JP5298792B2 - アライメントマークの検出方法 - Google Patents

アライメントマークの検出方法 Download PDF

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Publication number
JP5298792B2
JP5298792B2 JP2008291917A JP2008291917A JP5298792B2 JP 5298792 B2 JP5298792 B2 JP 5298792B2 JP 2008291917 A JP2008291917 A JP 2008291917A JP 2008291917 A JP2008291917 A JP 2008291917A JP 5298792 B2 JP5298792 B2 JP 5298792B2
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Japan
Prior art keywords
mark
work
pattern
workpiece
registered
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JP2008291917A
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English (en)
Japanese (ja)
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JP2010117632A (ja
Inventor
理恵 篠山
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Ushio Denki KK
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Ushio Denki KK
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Publication date
Application filed by Ushio Denki KK filed Critical Ushio Denki KK
Priority to JP2008291917A priority Critical patent/JP5298792B2/ja
Priority to TW098131761A priority patent/TWI442194B/zh
Priority to KR1020090098190A priority patent/KR101373930B1/ko
Priority to CN2009102121122A priority patent/CN101738882B/zh
Publication of JP2010117632A publication Critical patent/JP2010117632A/ja
Application granted granted Critical
Publication of JP5298792B2 publication Critical patent/JP5298792B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008291917A 2008-11-14 2008-11-14 アライメントマークの検出方法 Active JP5298792B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008291917A JP5298792B2 (ja) 2008-11-14 2008-11-14 アライメントマークの検出方法
TW098131761A TWI442194B (zh) 2008-11-14 2009-09-21 Alignment mark detection method
KR1020090098190A KR101373930B1 (ko) 2008-11-14 2009-10-15 얼라인먼트 마크의 검출 방법 및 장치
CN2009102121122A CN101738882B (zh) 2008-11-14 2009-11-10 对准标记的检测方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008291917A JP5298792B2 (ja) 2008-11-14 2008-11-14 アライメントマークの検出方法

Publications (2)

Publication Number Publication Date
JP2010117632A JP2010117632A (ja) 2010-05-27
JP5298792B2 true JP5298792B2 (ja) 2013-09-25

Family

ID=42279401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008291917A Active JP5298792B2 (ja) 2008-11-14 2008-11-14 アライメントマークの検出方法

Country Status (4)

Country Link
JP (1) JP5298792B2 (ko)
KR (1) KR101373930B1 (ko)
CN (1) CN101738882B (ko)
TW (1) TWI442194B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5523207B2 (ja) * 2010-06-01 2014-06-18 株式会社トプコン 露光装置
CN103576468B (zh) * 2012-08-10 2016-03-09 北京京东方光电科技有限公司 一种曝光设备及其挡板控制方法
KR102097342B1 (ko) 2013-06-21 2020-04-07 삼성디스플레이 주식회사 증착 마스크의 바코드 인식 방법 및 그 인식 장치
WO2016159201A1 (ja) * 2015-03-31 2016-10-06 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
CN105551033B (zh) * 2015-12-09 2019-11-26 广州视源电子科技股份有限公司 元件标记方法、系统和装置
JP6751635B2 (ja) * 2016-09-28 2020-09-09 昭和電工パッケージング株式会社 ラミネート材の加工方法
CN108614397B (zh) * 2017-06-16 2020-11-17 深圳市前海野马自动化设备有限公司 一种带下镜头机构的自动对位装置及其曝光设备
CN108118291A (zh) * 2017-12-25 2018-06-05 信利（惠州）智能显示有限公司 一种蒸镀对位效果检测装置及方法
JP7310617B2 (ja) * 2020-01-22 2023-07-19 ウシオ電機株式会社 アライメントマーク検出装置およびアライメントマーク検出方法
CN114550599B (zh) * 2022-03-30 2023-08-01 苏州华星光电技术有限公司 一种显示面板的贴合装置及其应用方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06309434A (ja) * 1993-04-27 1994-11-04 Nikon Corp 画像処理方法及び装置
JP3700214B2 (ja) * 1995-09-22 2005-09-28 株式会社ニコン 寸法測定装置
JP2001110697A (ja) * 1999-10-04 2001-04-20 Ushio Inc 露光装置におけるマスクとワークの位置合わせ方法
TWI225665B (en) * 2001-10-17 2004-12-21 Canon Kk Apparatus control system, apparatus control method, semiconductor exposure apparatus, semiconductor exposure apparatus control method and semiconductor device manufacturing method
KR100650814B1 (ko) * 2004-02-25 2006-11-27 주식회사 하이닉스반도체 웨이퍼 정렬방법
WO2006019166A1 (ja) * 2004-08-19 2006-02-23 Nikon Corporation アライメント情報表示方法とそのプログラム、アライメント方法、露光方法、デバイス製造方法、表示システム、表示装置、プログラム及び測定／検査装置
JP2006165140A (ja) * 2004-12-06 2006-06-22 Hitachi High-Technologies Corp 電子ビーム描画方法および装置
KR20070005813A (ko) * 2005-07-06 2007-01-10 삼성전자주식회사 웨이퍼 정렬 장치 및 정렬 방법
JP2007140117A (ja) * 2005-11-18 2007-06-07 Toppan Printing Co Ltd 露光方法及び露光装置
KR20080006151A (ko) * 2006-07-11 2008-01-16 동부일렉트로닉스 주식회사 반도체 정렬 장치 및 방법
CN101221375A (zh) * 2008-01-25 2008-07-16 上海微电子装备有限公司 用于步进光刻机对准系统的机器视觉系统及其标定方法

Also Published As

Publication number Publication date
KR101373930B1 (ko) 2014-03-12
CN101738882A (zh) 2010-06-16
CN101738882B (zh) 2013-10-30
TWI442194B (zh) 2014-06-21
KR20100054718A (ko) 2010-05-25
JP2010117632A (ja) 2010-05-27
TW201019056A (en) 2010-05-16

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