 2007-12-07 2010-02-12 Thales Sa Dispositif electronique comportant un film a base de nanotubes de carbonne pour assurer la gestion thermique et son procede de fabrication
AU2011220397B2 (en) * 2010-02-27 2015-09-03 Nuovo Film Suzhou China Inc. Structures with surface-embedded additives and related manufacturing methods
JP2011258755A (ja) * 2010-06-09 2011-12-22 Denso Corp 熱拡散体および発熱体の冷却装置
JP5316602B2 (ja) * 2010-12-16 2013-10-16 株式会社日本自動車部品総合研究所 熱拡散部材の接合構造、発熱体の冷却構造、及び熱拡散部材の接合方法
CN103178027B (zh) * 2011-12-21 2016-03-09 清华大学 散热结构及应用该散热结构的电子设备

Also Published As

Publication number Publication date
FR3014596A1 (fr) 2015-06-12

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