JP5330013B2 - エポキシ樹脂組成物および硬化物 - Google Patents
エポキシ樹脂組成物および硬化物 Download PDFInfo
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- JP5330013B2 JP5330013B2 JP2009029472A JP2009029472A JP5330013B2 JP 5330013 B2 JP5330013 B2 JP 5330013B2 JP 2009029472 A JP2009029472 A JP 2009029472A JP 2009029472 A JP2009029472 A JP 2009029472A JP 5330013 B2 JP5330013 B2 JP 5330013B2
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- Prior art keywords
- epoxy resin
- group
- resin composition
- bifunctional
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 118
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 118
- 239000000203 mixture Substances 0.000 title claims abstract description 72
- 150000002989 phenols Chemical class 0.000 claims abstract description 39
- 239000011256 inorganic filler Substances 0.000 claims abstract description 34
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 34
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000004305 biphenyl Substances 0.000 claims abstract description 20
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 54
- 230000001588 bifunctional effect Effects 0.000 claims description 28
- -1 4,4′-dihydroxydiphenyl ester Chemical class 0.000 claims description 21
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 17
- 238000000465 moulding Methods 0.000 claims description 13
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 125000005843 halogen group Chemical group 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 125000005650 substituted phenylene group Chemical group 0.000 claims description 6
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 5
- GXEVFESZEWKRAP-UHFFFAOYSA-N bis(3-hydroxyphenyl) benzene-1,4-dicarboxylate Chemical compound OC1=CC=CC(OC(=O)C=2C=CC(=CC=2)C(=O)OC=2C=C(O)C=CC=2)=C1 GXEVFESZEWKRAP-UHFFFAOYSA-N 0.000 claims description 4
- MLWDFHBGADSHPT-UHFFFAOYSA-N bis(4-hydroxyphenyl) benzene-1,3-dicarboxylate Chemical compound C1=CC(O)=CC=C1OC(=O)C1=CC=CC(C(=O)OC=2C=CC(O)=CC=2)=C1 MLWDFHBGADSHPT-UHFFFAOYSA-N 0.000 claims description 4
- PZKYPEIOGNUSOC-UHFFFAOYSA-N bis(4-hydroxyphenyl) benzene-1,4-dicarboxylate Chemical compound C1=CC(O)=CC=C1OC(=O)C1=CC=C(C(=O)OC=2C=CC(O)=CC=2)C=C1 PZKYPEIOGNUSOC-UHFFFAOYSA-N 0.000 claims description 4
- 150000002148 esters Chemical group 0.000 claims description 4
- 125000006267 biphenyl group Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 3
- 239000004848 polyfunctional curative Substances 0.000 abstract 4
- 239000002075 main ingredient Substances 0.000 abstract 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 22
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 22
- 239000000047 product Substances 0.000 description 21
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 17
- 229920003986 novolac Polymers 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 10
- 239000007795 chemical reaction product Substances 0.000 description 9
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- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
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- 238000002156 mixing Methods 0.000 description 8
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- 150000001875 compounds Chemical class 0.000 description 7
- 239000007822 coupling agent Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
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- 150000003022 phthalic acids Chemical class 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 6
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000012776 electronic material Substances 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 150000005165 hydroxybenzoic acids Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- GGNQRNBDZQJCCN-UHFFFAOYSA-N benzene-1,2,4-triol Chemical compound OC1=CC=C(O)C(O)=C1 GGNQRNBDZQJCCN-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229910002026 crystalline silica Inorganic materials 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 4
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 4
- ZUVBIBLYOCVYJU-UHFFFAOYSA-N naphthalene-1,7-diol Chemical compound C1=CC=C(O)C2=CC(O)=CC=C21 ZUVBIBLYOCVYJU-UHFFFAOYSA-N 0.000 description 4
- OENHRRVNRZBNNS-UHFFFAOYSA-N naphthalene-1,8-diol Chemical compound C1=CC(O)=C2C(O)=CC=CC2=C1 OENHRRVNRZBNNS-UHFFFAOYSA-N 0.000 description 4
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- 229960001755 resorcinol Drugs 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- LXEJRKJRKIFVNY-UHFFFAOYSA-N terephthaloyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C=C1 LXEJRKJRKIFVNY-UHFFFAOYSA-N 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 150000005205 dihydroxybenzenes Chemical class 0.000 description 3
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- XOOMNEFVDUTJPP-UHFFFAOYSA-N naphthalene-1,3-diol Chemical compound C1=CC=CC2=CC(O)=CC(O)=C21 XOOMNEFVDUTJPP-UHFFFAOYSA-N 0.000 description 3
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 3
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 3
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- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
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- 125000000524 functional group Chemical group 0.000 description 2
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
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- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- XSTITJMSUGCZDH-UHFFFAOYSA-N 4-(4-hydroxy-2,6-dimethylphenyl)-3,5-dimethylphenol Chemical group CC1=CC(O)=CC(C)=C1C1=C(C)C=C(O)C=C1C XSTITJMSUGCZDH-UHFFFAOYSA-N 0.000 description 1
- AZZWZMUXHALBCQ-UHFFFAOYSA-N 4-[(4-hydroxy-3,5-dimethylphenyl)methyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(CC=2C=C(C)C(O)=C(C)C=2)=C1 AZZWZMUXHALBCQ-UHFFFAOYSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- CJLPIPXJJJUBIV-UHFFFAOYSA-N 4-[3-(4-hydroxyphenoxy)phenoxy]phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=CC(OC=2C=CC(O)=CC=2)=C1 CJLPIPXJJJUBIV-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- LYWVNPSVLAFTFX-UHFFFAOYSA-N 4-methylbenzenesulfonate;morpholin-4-ium Chemical compound C1COCCN1.CC1=CC=C(S(O)(=O)=O)C=C1 LYWVNPSVLAFTFX-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- IXCOKTMGCRJMDR-UHFFFAOYSA-N 9h-fluorene;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.C1=CC=C2CC3=CC=CC=C3C2=C1 IXCOKTMGCRJMDR-UHFFFAOYSA-N 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical class [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
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- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 150000001638 boron Chemical class 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N c1ccccc1 Chemical compound c1ccccc1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- PVAONLSZTBKFKM-UHFFFAOYSA-N diphenylmethanediol Chemical compound C=1C=CC=CC=1C(O)(O)C1=CC=CC=C1 PVAONLSZTBKFKM-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 235000013872 montan acid ester Nutrition 0.000 description 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
- MAWJJKFGKLKRKN-UHFFFAOYSA-N naphthalene-1,5-diol naphthalene-2,6-diol Chemical compound OC1=CC=CC2=C(C=CC=C12)O.OC1=CC2=CC=C(C=C2C=C1)O MAWJJKFGKLKRKN-UHFFFAOYSA-N 0.000 description 1
- JRNGUTKWMSBIBF-UHFFFAOYSA-N naphthalene-2,3-diol Chemical compound C1=CC=C2C=C(O)C(O)=CC2=C1 JRNGUTKWMSBIBF-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- OVARTBFNCCXQKS-UHFFFAOYSA-N propan-2-one;hydrate Chemical compound O.CC(C)=O OVARTBFNCCXQKS-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 238000009757 thermoplastic moulding Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
HO-Ar1-OOC-Ar2-COO-Ar1-OH (a)
HO-Ar1-OOC-Ar3-OH (b)
HO-Ar3-COO-Ar2-OOC-Ar3-OH (c)
ここで、Ar1、Ar2及びAr3は、独立にフェニレン基、または一般式(1)におけるR1、R2と同様な置換基を有する置換フェニレン基である。置換フェニレン基としては、ハロゲン原子、炭素数1〜8の炭化水素基または炭素数1〜8のアルコキシ基を1〜3個有する置換フェニレン基がある。また、Ar1、Ar2及びAr3は、それぞれ、フタル酸類、2官能性のフェノール類及びヒドロキシ安息香酸類に由来する残基と見ることもできる。
2Lフラスコに4−ヒドロキシ安息香酸207g(1.5mol)とハイドロキノン165g (1.5 mol)、ホウ酸3g 、キシレン900mLを加え攪拌し、濃硫酸4.1gを少しずつ滴下した。その後還流脱水し、脱水量より反応を確認して30分攪拌した後、室温でろ過し固形物を取り出した。それを再びフラスコに戻し1%炭酸水素ナトリウム水溶液500mLで中和した。ろ過後、固形物を水600mLで水洗し乾燥した。さらに、過熱してアセトンに溶解後、水を加えて結晶を析出させ、その後、ろ過、乾燥して白色固体164.6gを得た。
2Lフラスコにハイドロキノン110g (1.0mol)をアセトン480 mLとピリジン81.5mL(1.0 mol)を仕込み、氷浴冷却中において攪拌しながらアセトン720mLに溶解したテレフタル酸クロライド100g(0.49 mol)を約30分かけて滴下した。1時間攪拌後、混合物をろ過し、固形分を水600mlで数回洗浄し乾燥した後、白色固体146.1gを得た。DSC法に基づく融点は291.6℃、GPC測定より求められたビス(4−ヒドロキシフェニル)テレフタレートの純度は86.2%、ハイドロキノンとテレフタル酸クロライドの3:2の反応物が7.6%、4:3の反応物が2.3%であった。水酸基当量は186g/eq.であった。
2Lフラスコにレゾルシン88g (0.8mol)をアセトン384mlとピリジン65 mL(0.8 mol)を仕込み、氷浴冷却中において攪拌しながらアセトン580 mlに溶解したテレフタル酸クロライド80 g( 0.39mol)を約1時間かけて滴下した。1時間攪拌後、混合物をろ過し、ろ液を回収してアセトンを600ml留去し、1Lの水に滴下しろ過を行い、水洗を繰り返し白色固体88.0gを得た。DSC法に基づく融点のピークは153.5−161.0および270.3 ℃に認められた。GPC測定より求められたビス(3−ヒドロキシフェニル)テレフタレートの純度は48.5%、レゾルシンとテレフタル酸クロライドの3:2の反応物が34.8%、4:3の反応物が14.1%、5:4の反応物が1.8%であった。水酸基当量は263g/eq.であった。
2Lセパラフラスコにハイドロキノン110g (1.0 mol)をアセトン480 mLとピリジン81.5 mL( 1.0 mol)を仕込み、氷浴冷却中において攪拌しながら、アセトン700 mL中のイソフタル酸クロライド100g(0.49 mol)を1時間かけて滴下した。さらに1時間攪拌後、混合物をろ過し、固形分を水600mLで数回洗浄した後、ろ液を回収しアセトンを約300mL留去し、水2600mLに滴下した。ここで生じた固形物をろ過により取り出し、乾燥後白色固体121.0gを得た。DSC法に基づく融点のピークは162.3、および194.2℃に認められた。GPC測定より求められたビス(4−ヒドロキシフェニル)イソフタレートの純度は66.9%、ハイドロキノンとイソフタル酸クロライドの3:2の反応物が29.9%、4:3の反応物が1.9%であった。水酸基当量は244g/eq.であった。
2Lセパラフラスコに4,4’−ビスフェノールF 105g (0.52 mol)をアセトン480 mlとピリジン44mL(0.55mol)中を仕込み、氷浴冷却中において攪拌しながらアセトン360 mLに溶解したテレフタル酸クロライド49.9g( 0.25mol)を約30分かけて滴下した。1時間攪拌後、混合物をろ過し、固形分を水600mLで数回洗浄し乾燥した後、白色個体を77.0g得た。DSC法に基づく融点のピークは190.8、および219.2℃に認められた。GPC測定より求められたビス(4−(4−ヒドロキシベンジル)フェニル)テレフタレートの純度は18.8%、4,4’−ビスフェノールFとテレフタル酸クロライドの3:2の反応物が35.9%、4:3の反応物が23.1%、5:4以上の反応物が10.4%、未反応4,4’−ビスフェノールFが9.7%であった。水酸基当量は557g/eq.であった。
エポキシ樹脂として、ビフェニル系エポキシ樹脂(エポキシ樹脂A:ジャパンエポキシレジン製、YL−6121(4,4’−ジヒドロキシビフェニルのエポキシ化物と3,3’,5,5’−テトラメチル−4,4’−ジヒドロキシビフェニルのエポキシ化物との1:1の混合物)、エポキシ当量183)、ジフェニルエーテル系エポキシ樹脂(エポキシ樹脂B:東都化成製、YSLV−80DE、エポキシ当量175)を使用する。硬化剤として、
参考例1で得たジヒドロキシエステル化合物(硬化剤A)、参考例2で得たジヒドロキシエステル化合物(硬化剤B)、参考例3で得たジヒドロキシエステル化合物(硬化剤C)、参考例4で得たジヒドロキシエステル化合物(硬化剤D)、および参考例5で得たジヒドロキシエステル化合物(硬化剤E)、4,4’−ジヒドロキシジフェニルメタン(硬化剤F)、フェノ−ルノボラック(硬化剤G:群栄化学製、PSM−4261;OH当量103、軟化点 80℃)を使用する。硬化促進剤としてトリフェニルホスフィン、無機充填材として、球状アルミナ(平均粒径12.2μm)を使用する。
(1)熱伝導率
熱伝導率は、NETZSCH製LFA447型熱伝導率計を用いて非定常熱線法により測定した。
(2)融点、融解熱の測定(DSC法)
示差走査熱量分析装置(セイコーインスツル製DSC6200型)を用い、昇温速度10℃/分で測定した。
(3)熱(線)膨張係数、ガラス転移温度
熱膨張係数およびガラス転移温度は、セイコーインスツル(株)製TMA120C型熱機械測定装置を用いて、昇温速度10℃/分にて測定した。
(3)吸水率
直径50mm、厚さ3mmの円盤を成形し、ポストキュア後、85℃、相対湿度85%の条件で100時間吸湿させた後の重量変化率とした。
Claims (10)
- ジフェニルエステル構造を有する二官能性のフェノール性化合物が、下記式(a)〜(c)から選ばれる少なくとも1種のフェノール性化合物である請求項1に記載のエポキシ樹脂組成物。
HO-Ar1-OOC-Ar2-COO-Ar1-OH (a)
HO-Ar1-OOC-Ar3-OH (b)
HO-Ar3-COO-Ar2-OOC-Ar3-OH (c)
(但し、Ar1、Ar2及びAr3は、独立にフェニレン基、またはハロゲン原子、炭素数1〜8の炭化水素基、炭素数1〜8のアルコキシ基を1〜3個有する置換フェニレン基、または‐A‐CH2‐A‐若しくは-A-A-で表わされる基を示す。ここで、Aはフェニレン基または上記置換フェニレン基である。) - ジフェニルエステル構造を有する二官能性のフェノール性化合物が、4,4’−ジヒドロキシジフェニルエステル、ビス(4−ヒドロキシフェニル)テレフタレート、ビス(3−ヒドロキシフェニル)テレフタレート、ビス(4−ヒドロキシフェニル)イソフタレート、ビス(4−ヒドロキシベンゾイルオキシ)−p−フェニレンまたはビス(4−ヒドロキシベンゾイルオキシ)−m−フェニレンである請求項1に記載のエポキシ樹脂組成物。
- 二官能性のエポキシ樹脂が、メソゲン基を有する二官能性のエポキシ樹脂である請求項1〜3のいずれかに記載のエポキシ樹脂組成物。
- 二官能性のエポキシ樹脂が下記式(2)で表されるビスフェニレン構造を有するエポキシ樹脂である請求項1〜4のいずれかに記載のエポキシ樹脂組成物。
- ビスフェニレン構造を有するエポキシ樹脂の配合割合が、全エポキシ樹脂の80wt%以上である請求項5に記載のエポキシ樹脂組成物。
- 硬化剤成分中の80wt%以上が、二官能性のフェノール系硬化剤である請求項1〜6のいずれかに記載のエポキシ樹脂組成物。
- エポキシ樹脂成分中の90wt%以上が、二官能性のエポキシ樹脂である請求項1〜7のいずれかに記載のエポキシ樹脂組成物。
- 無機充填材の50wt%以上が球状のアルミナである請求項1〜8のいずれかに記載のエポキシ樹脂組成物。
- 請求項1〜9のいずれかに記載のエポキシ樹脂組成物を成形硬化して得られることを特徴とする硬化物。
Priority Applications (1)
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JP2012197366A (ja) * | 2011-03-22 | 2012-10-18 | Nippon Steel Chem Co Ltd | エポキシ樹脂組成物および成形物 |
CN102675112B (zh) * | 2012-05-21 | 2013-12-18 | 山东凯盛新材料股份有限公司 | 间苯二甲酸二苯酯的合成方法 |
KR101987260B1 (ko) * | 2012-10-31 | 2019-06-11 | 엘지이노텍 주식회사 | 에폭시 수지, 에폭시 수지 조성물 및 이를 이용한 방열회로기판 |
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KR102104524B1 (ko) * | 2013-08-23 | 2020-04-24 | 엘지이노텍 주식회사 | 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판 |
JP6376395B2 (ja) * | 2014-12-05 | 2018-08-22 | Dic株式会社 | 活性エステル化合物、活性エステル樹脂、硬化性組成物、その硬化物、ビルドアップフィルム、半導体封止材料、プリプレグ、回路基板、及び活性エステル樹脂の製造方法 |
TWI620763B (zh) * | 2017-04-27 | 2018-04-11 | Taiwan Union Technology Corporation | 樹脂組成物、及使用該樹脂組成物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
TWI766025B (zh) * | 2017-06-28 | 2022-06-01 | 日商迪愛生股份有限公司 | 活性酯化合物及硬化性組成物 |
JP6608908B2 (ja) * | 2017-12-25 | 2019-11-20 | 積水化学工業株式会社 | 樹脂材料及び多層プリント配線板 |
JP7000279B2 (ja) * | 2018-08-29 | 2022-01-19 | 上野製薬株式会社 | 1,3-ビス(4-メチルベンゾイルオキシ)ベンゼン及びその製造方法 |
WO2020067016A1 (ja) * | 2018-09-27 | 2020-04-02 | 日立化成株式会社 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
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JP2022007637A (ja) | 2020-06-26 | 2022-01-13 | 日鉄ケミカル&マテリアル株式会社 | 多価ヒドロキシ樹脂、その製造方法、及びそれを含むエポキシ樹脂組成物、並びにエポキシ樹脂硬化物 |
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