JP5346765B2 - 成膜用基板、成膜方法、及び発光装置の作製方法 - Google Patents
成膜用基板、成膜方法、及び発光装置の作製方法 Download PDFInfo
- Publication number
- JP5346765B2 JP5346765B2 JP2009239102A JP2009239102A JP5346765B2 JP 5346765 B2 JP5346765 B2 JP 5346765B2 JP 2009239102 A JP2009239102 A JP 2009239102A JP 2009239102 A JP2009239102 A JP 2009239102A JP 5346765 B2 JP5346765 B2 JP 5346765B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- film
- layer
- substrate
- organic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009239102A JP5346765B2 (ja) | 2008-10-20 | 2009-10-16 | 成膜用基板、成膜方法、及び発光装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008270293 | 2008-10-20 | ||
| JP2008270293 | 2008-10-20 | ||
| JP2009239102A JP5346765B2 (ja) | 2008-10-20 | 2009-10-16 | 成膜用基板、成膜方法、及び発光装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010121207A JP2010121207A (ja) | 2010-06-03 |
| JP2010121207A5 JP2010121207A5 (enExample) | 2012-08-30 |
| JP5346765B2 true JP5346765B2 (ja) | 2013-11-20 |
Family
ID=42108916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009239102A Expired - Fee Related JP5346765B2 (ja) | 2008-10-20 | 2009-10-16 | 成膜用基板、成膜方法、及び発光装置の作製方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8486736B2 (enExample) |
| JP (1) | JP5346765B2 (enExample) |
| KR (1) | KR101611890B1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI452157B (zh) * | 2010-02-09 | 2014-09-11 | Ind Tech Res Inst | 一種面型蒸鍍源及其蒸鍍方法與系統 |
| CN102477538B (zh) * | 2010-11-26 | 2015-06-10 | 财团法人工业技术研究院 | 面型蒸镀源及其蒸镀方法与系统 |
| US10170315B2 (en) | 2013-07-17 | 2019-01-01 | Globalfoundries Inc. | Semiconductor device having local buried oxide |
| KR20150012530A (ko) * | 2013-07-25 | 2015-02-04 | 삼성디스플레이 주식회사 | 전사용 도너 기판 및 유기 발광 표시 장치의 제조 방법 |
| US9252272B2 (en) | 2013-11-18 | 2016-02-02 | Globalfoundries Inc. | FinFET semiconductor device having local buried oxide |
| DE102014116244A1 (de) * | 2014-07-07 | 2016-01-07 | Von Ardenne Gmbh | Beschichtungsanordnung |
| CN108539057B (zh) * | 2018-05-16 | 2019-07-02 | 深圳市华星光电技术有限公司 | Oled封装方法及oled封装结构 |
| JP7294858B2 (ja) * | 2019-04-09 | 2023-06-20 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
Family Cites Families (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3801730B2 (ja) | 1997-05-09 | 2006-07-26 | 株式会社半導体エネルギー研究所 | プラズマcvd装置及びそれを用いた薄膜形成方法 |
| US5937272A (en) | 1997-06-06 | 1999-08-10 | Eastman Kodak Company | Patterned organic layers in a full-color organic electroluminescent display array on a thin film transistor array substrate |
| US5851709A (en) | 1997-10-31 | 1998-12-22 | Eastman Kodak Company | Method for selective transfer of a color organic layer |
| US6165543A (en) | 1998-06-17 | 2000-12-26 | Nec Corporation | Method of making organic EL device and organic EL transfer base plate |
| JP3740557B2 (ja) | 1999-03-09 | 2006-02-01 | 独立行政法人産業技術総合研究所 | 有機薄膜作製方法および有機薄膜作製装置 |
| TWI232595B (en) | 1999-06-04 | 2005-05-11 | Semiconductor Energy Lab | Electroluminescence display device and electronic device |
| US8853696B1 (en) | 1999-06-04 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and electronic device |
| TW501379B (en) | 2000-07-25 | 2002-09-01 | Eastman Kodak Co | Method of making organic electroluminescent device using laser transfer |
| JP2002359075A (ja) | 2001-03-29 | 2002-12-13 | Sharp Corp | 有機エレクトロルミネッセンス表示パネルおよびその製造方法 |
| JP4595232B2 (ja) * | 2001-04-05 | 2010-12-08 | ソニー株式会社 | 薄膜パターンの形成方法および有機電界発光表示装置の製造方法 |
| SG114589A1 (en) | 2001-12-12 | 2005-09-28 | Semiconductor Energy Lab | Film formation apparatus and film formation method and cleaning method |
| US6695029B2 (en) | 2001-12-12 | 2004-02-24 | Eastman Kodak Company | Apparatus for permitting transfer of organic material from a donor to form a layer in an OLED device |
| US6610455B1 (en) | 2002-01-30 | 2003-08-26 | Eastman Kodak Company | Making electroluminscent display devices |
| US6703179B2 (en) | 2002-03-13 | 2004-03-09 | Eastman Kodak Company | Transfer of organic material from a donor to form a layer in an OLED device |
| US6566032B1 (en) | 2002-05-08 | 2003-05-20 | Eastman Kodak Company | In-situ method for making OLED devices that are moisture or oxygen-sensitive |
| JP4401688B2 (ja) * | 2002-06-07 | 2010-01-20 | 株式会社半導体エネルギー研究所 | 発光装置およびその作製方法、並びに電子機器 |
| US6811938B2 (en) | 2002-08-29 | 2004-11-02 | Eastman Kodak Company | Using fiducial marks on a substrate for laser transfer of organic material from a donor to a substrate |
| JP2004103406A (ja) | 2002-09-10 | 2004-04-02 | Sony Corp | 薄膜パターン形成方法および装置並びに有機el表示装置の製造方法 |
| JP4627961B2 (ja) | 2002-09-20 | 2011-02-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US20040191564A1 (en) | 2002-12-17 | 2004-09-30 | Samsung Sdi Co., Ltd. | Donor film for low molecular weight full color organic electroluminescent device using laser induced thermal imaging method and method for fabricating low molecular weight full color organic electroluminescent device using the film |
| JP4493926B2 (ja) | 2003-04-25 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 製造装置 |
| US20050145326A1 (en) | 2004-01-05 | 2005-07-07 | Eastman Kodak Company | Method of making an OLED device |
| KR100667069B1 (ko) * | 2004-10-19 | 2007-01-10 | 삼성에스디아이 주식회사 | 도너 기판 및 그를 사용한 유기전계발광표시장치의 제조방법 |
| JP2006228649A (ja) | 2005-02-21 | 2006-08-31 | Seiko Epson Corp | 有機el装置の製造方法、蒸着ボート |
| JP2006244944A (ja) * | 2005-03-07 | 2006-09-14 | Seiko Epson Corp | 有機el装置の製造方法、蒸着ボート |
| TWI307612B (en) | 2005-04-27 | 2009-03-11 | Sony Corp | Transfer method and transfer apparatus |
| JP2006309995A (ja) | 2005-04-27 | 2006-11-09 | Sony Corp | 転写用基板および表示装置の製造方法ならびに表示装置 |
| JP4449890B2 (ja) | 2005-11-21 | 2010-04-14 | ソニー株式会社 | 転写用基板および転写方法ならびに表示装置の製造方法 |
| TWI412079B (zh) | 2006-07-28 | 2013-10-11 | 半導體能源研究所股份有限公司 | 製造顯示裝置的方法 |
| TWI427702B (zh) | 2006-07-28 | 2014-02-21 | 半導體能源研究所股份有限公司 | 顯示裝置的製造方法 |
| KR101346246B1 (ko) | 2006-08-24 | 2013-12-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 제작방법 |
| US8563431B2 (en) | 2006-08-25 | 2013-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| US8148259B2 (en) | 2006-08-30 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2008066147A (ja) | 2006-09-07 | 2008-03-21 | Fuji Electric Holdings Co Ltd | 蒸着によるパターン形成方法、該方法を含む色変換フィルタ基板およびカラー有機el素子の製造方法 |
| JP2008071933A (ja) * | 2006-09-14 | 2008-03-27 | Konica Minolta Holdings Inc | ドナーシート、ドナーシートの製造方法、有機薄膜トランジスタの製造方法 |
| KR101563237B1 (ko) | 2007-06-01 | 2015-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 제조장치 및 발광장치 제작방법 |
| KR20090028413A (ko) | 2007-09-13 | 2009-03-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광장치 제작방법 및 증착용 기판 |
| US8153201B2 (en) | 2007-10-23 | 2012-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing light-emitting device, and evaporation donor substrate |
| KR20090041314A (ko) | 2007-10-23 | 2009-04-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 증착용 기판 및 발광장치의 제조방법 |
| US8425974B2 (en) | 2007-11-29 | 2013-04-23 | Semiconductor Energy Laboratory Co., Ltd. | Evaporation donor substrate and method for manufacturing light-emitting device |
| US7707874B2 (en) * | 2007-12-11 | 2010-05-04 | Toyota Jidosha Kabushiki Kaisha | Misfire determination device and method for internal combustion engine, and vehicle including misfire determination device |
| KR101689519B1 (ko) | 2007-12-26 | 2016-12-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 증착용 기판, 증착용 기판의 제조방법, 및 발광장치의 제조방법 |
| US8080811B2 (en) | 2007-12-28 | 2011-12-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing evaporation donor substrate and light-emitting device |
| WO2009099002A1 (en) | 2008-02-04 | 2009-08-13 | Semiconductor Energy Laboratory Co., Ltd. | Deposition method and method for manufacturing light-emitting device |
| JP5244680B2 (ja) | 2008-04-14 | 2013-07-24 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
| US8409672B2 (en) | 2008-04-24 | 2013-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing evaporation donor substrate and method of manufacturing light-emitting device |
| US8574709B2 (en) | 2008-07-21 | 2013-11-05 | Semiconductor Energy Laboratory Co., Ltd. | Deposition donor substrate and method for manufacturing light-emitting device |
-
2009
- 2009-10-14 US US12/579,067 patent/US8486736B2/en not_active Expired - Fee Related
- 2009-10-16 KR KR1020090098599A patent/KR101611890B1/ko not_active Expired - Fee Related
- 2009-10-16 JP JP2009239102A patent/JP5346765B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR101611890B1 (ko) | 2016-04-12 |
| US20100098879A1 (en) | 2010-04-22 |
| US8486736B2 (en) | 2013-07-16 |
| KR20100044101A (ko) | 2010-04-29 |
| JP2010121207A (ja) | 2010-06-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5416987B2 (ja) | 成膜方法及び発光装置の作製方法 | |
| JP5244680B2 (ja) | 発光装置の作製方法 | |
| JP5132516B2 (ja) | 蒸着用基板 | |
| JP5180012B2 (ja) | 発光装置の作製方法 | |
| JP5728068B2 (ja) | 成膜用基板 | |
| JP5247410B2 (ja) | 蒸着用基板、蒸着用基板の作製方法、および蒸着方法 | |
| JP5203994B2 (ja) | 成膜方法および発光装置の作製方法 | |
| JP5394048B2 (ja) | 蒸着用基板 | |
| JP5635737B2 (ja) | 成膜方法 | |
| JP5161154B2 (ja) | 発光装置の作製方法 | |
| JP5410791B2 (ja) | 成膜方法および発光装置の作製方法 | |
| JP5238587B2 (ja) | 発光装置の作製方法 | |
| JP2009120946A (ja) | 成膜方法および発光装置の作製方法 | |
| JP5346765B2 (ja) | 成膜用基板、成膜方法、及び発光装置の作製方法 | |
| KR20090096323A (ko) | 성막방법 및 발광장치 제조방법 | |
| JP2009295574A (ja) | 成膜用基板及びその基板を用いた成膜方法、発光装置、照明装置及び電子機器 | |
| JP2009283455A (ja) | 蒸着用基板の作製方法、および発光装置の作製方法 | |
| JP5238544B2 (ja) | 成膜方法及び発光装置の作製方法 | |
| JP5438313B2 (ja) | 成膜方法 | |
| JP2010251144A (ja) | 成膜用基板および成膜方法 | |
| JP5367415B2 (ja) | 発光装置の作製方法及び成膜用基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120716 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120716 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130725 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130806 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130819 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5346765 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |