JP5308814B2 - サーモパイル赤外線センサアレイ - Google Patents

サーモパイル赤外線センサアレイ Download PDF

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Publication number
JP5308814B2
JP5308814B2 JP2008511546A JP2008511546A JP5308814B2 JP 5308814 B2 JP5308814 B2 JP 5308814B2 JP 2008511546 A JP2008511546 A JP 2008511546A JP 2008511546 A JP2008511546 A JP 2008511546A JP 5308814 B2 JP5308814 B2 JP 5308814B2
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JP
Japan
Prior art keywords
thermopile
sensor array
infrared sensor
sensor
thermopile infrared
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2008511546A
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English (en)
Japanese (ja)
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JP2008541102A5 (enExample
JP2008541102A (ja
Inventor
レーネケ・ヴィルヘルム
ジーモン・マーリオン
シュルツェ・ミシャ
シュトルック・カールハインツ
シーファーデッカー・イェルク
Original Assignee
ハイマン・ゼンゾル・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング
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Publication of JP2008541102A publication Critical patent/JP2008541102A/ja
Publication of JP2008541102A5 publication Critical patent/JP2008541102A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/20—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals
    • H04N25/21—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals for transforming thermal infrared radiation into image signals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
JP2008511546A 2005-05-17 2006-05-16 サーモパイル赤外線センサアレイ Expired - Fee Related JP5308814B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005023333.3 2005-05-17
DE102005023333 2005-05-17
PCT/DE2006/000841 WO2006122529A2 (de) 2005-05-17 2006-05-16 Thermopile infrarot sensorarray

Publications (3)

Publication Number Publication Date
JP2008541102A JP2008541102A (ja) 2008-11-20
JP2008541102A5 JP2008541102A5 (enExample) 2011-08-18
JP5308814B2 true JP5308814B2 (ja) 2013-10-09

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Family Applications (1)

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JP2008511546A Expired - Fee Related JP5308814B2 (ja) 2005-05-17 2006-05-16 サーモパイル赤外線センサアレイ

Country Status (4)

Country Link
US (1) US7842922B2 (enExample)
JP (1) JP5308814B2 (enExample)
DE (1) DE112006000959B4 (enExample)
WO (1) WO2006122529A2 (enExample)

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Also Published As

Publication number Publication date
US20080216883A1 (en) 2008-09-11
DE112006000959A5 (de) 2008-01-24
WO2006122529A2 (de) 2006-11-23
US7842922B2 (en) 2010-11-30
WO2006122529A3 (de) 2007-01-25
JP2008541102A (ja) 2008-11-20
DE112006000959B4 (de) 2012-03-29

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