DE112006000959A5 - Thermopile Infrarot Sensorarray - Google Patents

Thermopile Infrarot Sensorarray Download PDF

Info

Publication number
DE112006000959A5
DE112006000959A5 DE112006000959T DE112006000959T DE112006000959A5 DE 112006000959 A5 DE112006000959 A5 DE 112006000959A5 DE 112006000959 T DE112006000959 T DE 112006000959T DE 112006000959 T DE112006000959 T DE 112006000959T DE 112006000959 A5 DE112006000959 A5 DE 112006000959A5
Authority
DE
Germany
Prior art keywords
infrared sensor
sensor array
thermopile infrared
thermopile
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112006000959T
Other languages
English (en)
Other versions
DE112006000959B4 (de
Inventor
Wilhelm Dr. Leneke
Marion Dr. Simon
Mischa Schulze
Karlheinz Storck
Jörg Dr. Schieferdecker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEIMANN Sensor GmbH
Original Assignee
HEIMANN Sensor GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEIMANN Sensor GmbH filed Critical HEIMANN Sensor GmbH
Publication of DE112006000959A5 publication Critical patent/DE112006000959A5/de
Application granted granted Critical
Publication of DE112006000959B4 publication Critical patent/DE112006000959B4/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/06Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/20Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals
    • H04N25/21Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming only infrared radiation into image signals for transforming thermal infrared radiation into image signals
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/30Transforming light or analogous information into electric information
    • H04N5/33Transforming infrared radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/146Mixed devices
    • H01L2924/1461MEMS
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
DE112006000959T 2005-05-17 2006-05-16 Thermopile Infrarot Sensorarray Expired - Fee Related DE112006000959B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005023333 2005-05-17
DE102005023333.3 2005-05-17
PCT/DE2006/000841 WO2006122529A2 (de) 2005-05-17 2006-05-16 Thermopile infrarot sensorarray

Publications (2)

Publication Number Publication Date
DE112006000959A5 true DE112006000959A5 (de) 2008-01-24
DE112006000959B4 DE112006000959B4 (de) 2012-03-29

Family

ID=36691904

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112006000959T Expired - Fee Related DE112006000959B4 (de) 2005-05-17 2006-05-16 Thermopile Infrarot Sensorarray

Country Status (4)

Country Link
US (1) US7842922B2 (de)
JP (1) JP5308814B2 (de)
DE (1) DE112006000959B4 (de)
WO (1) WO2006122529A2 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540406B2 (ja) * 2007-03-21 2014-07-02 セイコーNpc株式会社 赤外線センサ装置
DE102007025585A1 (de) * 2007-06-01 2008-12-04 Siemens Ag Verfahren zum Betreiben eines Verbrennungsmotors und Vorrichtung zur Bestimmung eines Betriebsparameters dessen
DE102007039228B8 (de) 2007-08-20 2009-12-17 Perkinelmer Optoelectronics Gmbh & Co.Kg Sensorkappenanordnung Sensor Schaltung
JP2009079946A (ja) * 2007-09-26 2009-04-16 Seiko Npc Corp サーモパイル型赤外線センサ
EP2169369A1 (de) * 2008-09-25 2010-03-31 General Electric Company Miniatur-Thermosäulensensor
US8395118B2 (en) 2009-04-12 2013-03-12 Ud Holdings, Llc Infrared detector having at least one switch for modulation and/or bypass
US8158943B2 (en) 2009-04-12 2012-04-17 Ud Holdings, Llc Infrared detector
US8136984B1 (en) * 2009-04-20 2012-03-20 Fluke Corporation Portable IR thermometer having thermal imaging capability
DE102010042108B4 (de) * 2010-01-18 2013-10-17 Heimann Sensor Gmbh Thermopile-Infrarot-Sensor in monolithischer Si-Mikromechanik
JP5645245B2 (ja) * 2010-02-23 2014-12-24 パナソニックIpマネジメント株式会社 赤外線センサモジュール
JP5842118B2 (ja) * 2010-06-24 2016-01-13 パナソニックIpマネジメント株式会社 赤外線センサ
US9083278B2 (en) * 2010-07-05 2015-07-14 Stmicroelectronics S.R.L. Device for transforming electromagnetic IR energy from spatially incoherent, low-power density, broad-band radiation in spatially coherent, high-power density, quasi-monochromatic radiation
US8927934B2 (en) * 2010-09-13 2015-01-06 Ricoh Company, Ltd. Thermal infrared sensor and manufacturing method thereof
FR2966596B1 (fr) * 2010-10-26 2012-12-07 Commissariat Energie Atomique Dispositif de detection d'un rayonnement electromagnetique.
US20150122999A1 (en) * 2010-12-22 2015-05-07 Seiko Epson Corporation Thermal detector, thermal detection device, electronic instrument, and thermal detector manufacturing method
KR20120100643A (ko) * 2011-03-04 2012-09-12 한국과학기술원 Sa-FPA를 이용한 적외선 감지기 및 이의 제조 방법
US9444027B2 (en) 2011-10-04 2016-09-13 Infineon Technologies Ag Thermoelectrical device and method for manufacturing same
CN102509729B (zh) * 2011-11-21 2014-02-05 中国科学院苏州纳米技术与纳米仿生研究所 可调谐热光带通滤波器像素阵列的制作方法
KR101701275B1 (ko) * 2012-02-16 2017-02-01 하이만 센서 게엠베하 높은 충전 레벨을 갖는 써모파일 적외선 센서 구조물
US9250126B2 (en) 2012-10-26 2016-02-02 Excelitas Technologies Singapore Pte. Ltd Optical sensing element arrangement with integral package
GB2521474A (en) * 2013-12-22 2015-06-24 Melexis Technologies Nv Infrared thermal sensor with beams having different widths
GB2521476A (en) * 2013-12-22 2015-06-24 Melexis Technologies Nv Infrared thermal sensor with good SNR
JP2016151523A (ja) 2015-02-18 2016-08-22 浜松ホトニクス株式会社 赤外線検出装置
US9978926B2 (en) 2015-05-14 2018-05-22 The Hong Kong University Of Science And Technology Thermal radiation microsensor comprising thermoelectric micro pillars
KR102100228B1 (ko) 2015-10-05 2020-04-13 하이만 센서 게엠베하 모놀리식 집적된 신호 처리를 갖는 고분해능 서모파일 적외선 센서 어레이
US10113837B2 (en) 2015-11-03 2018-10-30 N2 Imaging Systems, LLC Non-contact optical connections for firearm accessories
EP3405927A1 (de) 2016-01-20 2018-11-28 Carrier Corporation Gebäudemanagementsystem mit objekterkennung und -verfolgung in einem grossen raum mit einem niedrigauflösenden sensor
US10551246B2 (en) * 2016-01-28 2020-02-04 Ams Sensors Uk Limited IR detector array device
US10128302B2 (en) 2016-01-28 2018-11-13 Ams Sensors Uk Limited IR detector array device
WO2017139215A1 (en) 2016-02-10 2017-08-17 Carrier Corporation Presence detection system
DE102016209315A1 (de) * 2016-05-30 2017-11-30 Robert Bosch Gmbh Thermoelektrische Anordnung, insbesondere thermoelektrische Sensoranordnung, sowie entsprechendes Herstellungsverfahren
DE102017102833A1 (de) 2017-01-18 2018-07-19 Heimann Sensor Gmbh Hochauflösendes Thermopile Infrarot Sensorarray
US10923525B2 (en) 2017-07-12 2021-02-16 Meridian Innovation Pte Ltd CMOS cap for MEMS devices
US10403674B2 (en) 2017-07-12 2019-09-03 Meridian Innovation Pte Ltd Scalable thermoelectric-based infrared detector
US10199424B1 (en) 2017-07-19 2019-02-05 Meridian Innovation Pte Ltd Thermoelectric-based infrared detector having a cavity and a MEMS structure defined by BEOL metals lines
RU2671295C1 (ru) * 2017-08-17 2018-10-30 Общество с ограниченной ответственностью "ГрафИмпресс" Ячейка термопарного приемника ик изображения
WO2019087522A1 (ja) * 2017-10-31 2019-05-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置
FR3073941B1 (fr) * 2017-11-21 2021-01-15 Commissariat Energie Atomique Dispositif de detection d’un rayonnement electromagnetique a diaphotie reduite
US10436646B2 (en) 2018-02-28 2019-10-08 Ams Sensors Uk Limited IR detector arrays
US10753709B2 (en) 2018-05-17 2020-08-25 Sensors Unlimited, Inc. Tactical rails, tactical rail systems, and firearm assemblies having tactical rails
JP7142471B2 (ja) * 2018-06-07 2022-09-27 浜松ホトニクス株式会社 光検出器
JP7142470B2 (ja) * 2018-06-07 2022-09-27 浜松ホトニクス株式会社 光検出器
US11079202B2 (en) 2018-07-07 2021-08-03 Sensors Unlimited, Inc. Boresighting peripherals to digital weapon sights
US10645348B2 (en) 2018-07-07 2020-05-05 Sensors Unlimited, Inc. Data communication between image sensors and image displays
US10742913B2 (en) * 2018-08-08 2020-08-11 N2 Imaging Systems, LLC Shutterless calibration
US10921578B2 (en) 2018-09-07 2021-02-16 Sensors Unlimited, Inc. Eyecups for optics
US11122698B2 (en) 2018-11-06 2021-09-14 N2 Imaging Systems, LLC Low stress electronic board retainers and assemblies
US10801813B2 (en) 2018-11-07 2020-10-13 N2 Imaging Systems, LLC Adjustable-power data rail on a digital weapon sight
US10796860B2 (en) 2018-12-12 2020-10-06 N2 Imaging Systems, LLC Hermetically sealed over-molded button assembly
US11143838B2 (en) 2019-01-08 2021-10-12 N2 Imaging Systems, LLC Optical element retainers
WO2020204834A1 (en) 2019-04-01 2020-10-08 Meridian Innovation Pte Ltd Heterogenous integration of complementary metal-oxide-semiconductor and mems sensors
JP7316830B2 (ja) * 2019-04-18 2023-07-28 三菱電機株式会社 誘導加熱調理器
WO2021005150A1 (de) 2019-07-09 2021-01-14 Heimann Sensor Gmbh Verfahren zum herstellen eines thermischen infrarot-sensor arrays in einem vakuumgefüllten waferlevel gehäuse
TWI734316B (zh) * 2019-12-24 2021-07-21 新唐科技股份有限公司 熱感測器及其製造方法
CN114257242A (zh) * 2020-09-22 2022-03-29 无锡华润上华科技有限公司 热电堆阵列及其信号读出电路
CN112701211B (zh) * 2020-12-29 2023-04-28 上海烨映微电子科技股份有限公司 红外热电堆封装结构及方法
US11808633B2 (en) * 2021-08-16 2023-11-07 Oriental System Technology Inc. Infrared thermopile sensor

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02144966A (ja) * 1988-11-28 1990-06-04 Matsushita Electron Corp 半導体集積回路
JPH0634661Y2 (ja) * 1989-11-30 1994-09-07 新日本無線株式会社 サーモパイル素子
DE4102524C2 (de) * 1990-01-30 2000-05-25 Citizen Watch Co Ltd Infrarotsensor
JPH0626925A (ja) * 1992-07-06 1994-02-04 Fujitsu Ltd 赤外線検出器
WO1994007115A1 (en) * 1992-09-17 1994-03-31 Mitsubishi Denki Kabushiki Kaisha Infrared detector array and production method therefor
JPH06137935A (ja) * 1992-10-22 1994-05-20 Matsushita Electric Works Ltd 赤外線センサ
DE19630150B4 (de) * 1995-07-28 2009-03-05 Denso Corp., Kariya-shi Verfahren zum Entwerfen einer Halbleitervorrichtung
US5962854A (en) * 1996-06-12 1999-10-05 Ishizuka Electronics Corporation Infrared sensor and infrared detector
US5808350A (en) * 1997-01-03 1998-09-15 Raytheon Company Integrated IR, visible and NIR sensor and methods of fabricating same
JPH10227689A (ja) * 1997-02-17 1998-08-25 Mitsubishi Electric Corp 赤外線検出器および赤外線フォーカルプレーンアレイ
ATE250213T1 (de) * 1997-02-28 2003-10-15 Em Microelectronic Marin Sa Thermoelektrischer fühler
JP3097591B2 (ja) * 1997-03-31 2000-10-10 日本電気株式会社 熱型赤外線検出素子
DE19735379B4 (de) * 1997-08-14 2008-06-05 Perkinelmer Optoelectronics Gmbh Sensorsystem und Herstellungsverfahren
JPH11148868A (ja) * 1997-11-17 1999-06-02 Masanori Okuyama 熱検知素子およびその製造方法
DE19923606A1 (de) * 1998-06-30 2000-01-13 Bosch Gmbh Robert Vorrichtung zur Erfassung elektromagnetischer Strahlung
US6710348B1 (en) * 1998-06-30 2004-03-23 Robert Bosch Gmbh Apparatus for sensing electromagnetic radiation
DE19843984B4 (de) * 1998-09-25 2013-10-24 Robert Bosch Gmbh Verfahren zur Herstellung von Strahlungssensoren
JP2000186958A (ja) * 1998-12-24 2000-07-04 Sharp Corp 熱型赤外線検出素子
JP2000298062A (ja) * 1999-04-14 2000-10-24 Nec Corp 熱型機能デバイス、エネルギー検出装置および熱型機能デバイスの駆動方法
US6504153B1 (en) * 1999-07-26 2003-01-07 Kabushiki Kaisha Toshiba Semiconductor infrared detecting device
JP3523588B2 (ja) * 1999-11-01 2004-04-26 松下電器産業株式会社 半導体装置およびその製造方法
JP2001296184A (ja) * 2000-04-17 2001-10-26 Denso Corp 赤外線検出装置
JP2001304973A (ja) * 2000-04-26 2001-10-31 Denso Corp 赤外線イメージセンサ
JP2001326367A (ja) * 2000-05-12 2001-11-22 Denso Corp センサおよびその製造方法
JP3655232B2 (ja) * 2001-11-15 2005-06-02 株式会社東芝 赤外線センサ
US6649913B1 (en) * 2002-02-26 2003-11-18 Raytheon Company Method and apparatus providing focal plane array active thermal control elements
JP2004144715A (ja) * 2002-10-28 2004-05-20 Ishizuka Electronics Corp 赤外線検出装置
JP4231681B2 (ja) * 2002-11-22 2009-03-04 株式会社堀場製作所 サーモパイルアレイセンサ
DE10321639A1 (de) * 2003-05-13 2004-12-02 Heimann Sensor Gmbh Infrarotsensor mit optimierter Flächennutzung
DE10322860B4 (de) * 2003-05-21 2005-11-03 X-Fab Semiconductor Foundries Ag Schaltungsanordnung zum Auslesen elektronischer Signale aus hochauflösenden thermischen Sensoren

Also Published As

Publication number Publication date
WO2006122529A3 (de) 2007-01-25
JP2008541102A (ja) 2008-11-20
US20080216883A1 (en) 2008-09-11
US7842922B2 (en) 2010-11-30
WO2006122529A2 (de) 2006-11-23
JP5308814B2 (ja) 2013-10-09
DE112006000959B4 (de) 2012-03-29

Similar Documents

Publication Publication Date Title
DE112006000959A5 (de) Thermopile Infrarot Sensorarray
DE602006006500D1 (de) Infrarotkamera mit Feuchtigkeitssensor
DE112004002835D2 (de) Hochtemperatursensor
DE602004017911D1 (de) Fingerabdruck-sensor-element
BRPI0719913A2 (pt) Inspeção ultrassônica - laser aperfeiçoada usando termografia de infravermelho
DE102005033349B8 (de) Optischer Sensor
EP2034285A4 (de) Infrarot-array-sensor
DE602006020042D1 (de) Zusammengesetzter sensor
EP1884754A4 (de) Infrarotsensor
DE502006009331D1 (de) Sensorvorrichtung
DK3524150T3 (da) Transkutan analytsensor
FR2889872B1 (fr) Capteur de temperature
FI20060663A0 (fi) Kaksidimensioinen asema-anturi
DE602004021974D1 (de) Cmos-bildgeberelement
DE602006020588D1 (de) Infrarotsensor und herstellungsverfahren dafür
NO20051850A (no) Infrarød deteksjon av gass - diffraktiv.
DE602005002036D1 (de) Temperatursensor-schema
EP1856678A4 (de) Sicherheits-mikrobolometer-infrarotsensor
DE502005007018D1 (de) Sensorleuchte
DK1742168T3 (da) Optoelektronisk sensor
DE602006017925D1 (de) Drehmomentsensor
DE602006007195D1 (de) Sensoreinrichtung
DE602005027223D1 (de) Positionssensor
DE602005016374D1 (de) Bildsensor
FI20055042A0 (fi) Asennontunnistin

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20120630

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee