201019056 六、發明說明： 【發明所屬之技術領域】 本發明是有關檢測形成在掩模上的掩模•對準標記（ 掩模標記）和形成在工件上的工件•對準標記（工件標記 )，將兩者進行定位使其形成事先設定的位置關係（對準 )，並經由掩模將光照射在工件上的曝光裝置中，進行工 件•對準標記檢測用的檢測方法及檢測裝置 【先前技術】 藉光鈾刻製造半導體元件、印刷基板、液晶基板等圖 形的步驟中，使用曝光裝置。曝光裝置是將形成掩模圖形 的掩模，及轉印其圖形的工件定位在預定的位置關係，之 後經掩模照射含曝光光的光。藉此，將掩模圖形轉印（曝 光）到工件上。 曝光裝置的掩模和工件的定位一般是如以下進行。 • 藉對準顯微鏡檢測形成在掩模上的掩模標記和形成在 工件上的工件標記。進行檢測數據的影像處理，以求得各 個位置座標，並爲了使兩者的位置形成事先設定的位置關 係，移動掩模或工件來進行。掩模和工件必須進行平面內 的2方向（X方向與Y方向）及轉動方向（0方向）的定 位。因此，掩模標記和工件標記分別形成在2處以上。 第9圖是表示檢測掩模標記的對準顯微鏡10的槪略 構成。此外，如上述掩模標記和工件標記分別形成在2處 以上，因此對準顯微鏡10也分別對應設置2處以上，但 -5- 201019056 是同圖中，僅顯示1個（1處）。對準顯微鏡10是由半透 明反射鏡l〇a、透鏡LI、L2和CCD攝影機10b所構成。 11是進行影像處理等的控制部、12爲監測器、W爲 形成有工件標記WAM的工件。同圖中，工件標記WAM 的檢測（圖形搜尋）是如以下進行。 A )工件標記的登錄 · 在工件標記登錄WAM的檢測之前，例如使用第1 0 ( # a)圖表示的十字型標記，控制部11如第10(b)圖表示 ，以監測器的1像素爲單位，包含十字型的標記和其背景 登錄作爲一個圖形。亦即，同圖中爲了容易說明，像素數 雖是爲5x5，但是影像中央的5像素是以黑的十字型，其 週邊的20像素是以白色的圖形登錄。 具體而言，將形成要檢測的工件標記WAM的採樣基 板放置在對準顯微鏡之下，照射照明光將其照明。 藉著對準顯微鏡（例如3倍倍率）10，進行登錄之工 @ 件標記WAM的檢測。監測器1 2採用對準顯微鏡1 0映出 控制部11可影像處理的範圍（例如第11圖表示15mmx 1 5 mm的範圍）。 接著，爲了可放入登錄的工件標記WAM整體，在監 測器1 2上以工件標記登錄用的假設線（第1 1圖的點線） 框起工件標記WAM，在控制部1 1登錄工件標記WAM。 控制部11是以上述假設線框起的像素爲單位，根據其對 比儲存工件標記WAM。藉此，結束工件標記WAM的登錄 -6 - 201019056 作業。 工件標記WAM的大小根據工件的種類、使用者、工 程有著各種的不同，但是例如框起工件標記WAM的假設 線的大小則是如第1 1圖表示屢次使用200 a m〜700 y m的 線。 工件標記WAM的形狀也是和上述相同的理由而有種 • 種不同，不限於第10圖表示的十字型。多數是如第12(a Φ )圖表示的圓形或同（b )圖表示以規則性的圖形爲1組 作爲對準標記等。無論如何，設定登錄範圍以包含1個工 件標記的圖形整體。 B)圖形搜尋 接著，檢測實際的工件標記WAM。從對準顯微鏡的 下方，除去使用在工件標記的圖形登錄的採樣基板，放置 實際形成有圖形的基板（工件）。顯微鏡的倍率如上述是 # 與登錄圖形相同的倍率（3倍）。 如第9圖表示，經由對準單元10的半透明反射鏡l〇a 將照明光照射在工件W上的工件標記WAM，利用CCD攝 影機10b進行工件標記WAM的收像。並且將顯示在監測 器1 2的工件標記WAM的像輸入到控制部1 1，以監測器 12的像素爲單位轉換爲座標數據。 控制部1 1比較上述登錄圖形和接收後工件標記WAM 的像。例如，接收後工件標記的像（檢測圖形）是如第1 〇 (c)圖表示之檢測圖形A的場合，由於和登錄圖形形成 201019056 60%—致，因此辨識爲點數（相關値）60。 並且同樣地，接收後工件標記的像（檢測圖形）是如 第10(d)圖表示之檢測圖形B的場合，由於和登錄圖形 形成80%—致，因此辨識爲點數80。另外，接收後工件標 記的像（檢測圖形）是如第1 〇 ( e )圖表示之檢測圖形C 的場合，由於是100%—致，因此辨識爲點數1〇〇。 如上述，對監測器所映出的全區域進行圖形搜尋’以 ’ 點數最接近1〇〇的（最高）位置辨識作爲工件標記WAM φ 的位置（檢測工件標記WAM的位置），將其位置座標作 爲工件標記的位置座標予以儲存。 具體而言，以對準單元觀察設置在工件W上的工件 標記WAM的附近。第13圖是表示此時藉著監測器12所 投射之實際工件的區域的圖。如上述，對準顯微鏡的倍率 是和工件標記的圖形登錄時的倍率相同。 因此，在監測器12上映出和第11圖相同的範圍（ 15mmxl5mm的範圍）。將此範圍跨全區域，使上述假設 @ 線框起登錄後的範圍分別以1像素移動（掃描），在其各 個位置求得點數。 檢索第13圖的工件標記的區域內（15m mx 15 mm的範 圍），例如（B)也有形成工件標記以外圖形的場合，或 者如（C)有塵埃附著的場合。圖形或塵埃的形狀也有可 能恰如所登錄工件標記的圖形相似。此時，會在影像處理 區域內檢測出複數個點數比較高的位置。 但是，如上述，控制部1 1是以框起假設線的像素爲 -8- 201019056 單位，根據其對比儲存工件標記WAM。因此，第13圖的 區域內，只要有工件標記WAM的存在，其位置（A)的 點數會形成最高値。因此，設定以檢測出最高點數的位置 作爲工件標記的位置來進行檢測。 再者，如上述比較所輸入的影像和預先準備的樣板影 像來判定其類似度的手法已種種爲人所熟知，必要時例如 • 可參閱非專利文獻1等。 • 〔非專利文獻1〕江尻正員監修「影像處理產業應用 總覽，上卷，（基礎•系統技術篇）」1 994年1月17日 ，股份公司 FUJI · TECHNOSYSTEM 發行，初版，p26-p27 ,p5 0-p5 2 〔專利文獻1〕特開平9-8 2615號公報 【發明內容】 〔發明所欲解決的課題〕 φ 半導體晶圓的曝光裝置中，形成在工件之晶圓的工件 標記是和形成在相同面的電路圖形同樣，多是以光蝕刻所 形成。 另一方面，印刷基板的曝光裝置中，會有以雷射照射 或鑽孔器等的機械加工所形成之 Φ100#ιη左右的未貫穿 孔（凹陷）作爲工件標記使用的場合。 形成上述基板的孔的檢測是使用稱爲暗背景照明的照 明方法。暗背景照明是對基板從斜向照射照明光，在基板 的上方配置攝影元件。從正上方的照明孔的檢測困難。 -9- 201019056 第14(a)圖是模式表示藉著第9圖的對準顯微鏡， 以暗背景照明進行形成在基板100的孔101攝影的樣子的 圖。此外，同圖中，雖只從圖示的右側和左側顯示照明光 103，但是實際上是對孔101從3 60°全方向進行照明。 照明光1 03是對印刷基板1 00朝著斜向射入。印刷基 板100的表面爲擴散面，照射在基板的表面或孔的底部分 的照明光1 03被擴散反射，其一部分射入到反射鏡1 02所 ’ 反射的攝影元件（CCD，未圖示）。 φ 另一方面，射入到孔101的壁面的光被擴散反射而爲 壁面所反射的光並未直接射入到攝影元件（CCD )。 因此，在攝影元件，孔100被以壁的部分和其以外部 份（印刷基板的表面和孔的底部分）不同的明亮度照射。 例如第14(b)圖表示，壁的部分是呈黑框緣的圓圈，孔 的底部分則是和基板的表面同樣照射呈灰色。 因此’有底的孔理想形成的場合，登錄如第14(a) 圖的圓圈的圖形作爲工件標記WAM的登錄影像。 @ 但是’即使例如想加工成相同形狀的孔時，以對準顯 微鏡檢測後的場合’攝影手段（CCD )的呈現方式（形狀 或明暗或色調）會有不同。 其理由之一爲所形成的孔的形狀偶然會有不同的場合 〇 第1 5圖是對印刷基板以雷射或鑽孔器加工所形成孔 形狀的一例。 同圖爲孔的剖面圖。 -10- 201019056 第15 (a)圖爲理想的孔的形狀。但是，根據雷射或 鑽孔器前端的形狀，如第15(b)圖表示，孔的壁也會有 形成斜向（硏缽形）。並且，如第15(c)圖表示，也會 在孔的邊緣部份產生毛邊104。 如上述，在印刷基板1 00利用機械加工所形成的孔會 有其形狀形成不一致的可能。因此，將該孔作爲工件標記 ： 以對準顯微鏡檢測時，攝影手段（CCD)的呈現方式不同 攝影手段（CCD)的呈現方式不同的其他理由是由於 孔形成後施以處理所造成。 例如第15(d)圖表示，印刷基板在表面會電鍍銅 105等的金屬箔，孔中也予以電鑛。藉金屬電鍍使表面的 反射率變化，因此可根據電鍍的有無，以致攝影手段（ CCD )的呈現方式不同。 並且，如第15(e)圖表示，也有在金屬電鍍後的上 φ 面黏貼抗蝕膜。抗蝕膜106的厚度爲數十gm，黏貼該抗 蝕膜時，不能沿著孔的側面或底面黏貼，會形成孔的開口 的堵塞。 因此，孔的部分是由於抗蝕膜使照明光的反射率或光 的反射方向的變化，在未黏貼抗蝕膜的場合和黏貼有抗蝕 膜的場合，攝影手段（CCD)的呈現方式不同。 例如，如第1 5 ( e )圖表示，黏貼著抗蝕膜的場合， 藉對準顯微鏡所檢測出的孔的形狀其整體是以黑圓形顯示 201019056 並且，根據抗鈾膜的黏合狀態也會改變孔中的薄膜鬆 驰狀態，會使得攝影手段（CCD)的呈現方式不同。 工件標記的呈現方式不同時’實際上所攝影的工件標 記影像和被儲存在控制部的工件標記的影像會形成不同。 一旦引起上述情況時，會使得工件標記存在位置的點數降 低，不能正確檢測出工件標記。 使用第16圖加以說明。第16(a)圖表示的圓圈圖形 ： 是作爲登錄在控制部的工件標記的影像。 0 第16(b)圖是在檢索（搜尋）基板的工件標記的區 域內存在有工件標記，並且與所登錄的影像大致同等呈現 方式的場合。此時，第16(a)圖的登錄標記在第16(b )圖的四角所圍繞的位置大致一致，其點數例如爲9000 點（滿點1 0000 )。 第16(c)圖是構成本發明課題的場合。在搜尋的區 域內存在有工件標記，但是根據上述的原因呈現方式與登 錄標記不同會有呈黑圓形顯示的場合。環的中央部雖是白 ❹ 色，黑圓形中央部爲黑色，因此第16(c)圖的四角所圍 繞位置的點數低，例如2000點左右。 第16(d)圖是在檢索區域內，存在有非工件標記的 配線等的黑四角形輪廓的圖形的場合。此時，形狀雖然不 同’但是中間黑色周邊部爲白色的明暗的圖形相似，因此 第16(d)圖的四角圍繞的位置的點數比第16©圖的場合 高，例如是5000點。 第16(c)圖和所登錄的標記雖然呈現方式不同，但 -12- 201019056 由於是工件標記必須進行檢測。但是，第1 6 ( d )圖並不 是工件標記，因此不須進行工件標記的檢測。 但是，第1 6 ( c)圖作爲工件標記加以檢測時，控制 部中，例如設定「點數2000點以上的場合作爲工件標記 」時，會以非工件標記的第1 6 ( d )圖作爲工件標記加以 檢測。另一方面，爲了不致以第1 6 ( d )圖作爲工件標記 檢測而設定「點數6000點以上的場合作爲工件標記」時 _ ，不能檢測出作爲工件標記的第1 6 ( c )圖。 如上述，以同一形狀形成在工件上的工件標記是藉著 工件標記的加工條件或印刷基板製造步驟上的處理，以攝 影元件所照射的呈現方式（形狀或明暗或色調）會有不同 。此時，即使以登錄的工件標記實際進行工件標記的檢測 時，仍會有不能檢測的可能。 本發明是爲了解決上述問題所硏創而成，本發明目的 是提供一種照射在對準顯微鏡的攝影元件之工件標記的呈 ❷ 現方式即使不同，仍可正確檢測出工件標記的工件標記之 檢測方法及裝置。 〔解決課題用的手段〕 利用對準顯微鏡觀察以突起或凹陷（也含貫穿孔）形 成在工件上的工件•對準標記（工件標記）時，雖然具有 同樣的輪廓，但是會觀察出一部分有缺陷，色調•色的濃 度•明暗不同等、呈現方式不同的複數個圖形。以上的複 數個圖形中，將作爲具有同樣輪廓但色調•色的濃度•明 -13- 201019056 暗不同的工件•對準標記應進行檢測的複數個圖形登錄在 記憶部。 並且，檢測形成在工件上的工件標記時，逐一讀取作 爲工件•對準標記應檢測出的上述複數個登錄圖形，比較 收像後工件上的圖形和上述讀取後的登錄圖形，評估兩者 的一致度。 亦即，首先，以登錄的第1圖形進行檢索區域的搜尋 ，和工件上的圖形比較求得其點數。接著，同樣以登錄的 0 第2圖形進行檢索區域的搜尋求得其點數。重複此一檢測 ，一旦檢測出顯示重新設定的値以上之點數的登錄圖形時 ，採用此登錄圖形作爲對應工件標記的圖形。或者，也可 以重複上述比較，一旦檢測出顯示最高値之點數的登錄圖 形時，採用此登錄圖形作爲對應工件標記的圖形。 如上述，一旦顯示獲得最高一致度的登錄圖形，或者 獲得預先所設定値以上的一致度的登錄圖形時，以和該登 錄圖形的一致度高的收像圖形作爲工件對準標記進行檢測 © ，並儲存其位置。 投影曝光裝置等的曝光裝置中，如上述以檢測後的圖 形作爲工件標記，進行掩模與工件的定位，將形成在工件 上的掩模圖形轉印到工件上。 掩模和工件的定位是進行使得工件載台朝著XY方向 移動，並且以垂直於XY平面的軸爲中心轉動，使上述所 檢測出工件標記的位置座標，例如和預先檢測所登陸的掩 模對準標記（掩模標記）的位置座標一致。 -14- 201019056 〔發明效果〕 本發明中，將作爲工件•對準標記應檢測的複數個登 錄圖形和收像後工件上的圖形進行比較，評估其一致度， 並根據該評估結果，以收像後工件上的圖形作爲工件•對 準標記進行檢測，因此即使因一部分缺陷、色的濃度•明 暗不同，導致相同形狀之工件標記不同的呈現方式時，仍 然可以進行工件標記的確實檢測。 因此，即使工件標記在工件上形成突起或凹陷，仍可 確實檢測出工件標記，精度良好地進行定位。 【實施方式】 第1圖是表示本發明運用對象之一的投影裝置的構成 例的圖。 同圖中，MS爲掩模架。掩模架MS上放置保持著形 成有掩模標記MAM和掩模圖形MP的掩模Μ。 φ 從光照射裝置1射出曝光光。射出的曝光光是經由掩 模Μ、投影透鏡2，照射在載放於工件架WS上的工件W 上，將掩模圖形ΜΡ投影在工件W上曝光。 投影透鏡2和工件W之間設有2處可在同圖的箭頭 方向移動的對準顯微鏡1〇。掩模圖形ΜΡ曝光於工件W 上之前，將對準顯微鏡10插入於圖示的位置，檢測掩模 標記ΜΑΜ和形成在工件上的工件標記WAM，進行掩模Μ 和工件W的定位。定位後，對準顯微鏡10從工件W上退 出。並且，第1圖是僅顯不設有2處內之一方的對準顯微 -15- 201019056 鏡。 對準顯微鏡10是如上述由半透明反射鏡l〇a、透鏡 LI、L2和CCD攝影機10b所構成。爲進行上述第14圖表 示的暗背景照明，對準顯微鏡10設有對基板從斜向照射 照明光用的照明手段l〇c。 將對準顯微鏡1〇的CCD攝影機10b所收像的掩模標 記MAM像、工件標記像等送到控制部1 I。 控制部11，具備：處理上述CCD攝影機所收像之影 @ 像的影像處理部1 1 a，及儲存作爲工件標記應檢測之複數 個登錄圖形、掩模標記等的位置座標資訊、各種參數等的 記憶部1 1 b。 另外，控制部1 1，具備：以CCD攝影機10b收像， 比較影像處理部11a進行影像處理後的圖像和登錄在記憶 部lib的圖像求得一致度來計算點數的比較·評估部11c :根據比較·評估部11c所獲得的一致度，判定收像後之 工件上的圖形是否爲作爲工件標記所檢測出的圖形的判定 © 部lid;移動工件架WS或掩模架MS (或者其雙方）使得 作爲工件標記所檢測圖形的位置座標和儲存在記億部1 1 b 的掩模標記像的位置座標一致的定位控制部Π e ;及根據 作業人員的指示將供件標記等登錄到記憶部1 1 b用的登錄 部 Ilf。 工件架WS或者掩模架MS是藉著上述定位控制部 lie所控制的工件架驅動機構4、掩模架驅動機構3所驅 動，在XY方向（X，Y:在掩模架MS、工件架WS面上 -16- 201019056 平行且彼此正交的方向）移動的同時，在χγ平面上以垂 直的軸爲中心轉動。 上述控制部11連接有監測器12，將上述影像處理部 11a所影像處理後的影像顯示在監測器12的畫面上。 第1圖中，掩模Μ和工件W的定位是如以下進行。 從光照射裝置1或者未圖示的對準光源將照明光照射 在掩模Μ，藉對準顯微鏡10的CCD攝影機10b進行掩模 φ 標記Μ AM像的收像，送到控制部丨1。控制部1 1的影像 處理部11a將上述掩模標記Μ AM像轉換成位置座標儲存 在記憶部1 1 b。 並且，掩模標記的檢測方法提出有種種的方法，必要 時例如可參閱專利文獻1等。 接著，將照明光從對準顯微鏡10的照明手段10c照 射到工件W，如上述進行圖形搜尋，檢測工件W上的工 件標記WAM，控制部11求得其位置座標。 控制部11移動工件架WS (或者掩模架MS，或其雙 方）進行掩模Μ和工件W的定位，使得所儲存掩模標記 ΜΑΜ的位置座標和檢測後之工件標記WAM的位置座標形 成預定的位置關係。 接著針對工件標記的檢測順序和掩模的定位藉第2圖 、第3圖、第4圖更具體加以說明。 (1 )首先，檢測出掩模標記ΜΑΜ的位置。爲此如第 2 ( a )圖表示，求得對準顯微鏡10視野內（視角的範圍 內）的掩模標記MAM的位置座標（xml、ym2)。 -17- 201019056 即’以控制部11的影像處理部lla處理對準顯微鏡 10的CCD攝影機l〇b所攝影的影像，求得掩模標記MAM 的位置座標（xml、ym2)儲存在記憶部lib。 (2)將工件標記登錄到控制部1丨的記憶部〗丨b。該 登錄是如下述，作業人員是以目視進行。 將實際的工件放置在工件架WS上，使用對準顯微鏡 10接收工件W1的表面影像，並以影像處理部iia處理， 在監測器1 2上映出工件W 1的表面。 此時的對準顯微鏡10是和實際檢測工件標記WAM時 相同的對準顯微鏡10，對準顯微鏡10的倍率實際是和檢 測工件標記WAM時相同的倍率（例如3倍）。並且，對 準顯微鏡10被保持在與檢測掩模標記時的位置相同的位 置’對準顯微鏡10的視野（視角）也相同。 作業人員看著所投射的工件W1的影像，尋找工件標 記WAM » —旦發現作爲工件標記WAM應加以登錄的圖形 時’和上述「工件標記的登錄」的說明同樣如第2(b-l) 圖表示’爲使工件標記WAM整體進入，在監測器12上以 工件標記登錄用的假設線框起工件標記WAM，例如以目 視特定其中央位置，標上+等的標記。 例如工件標記WAM爲圓形的場合，以對準顯微鏡i 〇 所觀察的影像例如第3(b-2)圖表示，雖顯示圓或黑圓圈 ，但是作業人員可根據該等的圖形，選擇作爲工件標記 WAM應登錄的圖形。 並且’針對作爲工件標記WAM應登錄的圖形，是以 201019056 工件標記登錄用的假設線框起圖形，以此假設線所框起的 區域作爲工件標記WAM1的圖形像，對登錄部Ilf賦予登 錄指令登錄到記億部Π b。 又，以目視來特定圖形的中心位置，從假設線所形成 四角形的例如左上角到圖形的中心位置爲止的距離dx、dy 作爲圖形的位置座標登錄至記憶手段lib。 在此，如第3(b-3)圖表示，圖形中心位置的設定不 φ 正確時，會將其錯誤位置（+的位置）登錄作爲工件標記 位置。 再者，藉運算等自動求得圖形中心位置的手法自以往 即種種爲人所熟知，但是圖形中心位置的設定並非以目視 ，而是以影像處理部11a藉著影像處理自動求得。 以往如上述’係僅登錄1個工件標記即結束工件標記 WAM的登錄。但是，本發明是以作爲工件標記應登錄的 呈現方式不同的複數個圖形登錄作爲工件標記。 Φ 因此，持續登錄工件標記的場合時，將現在的工件 W1從工件架WS卸下，將確實形成相同形狀的工件標記 WAM的其他第2個工件標記W2載放在工件架WS上。 並且’和上述同樣，藉著對準顯微鏡10將工件W2 的表面投射在監測器12上，尋找工件標記WAM。所發現 的工件標記WAM如果和先前登錄的工件標記WAM的呈 現方式（形狀或明暗或色調）不同時，即和上述同樣以工 件標記登錄用的假設線框起，作爲第2的工件標記WAM2 登錄到控制部1 1的記憶部1 1 b。 -19- 201019056 接著’從工件架WS卸下工件W2，將第3的工件W3 載放在工件架WS上。利用對準顯微鏡1〇將工件W3的表 面投射到監測器1 2上’尋找工件標記wAM。所發現的工 件標記WAM如果和至今爲止所登錄的工件標記WAM1或 WAM2的呈現方式（形狀或明暗或色調）不同時，即和上 述同樣以工件標記登錄用的假設線框起，作爲第3的工件 標記WAM3登錄到控制部1 1的記億部1 1 b。 (3 )接著，比較登錄後的工件標記和工件上的圖形 參 ，檢測工件W上的工件標記。 檢測工件標記蝕，使用登錄到控制部1 1的記憶部1 1 b 的所有工件標記WAM1〜η，進行檢索區域內圖形的檢索（ 搜尋）。比較·評估部11c比較上述所登錄的工件標記 WAM'1〜η和檢索區域內的圖形求得一致度的點數。判定部 lid —旦判定該點數超過一定値或者爲最高點數時，從上 述所登錄的工件標記WAMl〜n之中採取該工件標記。 並且，以獲得最高一致度的工件標記，或者對應獲得 @ 預先所設定的値以上的一致度之工件標記的檢索區域內的 圖形作爲工件W上的工件標記檢測出，並儲存其位置。 例如’工件標記的呈現方式有兩種類，第1的工件標 記WAM1爲圓圈的圖形，第2的工件標記WAM2爲黑圓 圈形的圖形時，使用該兩個工件標記WAM1和WAM2進 行搜尋。 即，首先以第1工件標記WAM1進行檢索區域的搜尋 得到點數。接著以第2工件標記WAM2進行檢索區域的搜 -20- 201019056 尋得到點數。並且，定位控制部1 1 e使用預先所設定的値 以上點數的工件標記，或者使用檢測出最高點數的工件標 記，進行掩模和工件的定位。 工件標記的搜尋是如第4圖進行。 例如以應檢索第4 ( c-1 )圖表示的矩形區域p登錄到 記憶部1 1 b。 在進行工件標記搜尋時，如第4 ( c-2 )圖表示，在對 φ 準顯微鏡的視野內，例如從視野的左上端，使得上述 第4(c-l)圖表示的包含工件標記WAM之圖形的縱Y、 橫X的矩形區域P —邊稍微偏移一邊重疊來尋找一致度高 的場所。 並且’在對準顯微鏡10的視野內檢索一致度高的區 域時，求得此時的矩形區域P左上的角的座標（Xl，yl) ’加上顯示區域P內的圖形之中心位置的（dx，dy )，作 爲檢測出（xl+dx，yl+dy)的工件標記的位置座標（ ❹ xwl ， ywl)。 (4 )如上述一旦檢測出工件標記的位置座標時，定 位控制部1 1 e是如第4 ( d )圖表示，爲使所檢測出工件標 記WAM的位置座標（xwl，ywl )和預先所儲存的工件標 記的位置座標（xml，yml )—致，移動工件標記WS或者 工件架MS (或其雙方），使兩者一致。 再者’上述說明中，雖是針對總括登錄複數個工件標 記WAM，使用該等的工件標記WAMl~n，進行檢索區域 檢索（搜尋）的場合已作說明，但是也可以一邊進行工件 -21 - 201019056 標記的檢測和掩模Μ和工件W的定位，一邊檢測出作爲 工件標記應登錄的圖形之後，將其圖形登錄作爲工件標記 〇 亦即，首先登錄第1工件標記WAM，使用登錄後的 該工件標記，檢測出工件W上的工件標記，使用檢測出 的工件標記進行定位。並且，在檢測該工件標記的過程， 一旦檢測出作爲新的不同呈現方式之工件標記應登錄的圖 形之後，如上述以此圖形作爲工件標記WAM登錄到記憶 0 部 lib。 接著的工件標記的檢測是使用先前所登錄作爲工件標 記應登錄的圖形和重新所登錄的圖形進行工件標記的檢測 〇 接著，使用第5圖和第6圖的流程圖，針對工件標記 的檢測具體說明如下。201019056 VI. Description of the Invention: [Technical Field] The present invention relates to detecting a mask formed on a mask, an alignment mark (a mask mark), and a workpiece formed on a workpiece, an alignment mark (work mark) And positioning the two to form a predetermined positional relationship (alignment), and irradiating light onto the workpiece through the mask, and detecting the workpiece and the alignment mark and detecting the device. Technology] An exposure apparatus is used in the step of producing a pattern such as a semiconductor element, a printed circuit board, or a liquid crystal substrate by photolithography. The exposure device positions the mask forming the mask pattern and the workpiece on which the pattern is transferred in a predetermined positional relationship, and then irradiates the light containing the exposure light through the mask. Thereby, the mask pattern is transferred (exposed) onto the workpiece. The masking of the exposure apparatus and the positioning of the workpiece are generally performed as follows. • The mask mark formed on the mask and the workpiece mark formed on the workpiece are detected by an alignment microscope. The image processing of the detected data is performed to obtain the coordinates of each position, and the mask or the workpiece is moved in order to form the positional relationship between the two positions in advance. The mask and the workpiece must be positioned in the two directions (X direction and Y direction) and the direction of rotation (0 direction) in the plane. Therefore, the mask mark and the workpiece mark are formed at two or more places, respectively. Fig. 9 is a schematic view showing the outline of the alignment microscope 10 for detecting a mask mark. Further, since the mask mark and the workpiece mark are formed at two or more positions, respectively, the alignment microscope 10 is also provided in two or more places, respectively, but -5 - 201019056 is the same figure, and only one (one place) is displayed. The alignment microscope 10 is composed of a translucent mirror 10a, lenses L1, L2, and a CCD camera 10b. 11 is a control unit that performs image processing or the like, 12 is a monitor, and W is a workpiece on which a workpiece mark WAM is formed. In the same figure, the detection of the workpiece mark WAM (graphic search) is performed as follows. A) Registration of the workpiece mark. Before the detection of the workpiece mark registration WAM, for example, using the cross mark indicated by the 1st (#a) diagram, the control unit 11 is represented by the 10th (b) diagram, and 1 pixel of the monitor. For units, include a cross-shaped mark and its background login as a graphic. That is, in the same figure, for the sake of easy explanation, although the number of pixels is 5x5, 5 pixels in the center of the image are black cross type, and 20 pixels in the periphery are registered in a white pattern. Specifically, the sampling substrate forming the workpiece mark WAM to be detected is placed under the alignment microscope, and the illumination light is illuminated to illuminate it. By aligning the microscope (for example, 3x magnification) 10, the registration is performed. The monitor 1 2 uses the alignment microscope 10 to reflect the range in which the control unit 11 can perform image processing (for example, Fig. 11 shows a range of 15 mm x 15 mm). Next, in order to insert the registered workpiece mark WAM as a whole, a hypothetical line for registration of the workpiece mark (dotted line of Fig. 1) is placed on the monitor 1 to frame the workpiece mark WAM, and the work mark is registered in the control unit 1 1 WAM. The control unit 11 stores the workpiece mark WAM based on the contrast ratio of the pixels in the above-mentioned assumed line frame. By this, the registration of the workpiece mark WAM -6 - 201019056 is ended. The size of the workpiece mark WAM varies depending on the type of the workpiece, the user, and the engineering. However, for example, the size of the hypothetical line in which the workpiece mark WAM is framed is a line in which the first use of 200 a m to 700 y m is repeatedly used. The shape of the workpiece mark WAM is also different for the same reason as described above, and is not limited to the cross type shown in Fig. 10. Most of them are circular or the same as (b) shown in the 12th (a Φ) diagram, and a group of regular patterns is used as an alignment mark or the like. In any case, set the registration range to include the entire graphic of the 1 workpiece mark. B) Graphic Search Next, the actual workpiece mark WAM is detected. From the lower side of the alignment microscope, the sampling substrate registered using the pattern marked on the workpiece mark is removed, and the substrate (workpiece) on which the pattern is actually formed is placed. The magnification of the microscope is # the same magnification as the registration pattern (3 times) as described above. As shown in Fig. 9, the workpiece mark WAM is irradiated with the illumination light on the workpiece W via the semi-transparent mirror 10a of the alignment unit 10, and the image of the workpiece mark WAM is imaged by the CCD camera 10b. And the image of the workpiece mark WAM displayed on the monitor 12 is input to the control section 1 1, and converted into coordinate data in units of pixels of the monitor 12. The control unit 1 1 compares the registration pattern with the image of the workpiece mark WAM after reception. For example, when the image (detection pattern) of the workpiece mark after reception is the detection pattern A as shown in the first diagram (c), since it is 60% from the registration pattern formation 201019056, it is recognized as the number of points (related 60) 60. . Similarly, when the image (detection pattern) of the workpiece mark after reception is the detection pattern B as shown in Fig. 10(d), since the registration pattern is 80%, it is recognized as the number of points 80. Further, when the image (detection pattern) of the workpiece mark after reception is the detection pattern C indicated by the first e (e) diagram, since it is 100%, it is recognized as the number of points 1 〇〇. As described above, the image search for the entire area reflected by the monitor is identified as the (highest) position of the point closest to 1〇〇 as the position of the workpiece mark WAM φ (the position of the workpiece mark WAM is detected), and its position is set. The coordinates are stored as position coordinates of the workpiece mark. Specifically, the vicinity of the workpiece mark WAM disposed on the workpiece W is observed by the aligning unit. Fig. 13 is a view showing an area of the actual workpiece projected by the monitor 12 at this time. As described above, the magnification of the alignment microscope is the same as the magnification when the pattern of the workpiece mark is registered. Therefore, the same range as that of Fig. 11 (the range of 15 mm x 15 mm) is reflected on the monitor 12. This range is spanned over the entire area, so that the range in which the above-mentioned hypothesis @ wireframe is registered is moved (scanned) by 1 pixel, and the number of points is obtained at each position. In the area of the workpiece mark of Fig. 13 (15 m mx 15 mm range), for example, (B) may be formed in a pattern other than the workpiece mark, or (C) where dust adheres. The shape of the graphic or dust may also be similar to the shape of the registered workpiece mark. At this time, a plurality of positions with a relatively high number of points are detected in the image processing area. However, as described above, the control unit 1 1 is a unit in which the pixels of the assumed line are -8-201019056, and the workpiece mark WAM is stored in accordance with the comparison. Therefore, in the area of Fig. 13, as long as the workpiece mark WAM exists, the number of points at the position (A) will be the highest. Therefore, it is set to detect the position at which the highest number of points is detected as the position of the workpiece mark. Further, as described above, the method of comparing the input image with the image image prepared in advance to determine the degree of similarity is well known, and if necessary, for example, see Non-Patent Document 1. • [Non-Patent Document 1] 尻 尻 监 「 「 「 「 「 「 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 影像 FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU FU P5 0-p5 2 [Patent Document 1] JP-A-9-8-2615 SUMMARY OF INVENTION [Problem to be Solved by the Invention] φ In an exposure apparatus for a semiconductor wafer, a workpiece mark formed on a wafer of a workpiece is The circuit patterns formed on the same surface are similarly formed by photolithography. On the other hand, in the exposure apparatus of the printed circuit board, there is a case where a through hole (recess) of about Φ100#ιη formed by laser processing such as laser irradiation or a drill is used as a workpiece mark. The detection of the holes forming the above substrate is an illumination method called dark background illumination. In the dark background illumination, the illumination light is irradiated obliquely to the substrate, and the imaging element is placed above the substrate. It is difficult to detect the illumination hole from directly above. -9- 201019056 Fig. 14(a) is a view showing a state in which the hole 101 formed on the substrate 100 is photographed by dark background illumination by the alignment microscope of Fig. 9. Further, in the same figure, although the illumination light 103 is displayed only from the right side and the left side of the figure, the hole 101 is actually illuminated from the entire direction of 3 60 degrees. The illumination light 103 is incident on the printed substrate 100 in an oblique direction. The surface of the printed circuit board 100 is a diffusing surface, and the illumination light 103 that is irradiated on the surface of the substrate or the bottom portion of the hole is diffusely reflected, and a part of the printed light is incident on the reflecting element reflected by the mirror 102 (CCD, not shown). . φ On the other hand, the light incident on the wall surface of the hole 101 is diffused and reflected, and the light reflected by the wall surface is not directly incident on the photographic element (CCD). Therefore, in the photographic element, the hole 100 is irradiated with a portion of the wall and a brightness different from that of the outer portion (the surface of the printed substrate and the bottom portion of the hole). For example, in Fig. 14(b), the portion of the wall is a circle having a black frame edge, and the bottom portion of the hole is irradiated with gray as the surface of the substrate. Therefore, when the bottomed hole is ideally formed, the pattern of the circle as shown in Fig. 14(a) is registered as the registered image of the workpiece mark WAM. @ However, even if it is intended to be processed into a hole of the same shape, the presentation method (shape, lightness or darkness or hue) of the photographing means (CCD) may differ depending on the case where the micromirror is detected. One of the reasons is that the shape of the formed hole may be different by chance. 〇 Fig. 15 is an example of a shape of a hole formed by laser or a drill for a printed circuit board. The same figure is a sectional view of the hole. -10- 201019056 The 15th (a) picture shows the shape of the ideal hole. However, depending on the shape of the front end of the laser or the drill, as shown in Fig. 15(b), the wall of the hole will also be formed in an oblique direction (硏钵 shape). Further, as shown in Fig. 15(c), a burr 104 is also generated at the edge portion of the hole. As described above, the holes formed by the machining of the printed substrate 100 may have inconsistent shape formation. Therefore, the hole is used as a workpiece mark: When the inspection is performed by an alignment microscope, the manner in which the photographing means (CCD) is presented is different. The other reason why the photographing means (CCD) is different in appearance is due to the treatment after the hole is formed. For example, Fig. 15(d) shows that the printed substrate is plated with a metal foil such as copper 105 on the surface, and the holes are also subjected to electric ore. The reflectance of the surface is changed by metal plating, so that depending on the presence or absence of electroplating, the photographic means (CCD) is presented in a different manner. Further, as shown in Fig. 15(e), a resist film is adhered to the upper φ surface after metal plating. The thickness of the resist film 106 is several tens of gm, and when the resist film is adhered, it cannot be adhered along the side surface or the bottom surface of the hole, and clogging of the opening of the hole is formed. Therefore, the portion of the hole is a change in the reflectance of the illumination light or the direction in which the light is reflected by the resist film. When the resist film is not adhered and the resist film is adhered, the photographing means (CCD) is presented differently. . For example, as shown in Fig. 15(e), when the resist film is adhered, the shape of the hole detected by the alignment microscope is generally displayed in black circle 201019056 and, depending on the adhesion state of the uranium-resistant film. It will change the relaxation state of the film in the hole, which will make the photographic means (CCD) appear differently. When the presentation of the workpiece mark is different, the image of the workpiece mark actually photographed and the image of the workpiece mark stored in the control unit are different. When the above situation is caused, the number of points where the workpiece mark exists is lowered, and the workpiece mark cannot be detected correctly. Use Figure 16 to illustrate. The circle figure shown in Fig. 16(a) is an image of the workpiece mark registered in the control unit. 0 Fig. 16(b) shows a case where there is a workpiece mark in the area of the workpiece mark of the search (search) substrate, and the image is displayed in the same manner as the registered image. At this time, the registration mark of the 16th (a) diagram substantially coincides with the position surrounded by the four corners of the 16th (b) diagram, and the number of points is, for example, 9000 points (full point 1 0000). Fig. 16(c) is a view constituting the subject of the present invention. There is a workpiece mark in the searched area, but the display mode according to the above reason may be displayed in a black circle unlike the login mark. Although the central portion of the ring is white and the central portion of the black circle is black, the number of points around the four corners of Fig. 16(c) is low, for example, about 2000. Fig. 16(d) is a view showing a pattern of a black square outline such as a wiring other than the workpiece mark in the search area. At this time, although the shape is different, but the black and white portions in the middle black peripheral portion are similar in pattern, the number of points around the four corners of the 16th (d) figure is higher than that in the case of the 16th diagram, for example, 5000 points. Figure 16(c) and the registered mark are presented in different ways, but -12- 201019056 must be detected because it is a workpiece mark. However, the 16th (d) diagram is not a workpiece mark, so the inspection of the workpiece mark is not necessary. However, when the figure 6 (c) is detected as a workpiece mark, for example, when "the number of points 2000 points or more is used as the workpiece mark", the first 6 (d) image of the non-work mark is used as the control unit. The workpiece mark is detected. On the other hand, in order to prevent the case where "the number of points is 6000 points or more is used as the workpiece mark" in the case of the first mark (d) as the workpiece mark detection, the first 6 (c) image which is the workpiece mark cannot be detected. As described above, the workpiece mark formed on the workpiece in the same shape is processed by the processing condition of the workpiece mark or the manufacturing step of the printed substrate, and the presentation manner (shape or lightness or hue) illuminated by the image pickup element may be different. At this time, even if the workpiece mark is actually detected by the registered workpiece mark, there is a possibility that it cannot be detected. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for detecting a workpiece mark which can accurately detect a workpiece mark even if the difference is different between the workpiece marks of the photographic element of the alignment microscope. Method and device. [Means for Solving the Problem] When the workpiece/alignment mark (work mark) formed on the workpiece by protrusions or depressions (including the through holes) is observed by the alignment microscope, the same contour is observed, but some of them are observed. Defects, color and color density, and a variety of graphics with different shades and presentations. In the above plurality of figures, the same pattern but the color tone and color density • Ming -13 - 201019056 Dark different workpieces • The plurality of patterns to be detected by the alignment mark are registered in the memory unit. Further, when detecting the workpiece mark formed on the workpiece, the plurality of registration patterns to be detected as the workpiece and the alignment mark are read one by one, and the pattern on the workpiece after the image is captured and the registered pattern after the reading are compared, and two evaluations are evaluated. The degree of consistency. That is, first, the search for the search area is performed by the first graph registered, and the number of points is obtained by comparison with the pattern on the workpiece. Next, the search for the search area is performed by the 0 second pattern registered, and the number of points is obtained. This detection is repeated, and when the registration pattern indicating the number of points above the reset is detected, the registration pattern is used as the graphic corresponding to the workpiece mark. Alternatively, the above comparison may be repeated, and when the registration pattern showing the highest number of points is detected, the registration pattern is used as the graphic corresponding to the workpiece mark. As described above, once the registration pattern having the highest matching degree is displayed, or the registration pattern having the matching degree equal to or greater than the preset value is obtained, the image with the matching degree of the registration pattern is detected as the workpiece alignment mark ©, And save its location. In the exposure apparatus such as the projection exposure apparatus, as described above, the detected pattern is used as a workpiece mark, and the mask and the workpiece are positioned, and the mask pattern formed on the workpiece is transferred onto the workpiece. The mask and the workpiece are positioned such that the workpiece stage moves in the XY direction and rotates about an axis perpendicular to the XY plane to make the position coordinates of the detected workpiece mark, for example, and detect the landed mask in advance. The position coordinates of the alignment marks (mask marks) are the same. -14- 201019056 [Effect of the Invention] In the present invention, a plurality of registration patterns to be detected as workpieces and alignment marks are compared with figures on the workpiece after the image is taken, and the degree of coincidence is evaluated, and based on the evaluation result, The image on the rear workpiece is detected as the workpiece/alignment mark. Therefore, even if a part of the defect, the density of the color, the brightness and the darkness are different, and the workpieces of the same shape are marked differently, the actual detection of the workpiece mark can be performed. Therefore, even if the workpiece mark forms a projection or a recess on the workpiece, the workpiece mark can be surely detected and positioned accurately. [Embodiment] FIG. 1 is a view showing an example of a configuration of a projection apparatus which is one of the objects to which the present invention is applied. In the same figure, the MS is a mask holder. A mask 形 having a mask mark MAM and a mask pattern MP is placed on the mask holder MS. φ The exposure light is emitted from the light irradiation device 1. The emitted exposure light is irradiated onto the workpiece W placed on the workpiece holder WS via the mask Μ and the projection lens 2, and the mask pattern ΜΡ is projected onto the workpiece W for exposure. Between the projection lens 2 and the workpiece W, there are two alignment microscopes 1 which are movable in the direction of the arrow in the same figure. Before the mask pattern ΜΡ is exposed on the workpiece W, the alignment microscope 10 is inserted at the position shown, the mask mark ΜΑΜ and the workpiece mark WAM formed on the workpiece are detected, and the mask Μ and the workpiece W are positioned. After positioning, the alignment microscope 10 is withdrawn from the workpiece W. Also, Fig. 1 is an alignment microscopy -15-201019056 mirror showing only one of the two locations. The alignment microscope 10 is constituted by a semi-transparent mirror 10a, a lens LI, L2, and a CCD camera 10b as described above. In order to perform the dark background illumination shown in Fig. 14, the alignment microscope 10 is provided with illumination means 10c for illuminating the illumination light from the substrate obliquely. The mask mark MAM image, the workpiece mark image, and the like imaged by the CCD camera 10b aligned with the microscope are sent to the control unit 11. The control unit 11 includes a video processing unit 11a that processes the image of the image captured by the CCD camera, and a position coordinate information, various parameters, and the like for storing a plurality of registration patterns, mask marks, and the like to be detected as workpiece marks. Memory part 1 1 b. In addition, the control unit 1 1 includes a comparison/evaluation unit that calculates the number of points by comparing the image obtained by the video processing unit 11a and the image stored in the memory unit lib by the CCD camera 10b. 11c: based on the degree of coincidence obtained by the comparison/evaluation unit 11c, it is determined whether or not the pattern on the workpiece after the image is the determination unit portion lid of the pattern detected as the workpiece mark; moving the workpiece holder WS or the mask holder MS (or Both of them are such that the position coordinates of the pattern detected by the workpiece mark are aligned with the position coordinates of the position mark of the mask mark image stored in the unit 1 1 b; and the supplier mark is registered according to the instruction of the operator. The registration unit Ilf to the memory unit 1 1 b. The workpiece holder WS or the mask holder MS is driven by the workpiece holder driving mechanism 4 and the mask holder driving mechanism 3 controlled by the positioning control unit lie in the XY direction (X, Y: in the mask holder MS, the workpiece holder) While the WS planes are moving in parallel and orthogonal to each other, they are rotated around the vertical axis on the χγ plane. The control unit 11 is connected to the monitor 12, and displays the image processed by the image processing unit 11a on the screen of the monitor 12. In Fig. 1, the positioning of the mask Μ and the workpiece W is performed as follows. The illumination light is applied to the mask 从 from the light irradiation device 1 or an alignment light source (not shown), and the image of the mask φ mark Μ AM image is imaged by the CCD camera 10b of the alignment microscope 10, and sent to the control unit 丨1. The image processing unit 11a of the control unit 1 1 converts the mask mark Μ AM image into a position coordinate and stores it in the memory unit 1 1 b. Further, there are various methods for detecting a mask mark, and for example, see Patent Document 1 and the like. Next, the illumination light is irradiated from the illumination means 10c of the alignment microscope 10 to the workpiece W, and the pattern search is performed as described above, and the workpiece mark WAM on the workpiece W is detected, and the control unit 11 obtains the position coordinates thereof. The control unit 11 moves the workpiece holder WS (or the mask holder MS, or both) to position the mask Μ and the workpiece W such that the position coordinates of the stored mask mark 和 and the position coordinates of the detected workpiece mark WAM are predetermined. The positional relationship. Next, the detection order of the workpiece marks and the positioning of the mask will be described in more detail with reference to Figs. 2, 3, and 4. (1) First, the position of the mask mark ΜΑΜ is detected. For this reason, as shown in Fig. 2(a), the position coordinates (xml, ym2) of the mask mark MAM in the field of view (within the angle of view) of the microscope 10 are obtained. -17- 201019056 That is, the image captured by the CCD camera 10b of the alignment microscope 10 is processed by the image processing unit 11a of the control unit 11, and the position coordinates (xml, ym2) of the mask mark MAM are obtained and stored in the memory unit lib. . (2) The workpiece mark is registered in the memory unit 丨b of the control unit 1丨. The registration is as follows, and the worker is visually observed. The actual workpiece is placed on the workpiece holder WS, and the surface image of the workpiece W1 is received by the alignment microscope 10, and processed by the image processing unit iia to reflect the surface of the workpiece W1 on the monitor 12. The alignment microscope 10 at this time is the same alignment microscope 10 as when the workpiece mark WAM is actually detected, and the magnification of the alignment microscope 10 is actually the same magnification (for example, three times) as when the workpiece mark WAM is detected. Further, the alignment microscope 10 is held at the same position as the position at which the mask mark is detected. The field of view (viewing angle) of the alignment microscope 10 is also the same. The operator looks at the image of the projected workpiece W1 and looks for the workpiece mark WAM. - When the figure to be registered as the workpiece mark WAM is found, the description of the "registration of the workpiece mark" is also shown as the 2nd (bl) figure. In order to allow the workpiece mark WAM to enter as a whole, the workpiece mark WAM is set on the monitor 12 with a hypothetical wire frame for registration of the workpiece mark, for example, a mark of + or the like is specified by visually specifying the center position thereof. For example, when the workpiece mark WAM is circular, the image observed by the alignment microscope i 例如 is shown, for example, in the third (b-2) diagram. Although a circle or a black circle is displayed, the worker can select the image according to the pattern. The workpiece mark WAM should be registered as a graphic. In addition, 'the figure to be registered as the workpiece mark WAM is the assumed line frame for the 201019056 workpiece mark registration, and the area enclosed by the line is assumed to be the figure image of the work mark WAM1, and the registration part Ilf is given the registration instruction. Log in to Jiyi Department Π b. Further, by visually recognizing the center position of the figure, the distance dx, dy from the upper left corner of the square formed by the hypothetical line to the center position of the figure is registered as the position coordinate of the figure to the memory means lib. Here, as shown in the third (b-3) diagram, when the setting of the center position of the figure is not correct, the error position (position of +) is registered as the workpiece mark position. Further, the method of automatically obtaining the position of the center of the figure by calculation or the like is known from the past, but the setting of the center position of the figure is not visually recognized, but is automatically obtained by the image processing unit 11a by image processing. In the past, as described above, the registration of the workpiece mark WAM is completed when only one workpiece mark is registered. However, the present invention is registered as a workpiece mark in a plurality of figures which are different in presentation manners to be registered as workpiece marks. Φ Therefore, when the workpiece mark is continuously registered, the current workpiece W1 is detached from the workpiece holder WS, and the other second workpiece mark W2 of the workpiece mark WAM having the same shape is surely placed on the workpiece holder WS. And, as in the above, the surface of the workpiece W2 is projected onto the monitor 12 by the alignment microscope 10 to find the workpiece mark WAM. When the workpiece mark WAM found is different from the presentation mode (shape, brightness, or hue) of the previously registered workpiece mark WAM, the same as the above-described hypothetical wire frame for the workpiece mark registration, the second workpiece mark WAM2 is registered. The memory unit 1 1 b of the control unit 1 1 . -19- 201019056 Next, the workpiece W2 is detached from the workpiece holder WS, and the third workpiece W3 is placed on the workpiece holder WS. The surface of the workpiece W3 is projected onto the monitor 1 by the alignment microscope 1' to find the workpiece mark wAM. When the workpiece mark WAM found is different from the presentation mode (shape, brightness, or hue) of the workpiece mark WAM1 or WAM2 registered so far, the same as the above, the assumed line frame for registering the workpiece mark is used as the third The workpiece mark WAM3 is registered in the unit 1 1 b of the control unit 1 1 . (3) Next, the registered workpiece mark and the graphic parameter on the workpiece are compared, and the workpiece mark on the workpiece W is detected. The workpiece marking is detected, and all the workpiece marks WAM1 to η registered in the memory unit 1 1 b of the control unit 1 1 are used to search (search) the graphics in the search area. The comparison/evaluation unit 11c compares the points of the degree of matching between the registered workpiece marks WAM'1 to η and the patterns in the search area. When the determination unit lid determines that the number of points exceeds a certain value or is the highest point, the determination unit lid takes the workpiece mark from among the registered workpiece marks WAM1 to n. Further, the workpiece mark having the highest degree of matching is obtained, or the figure in the search area corresponding to the workpiece mark having the degree of coincidence of @ set in advance is detected as the work mark on the workpiece W, and its position is stored. For example, there are two types of presentation of the workpiece mark. The first workpiece mark WAM1 is a circle pattern, and the second workpiece mark WAM2 is a black circle shape pattern, and the two workpiece marks WAM1 and WAM2 are used for searching. In other words, first, the search for the search area is performed by the first workpiece mark WAM1 to obtain the number of points. Then, the second workpiece mark WAM2 is used to search the search area -20- 201019056 to find the number of points. Further, the positioning control unit 1 1 e uses the workpiece mark of the number of points set in advance or more, or uses the workpiece mark which detects the highest number of points to position the mask and the workpiece. The search for the workpiece mark is performed as shown in Fig. 4. For example, the rectangular area p indicated by the search for the 4th (c-1) map is registered in the memory unit 1 1 b. When the workpiece mark search is performed, as shown in Fig. 4 (c-2), in the field of view of the φ quasi-microscope, for example, from the upper left end of the field of view, the figure including the workpiece mark WAM shown in the fourth (cl) figure is made. The rectangular areas P of the vertical Y and the horizontal X are overlapped while being slightly offset to find a place having a high degree of matching. Further, when a region having a high degree of matching is searched in the field of view of the alignment microscope 10, the coordinates (X1, yl) of the upper left corner of the rectangular region P at this time are obtained, plus the center position of the figure in the display region P ( Dx, dy ), as the position coordinate (❹ xwl , ywl) of the workpiece mark that detects (xl+dx, yl+dy). (4) When the position coordinates of the workpiece mark are detected as described above, the positioning control unit 1 1 e is as shown in the fourth (d) diagram, in order to detect the position coordinates (xwl, ywl) of the workpiece mark WAM and the advance The position coordinates (xml, yml) of the stored workpiece marks are such that the workpiece mark WS or the workpiece frame MS (or both of them) is moved to make the two match. In the above description, although the plurality of workpiece marks WAM are collectively registered, the search for the search area (search) is performed using the workpiece marks WAM1 to n, but the workpiece-21 may be performed. 201019056 Marking detection and positioning of the mask Μ and the workpiece W, and detecting the pattern to be registered as the workpiece mark, and registering the pattern as the workpiece mark, that is, first registering the first workpiece mark WAM, and using the registered The workpiece mark detects the workpiece mark on the workpiece W and uses the detected workpiece mark to perform positioning. Further, in the process of detecting the workpiece mark, upon detecting the pattern to be registered as the workpiece mark of the new different presentation mode, the figure is registered as the workpiece mark WAM to the memory 0 lib as described above. The subsequent detection of the workpiece mark is performed by using the previously registered graphic as the workpiece mark and the re-registered graphic for the detection of the workpiece mark. Next, using the flowcharts of FIGS. 5 and 6 for the detection of the workpiece mark described as follows.
在此，登錄後的工件標記的圖形（登錄標記）有 WAM1和WAM2的2個，第1登錄標記WAM1是如第5 ( Q a)圖表示爲環狀的圖形，第2登錄標記WAM2則是如第 5 (b)圖表示爲黑圓圈形的圖形。 (1)如第5(c)圖表示，工件標記的檢索區域會有 顯現環狀工件標記的場合。 (i )搜尋的開始。首先，i =第1的登錄圖形，即以 第1登錄圖形WAM1進行檢索區域的搜尋（第6圖的步驟 S 1、S 2 )。一旦檢測出第5 ( c )圖的圖形時，以控制部 1 1的比較•評估部1 1 c比較·評估第1登錄圖形WAM 1和 -22- 201019056 第5(c)圖的圖形，求得點數。 第1登錄標記WAM1由於實際顯示的第5(c)圖的 工件標記和圖形大致一致，因此可獲得高的點數，例如 9000點。將該値作爲第1登錄標記WAM1的點數儲存到 控制部1 1的記憶部1 lb (步驟S3 )。 (ii )前進到步驟S4，在i加上1形成i = 2。n = 2， 並非i > η，因此以i = 2的第2登錄標記WAM2搜尋檢索區 φ 域（步驟S1、S2)。 (iii )相對於第2登錄圖形WAM2的黑圓圈，所顯 示工件標記的圖形爲第5(c)圖表示的圓圈時，點數降低 ，例如形成2000點。將該値作爲第2登錄標記WAM2的 點數儲存到記憶部1 1 b (步驟S3 )。 (iv)前進到步驟S4，在i加上1形成i = 3。形成i >n，因此’在控制部11的判定部lid比較第1登錄 WAM 1的點數9 000點和第2登錄標記WAM2的點數2000 # 點。並且’採用獲得高點數的第1登錄標記WAM 1作爲具 有第5 (c)圖的圖形之工件的工件標記。結束以上搜尋。 (2)如第5(d)圖表示，工件標記顯示黑圓圈形的 場合是形成如下。並且’和上述重複的部分省略其說明。 (i)首先，以第1登錄圖形WAM1搜尋檢索區域 。兩者的圖形不相似，點數爲低的2000點。將該値作爲 第1登錄標記WAM1的點數儲存到記憶部lib。 (ii )接著，以第2登錄標記WAM2捜尋檢索區域 。第2登錄標記WAM2和所顯示工件標記在圖形上極爲相 -23- 201019056 似，因此獲得高的點數（9000點）。將該値作爲第2登錄 標記W AM2的點數儲存到記憶部1 1 b。 (ϋΐ )控制部11的判定部lid比較第1登錄 WAM1的點數2000點和第2登錄標記WAM2的點數9000 點。並且，採用獲得高點數的第2登錄標記WAM2作爲第 5 ( d )圖的工件的工件標記。 (3)並非第5(e)圖表示的配線等黑四角形的環狀 工件的工件圖形與第5(c)圖或第5(d)圖的工件標記 混合存在的場合。即使是這樣的場合，仍然可正確檢測出 工件標記，在以下加以說明。 (a )第5 ( c )圖的環狀工件標記和第5 ( d )圖的黑 四角形的環狀工件圖形混合存在的場合。 (i)首先，以第1登錄圖形WAM1捜尋檢索區域 。相對於第5(e)圖的圖形的點數爲5000點，相對於第 5(c)圖的圖形的點數爲9 0 00點。控制部1 1的比較•評 估部11c將高的一方的9000點的點數作爲第1登錄標記 WAM1的點數儲存到記憶部lib。 (Π)接著，以第2登錄圖形WAM2搜尋檢索區域 。相對於第5(e)圖的圖形的點數爲1500點，相對於第 5(c)圖的圖形的點數爲2 000點。比較•評估部1 lc將 高的一方的2000點的點數作爲第2登錄標記WAM2的點 數儲存到記憶部1 1 b。 (iii )控制部1 1的判定部Π d比較第1登錄標記 WAM1的點數9000點和第2登錄標記WAM2的點數2000 201019056 點。並且採用獲得高點數的根據第1登錄標記WAM2的搜 尋結果的第5(c)圖的圖形作爲工件標記。 (b)第5(d)圖的黑圓圈的工件標記和第5(e)圖 的黑四角形的環狀工件圖形混合存在的場合。 (〇首先，以第1登錄圖形WAM1搜尋檢索區域 。相對於第5(e)圖的圖形的點數爲5000點，相對於第 5 (d)圖的圖形的點數爲2000點。比較•評估部11c將 φ 高的一方的5000點的點數作爲第1登錄標記WAM1的點 數儲存到記憶部1 1 b。 (ii )以第2登錄圖形WAM2搜尋檢索區域。相對 於第5(e)圖的圖形的點數爲1500點，相對於第5(d) 圖的圖形的點數爲9000點。比較•評估部1 ic將高的一 方的900 0點的點數作爲第2登錄標記WAM2的點數儲存 到記憶部1 1 b。 (iii )判定部1 Id比較第1登錄標記WAM1的點數 φ 5000點和第2登錄標記WAM2的點數9000點。並且採用 獲得高點數的根據第2登錄標記WAM2的搜尋結果的第5 (d )圖的圖形作爲工件標記。 如以上說明’控制部U中，只要採用獲得最高點數 的登錄標記作爲工件標記預先加以設定時，不致有例如上 述黑四角形的環狀圖形誤作爲工件標記進行檢測。 再者，檢索區域實際上不存在著（沒有黑圓圈或圓環 )工件標記的場合，有可能點數爲5000點的四角形被誤 判爲黑色工件圖形而作爲工件標記進行檢測。其對策是在 -25- 201019056 控制部1 1例如預先設定「僅點數9000點以上的場合，採 用作爲工件標記」即可。 如上述，工件標記的呈現方式（形狀或明暗或色調） 有著種種不同的場合，將其呈現方式所有不同的圖形加以 登錄。 但是，一旦增加登錄圖形（登錄標記）的數量時，在 曝光裝置中，掩模和工件的定位一倂重複進行第6圖的流 程圖所示的處理（形成i>n爲止，針對所有的登錄標記 _ 進行搜尋，求得點數）時，工件標記的檢測極爲耗時，其 結果整體會增長曝光處理的時間。即生產量不良。 因此，例如可考慮在登錄標記i(第i個登錄標記） 獲得重新設定點數以上的點數後，在其階段結束搜尋，跳 過接著的第i+Ι個以後的登錄標記的搜尋，設定前進到 接著的順序（工件標記的位置檢測和掩模和工件的定位） 〇 將此不前進到接著的登錄標記之搜尋所獲得的點數値 稱爲「中斷閾値」。 —旦顯示上述「如獲得重新所設定點數以上的點數後 ，在其階段結束其搜尋」的流程圖時，形成如第7圖表示 〇 第7圖中，工件標記的檢測處理是如以下進行。 在此，預先登錄η個工件標記的圖形（登錄圖形）。 預先在控制部1 1的記憶部1 1 b設定中斷閾値（例如9000 點）。中斷閾値是應可正確檢測工件標記的點數値，預先 -26- 201019056 以實驗等求得。 (i )搜尋開始。以i =第1個登錄圖形的第1登錄圖 形WAM1搜尋檢索區域（步驟si、S2)。比較·評估部 1 1 c將搜尋後的最高點數作爲第1登錄標記WAM 1所檢測 出圖形的點數儲存在記憶部lib (步驟S3)。 (Π )以判定部1 Id比較儲存後第1登錄標記WAM1 所檢測出圖形的點數和中斷閾値（例如9000點）（步驟 • S4)。 第1登錄標記WAM1的點數在9000點以上時，不進 行第2登錄標記WAM2以後的搜尋，採用第1登錄標記 W AM 1所檢測出的圖形作爲工件標記，結束搜尋（步驟S 6 )° (iii )第1登錄標記WAM1的點數小於9000點時， 前進到步驟S6，在i加上1，i = 2以第2登錄標記WAM2 搜尋檢索區域（步驟S1、S2)。 將搜尋後的最高點數作爲第2登錄標記WAM2所檢測 出圖形的點數儲存在記憶部lib (步驟S3)。 (iv )以判定部1 1 d比較儲存後第2登錄標記WAM2 所檢測出圖形的點數和中斷閾値（例如9000點）（步驟 S4)。第2登錄標記WAM2所檢測出圖形的點數在9000 點以上時，不進行第3登錄標記WAM3以後的搜尋，採用 第2登錄標記WAM2所檢測出的圖形作爲工件標記，結束 搜尋（步驟S6)。 (v )第2登錄標記WAM2所檢測圖形的點數也小於 -27- 201019056 9000點時，以第3登錄標記WAM3進行檢索區域的捜尋 〇 將此重複至i = n爲止’一旦檢測出超過中斷閾値的圖 形時，採用其圖形作爲工件標記（步驟S6 )。 如果沒有超過中斷閾値的圖形時，從第1登錄標記 WAM1比較第η登錄標記WAMn所檢測出圖形的各點數。 並且採用所獲得之最高點數的第1登錄標記WAMi檢測出 的圖形作爲工件標記（步驟S7)，結束搜尋。 如上述，預先設定中斷閾値時，不需針對掩模與工件 定位一倂之所有登錄圖形進行搜尋，可縮短工件標記的檢 測時間。 並且’除了中斷閾値的設定，也可以預先儲存各登錄 標記的使用次數，從使用次數多的登錄標記依序進行搜尋 ’或者從近來（最近）使用的標記依序進行捜尋等，預先 對控制部11附加學習功能，可更提高儘早捜尋到高點數 的登錄標記的可能性，獲得工件標記檢測時間的縮短。 再者，本發明是以基板形成有底的孔（凹部、凹陷） 作爲工件•對準標記（工件標記）使用的場合爲例，說明 在該孔電鍍或黏貼抗蝕劑，以對準顯微鏡所檢測出工件標 記的不同呈現方式（形狀或明暗或色調）。 但是，不限於孔的場合，也可如第8(a)圖表示以形 成在基板100的突起107 (凸部、隆起）作爲工件•對準 標記使用的場合，由於工件標記的呈現方式變化，因此可 運用本發明。 -28- 201019056 並且’也有如第8(b)圖表示，根據銅105等的有無 電鍍變化表面的反射率而使得呈現方式變化的場合。 另外，如第8(c)圖表示在突起黏貼抗蝕膜106時， 不能沿著突起的側面黏貼，可在突起的側面形成空間。因 此，會使照明光的反射率或光的反射方向變化，在未黏貼 有抗蝕膜的場合和黏貼有抗蝕膜的場合使得攝影手段（ CCD )的呈現方式不同。 此外，根據抗蝕膜的黏貼狀態，會使薄膜的鬆弛狀態 改變而使得呈現方式變化，該等的場合也可以運用本發明 置 裝 光 曝 影 投 的 1 之 象 對 用 H3U 0 的 明 發 本 1示 月表 說是 單圖 簡 1 式第 圖 的構成例圖。 第2圖爲本發明實施例之工件標記的檢測順序和掩模 和工件的定位的說明圖（1 )。 第3圖爲本發明實施例之工件標記的檢測順序和掩模 和工件的定位的說明圖（2 )。 第4圖爲本發明實施例之工件標記的檢測順序和掩模 和工件的定位的說明圖（3 )。 第5圖是表示登錄後的工件標記和以對準顯微鏡所攝 影的輸入影像的例圖。 第6圖是表示工件標記的檢測處理順序的流程圖。 第7圖是表示工件標記的其他檢測處理順序的流程圖 -29- 201019056 第8圖是表示工件標記的呈現方式不同的其他例的圖 〇 第9圖是表示對準顯微鏡的槪略構成的圖° 第10圖是表示登錄圖形和檢測圖形的一例的圖。 第11圖是表示監測器所顯示之影像的一例圖。 第12圖是表示工件標記的形狀例的圖° 第13圖是說明圖形搜尋的圖。 @ 第14圖是模式表示藉對準顯微鏡’以暗背景照明攝 影形成在基板的孔的樣子的圖。 第1 5圖是表示在印刷基板以雷射或鑽孔加工形成的 孔的形狀的例圖。 第16圖是表示登錄後的工件標記和檢索區域的影像 的例圖。 【主要元件符號說明】 Θ 1 :光照射裝置 2 :投影透鏡 3 :掩模架驅動機構 4:工件架驅動機構 1 〇 :對準顯微鏡 l〇a :半透明反射鏡 10b : CCD攝影機 l〇c :照明手段 •30- 201019056 11 :控制部 1 la :影像處理部 1 1 b :記憶部 1 1 c :比較·評估部 1 1 d :判定部 1 1 e :定位控制部 1 1 f :登錄部 Φ 1 2 :監測器 L 1、L2 :透鏡 Μ :掩模 (掩模標記 ΜΑΜ :掩模·對準標 M S :掩模架 W :工件 (工件標記 WAM :工件.對準標 W S :工件架 -31 -Here, the pattern (registration mark) of the workpiece mark after registration is two of WAM1 and WAM2, the first registration mark WAM1 is a figure represented by a fifth (Q a) diagram, and the second registration mark WAM2 is Figure 5 (b) shows a black circle shape. (1) As shown in Fig. 5(c), the search area of the workpiece mark may have a ring-shaped workpiece mark. (i) The beginning of the search. First, i = the first registration pattern, that is, the search for the search area is performed by the first registration pattern WAM1 (steps S1 and S2 in Fig. 6). When the graph of the fifth (c) graph is detected, the comparison/evaluation unit 1 1 c of the control unit 1 1 compares and evaluates the graphs of the first registration graph WAM 1 and -22-201019056, the fifth graph (c). Get points. Since the first registration mark WAM1 substantially coincides with the workpiece mark and the figure in the fifth (c) view actually displayed, a high number of points, for example, 9000 points can be obtained. The number of points in which the 値 is the first registration mark WAM1 is stored in the memory unit 1 lb of the control unit 1 1 (step S3). (ii) Advancing to step S4, adding 1 to i forms i = 2. n = 2, not i > η, so the second registration mark WAM2 with i = 2 searches for the search area φ field (steps S1, S2). (iii) With respect to the black circle of the second registration pattern WAM2, when the pattern of the workpiece mark is displayed as the circle shown in Fig. 5(c), the number of dots is lowered, for example, 2000 dots are formed. The number of points in which the 値 is the second registration mark WAM2 is stored in the storage unit 1 1 b (step S3). (iv) Advancing to step S4, adding 1 to i forms i = 3. When i >n is formed, the determination unit lid of the control unit 11 compares the number of points of the first registration WAM 1 by 9 000 points and the number of points of the second registration mark WAM2 by 2000 points. Further, the first registration mark WAM 1 which obtains a high number of points is used as the workpiece mark of the workpiece having the figure of the fifth (c) figure. End the above search. (2) As shown in Fig. 5(d), the case where the workpiece mark shows a black circle shape is formed as follows. And the description of the same as the above is omitted. (i) First, the search area is searched for by the first registration pattern WAM1. The graphics of the two are not similar, and the number of points is 2000 points. The number of points in which the 値 is the first registration mark WAM1 is stored in the memory unit lib. (ii) Next, the search area is searched by the second registration mark WAM2. The second registration mark WAM2 and the displayed workpiece mark are extremely similar on the graph -23- 201019056, so a high number of points (9000 points) is obtained. The number of points in which the 値 is the second registration mark W AM2 is stored in the storage unit 1 1 b. (ϋΐ) The determination unit lid of the control unit 11 compares the number of points of the first registration WAM1 by 2000 points and the number of points of the second registration mark WAM2 by 9000 points. Further, the second registration mark WAM2 which obtains the high number of points is used as the workpiece mark of the workpiece of the fifth (d) diagram. (3) It is not the case where the workpiece pattern of the black square annular workpiece such as the wiring shown in Fig. 5(e) is mixed with the workpiece mark of Fig. 5(c) or Fig. 5(d). Even in such a case, the workpiece mark can be correctly detected and will be described below. (a) Where the annular workpiece mark of Fig. 5(c) and the black square annular workpiece pattern of Fig. 5(d) are mixed. (i) First, the search area is searched by the first registration pattern WAM1. The number of dots with respect to the graph of Fig. 5(e) is 5000 dots, and the number of dots for the graph of Fig. 5(c) is 900 00 dots. The comparison/evaluation unit 11c of the control unit 1 1 stores the number of points of the higher one of 9000 points as the number of points of the first registration mark WAM1 in the memory unit lib. (Π) Next, the search area is searched by the second registration pattern WAM2. The number of dots with respect to the graph of Fig. 5(e) is 1500 dots, and the number of dots with respect to the graph of Fig. 5(c) is 2 000 dots. The comparison/evaluation unit 1 lc stores the number of points of 2000 points of the higher one as the number of points of the second registration mark WAM2 in the storage unit 1 1 b. (iii) The determination unit Π d of the control unit 1 1 compares the number of points of the first registration mark WAM1 by 9000 points and the number of points of the second registration mark WAM2 by 2000 201019056 points. Further, a graph of the fifth (c) map of the search result of the first registration mark WAM2 obtained as a high point is used as the workpiece mark. (b) A case where the workpiece mark of the black circle in Fig. 5(d) and the ring-shaped workpiece pattern of the black square shape of Fig. 5(e) are mixed. (〇 First, the search area is searched by the first registration pattern WAM1. The number of points in the figure with respect to the fifth (e) figure is 5000 points, and the number of points in the figure of the fifth (d) figure is 2000 points. The evaluation unit 11c stores the number of points of 5000 points having the highest φ as the number of points of the first registration mark WAM1 in the storage unit 1 1 b. (ii) Searching for the search area by the second registration pattern WAM2. The number of points in the graph of the graph is 1500 points, and the number of points in the graph of the fifth (d) graph is 9000 points. The comparison/evaluation unit 1 ic sets the number of points of 900 0 points higher as the second registration mark. The number of points of the WAM 2 is stored in the storage unit 1 1 b. (iii) The determination unit 1 Id compares the number of points φ 5000 points of the first registration mark WAM1 with the number of points of the second registration mark WAM2 by 9000 points. The figure of the fifth (d) figure of the search result of the second registration mark WAM2 is used as the workpiece mark. As described above, the control unit U is not set as long as the registration mark having the highest number of points is used as the workpiece mark. For example, the ring pattern of the above black square is mistakenly detected as a workpiece mark. When the area does not actually have a workpiece mark (no black circle or ring), it is possible that the square of 5000 points is misjudged as a black workpiece pattern and detected as a workpiece mark. The countermeasure is controlled at -25- 201019056 For example, in the case where the number of points is only 9000 or more, the part 1 1 is used as the workpiece mark. As described above, the presentation manner (shape, brightness, or hue) of the workpiece mark is different, and the presentation manner is all Different graphics are registered. However, once the number of login graphics (login marks) is increased, the positioning of the mask and the workpiece is repeated in the exposure apparatus, and the processing shown in the flowchart of Fig. 6 is repeated (formation i>n) When the search is performed for all the registration marks _ and the number of points is obtained, the detection of the workpiece mark is extremely time consuming, and as a result, the exposure processing time is increased overall. That is, the throughput is poor. Therefore, for example, the registration mark i can be considered. (i-th registration mark) When the number of points above the number of points is reset, the search ends at the stage, and the next i+Ι is skipped. In the subsequent search of the registration mark, the setting proceeds to the next order (position detection of the workpiece mark and positioning of the mask and the workpiece). The number of points obtained by the search for the next registration mark is called "interruption threshold". Once the above-mentioned flow chart "If the number of points above the set number of points is re-established and the search is completed at the stage" is displayed, it is formed as shown in Fig. 7. In Fig. 7, the detection processing of the workpiece mark is Here, the pattern (registration pattern) of the n workpiece marks is registered in advance. The interruption threshold 値 (for example, 9000 points) is set in advance in the memory unit 1 1 b of the control unit 1 1 . The interruption threshold 値 is the number of points that should be able to correctly detect the workpiece mark 値, which is obtained by experiment or the like in advance -26- 201019056. (i) The search begins. The search area is searched for in the first registration pattern WAM1 of i = first registration pattern (steps si, S2). The comparison/evaluation unit 1 1 c stores the highest number of points after the search as the number of points detected by the first registration mark WAM 1 in the storage unit lib (step S3). (Π) The determination unit 1 Id compares the number of points detected by the first registration mark WAM1 after storage and the interruption threshold 例如 (for example, 9000 points) (step S4). When the number of points of the first registration mark WAM1 is 9000 or more, the search after the second registration mark WAM2 is not performed, and the pattern detected by the first registration mark W AM 1 is used as the workpiece mark, and the search is ended (step S 6 ). (iii) When the number of points of the first registration mark WAM1 is less than 9000 points, the process proceeds to step S6, and i is incremented by 1, i = 2, and the search area is searched for by the second registration mark WAM2 (steps S1, S2). The highest number of points after the search is stored in the memory unit lib as the number of points detected by the second registration mark WAM2 (step S3). (iv) The determination unit 1 1 d compares the number of points detected by the second registration mark WAM2 after storage and the interruption threshold 例如 (for example, 9000 points) (step S4). When the number of points of the pattern detected by the second registration mark WAM2 is 9000 or more, the search after the third registration mark WAM3 is not performed, and the pattern detected by the second registration mark WAM2 is used as the workpiece mark, and the search is ended (step S6). . (v) When the number of points detected by the second registration mark WAM2 is also smaller than -27-201019056 9000 points, the search for the search area is performed by the third registration mark WAM3, and this is repeated until i = n. When the graph of the threshold 中断 is interrupted, its graph is used as the workpiece mark (step S6). If there is no pattern exceeding the interruption threshold ,, the number of points of the pattern detected by the nth registration mark WAMn is compared from the first registration mark WAM1. Then, the pattern detected by the first registration mark WAMi of the highest number of points obtained is used as the workpiece mark (step S7), and the search is ended. As described above, when the interrupt threshold is set in advance, it is not necessary to search for all the registered patterns of the mask and the workpiece, and the detection time of the workpiece mark can be shortened. In addition, in addition to the setting of the interrupt threshold ,, the number of times of use of each registration mark can be stored in advance, and the search mark can be searched sequentially from the number of used registration marks, or the tags used recently (most recently) can be searched in order, etc., and the control is performed in advance. The addition of the learning function to the part 11 can further increase the possibility of finding the registration mark of the high point as early as possible, and shorten the detection time of the workpiece mark. Furthermore, the present invention is an example in which a substrate having a bottomed hole (recess, recess) is used as a workpiece/alignment mark (work mark), and the plating is applied or adhered to the hole to align the microscope. Different presentations (shape or shading or hue) of the workpiece mark are detected. However, when it is not limited to the hole, as shown in Fig. 8(a), when the projection 107 (protrusion, ridge) formed on the substrate 100 is used as the workpiece/alignment mark, the presentation manner of the workpiece mark changes. Therefore, the present invention can be applied. -28-201019056 Further, as shown in Fig. 8(b), there is a case where the presentation mode changes depending on the presence or absence of the reflectance of the plating surface of the copper 105 or the like. Further, as shown in Fig. 8(c), when the resist is adhered to the resist film 106, it is not possible to adhere along the side surface of the protrusion, and a space can be formed on the side surface of the protrusion. Therefore, the reflectance of the illumination light or the direction of reflection of the light is changed, and the photographing means (CCD) is presented differently in the case where the resist film is not adhered and when the resist film is adhered. In addition, depending on the adhesion state of the resist film, the relaxed state of the film is changed to change the presentation mode, and in the case of the above, the image of the image of the present invention can be used for the image of the H3U 0. 1 The monthly table is a diagram showing the structure of a single figure. Fig. 2 is an explanatory view (1) of the detection order of the workpiece mark and the positioning of the mask and the workpiece according to the embodiment of the present invention. Fig. 3 is an explanatory view (2) of the detection order of the workpiece mark and the positioning of the mask and the workpiece according to the embodiment of the present invention. Fig. 4 is an explanatory view (3) of the detection order of the workpiece mark and the positioning of the mask and the workpiece according to the embodiment of the present invention. Fig. 5 is a view showing an example of the workpiece mark after registration and the input image taken by the alignment microscope. Fig. 6 is a flow chart showing the procedure of the detection process of the workpiece mark. Fig. 7 is a flow chart showing another procedure for detecting the workpiece mark. -29- 201019056 Fig. 8 is a view showing another example in which the workpiece marks are displayed in different ways. Fig. 9 is a view showing a schematic configuration of the alignment microscope. ° Fig. 10 is a view showing an example of a registration pattern and a detection pattern. Fig. 11 is a view showing an example of an image displayed by the monitor. Fig. 12 is a view showing an example of the shape of a workpiece mark. Fig. 13 is a view for explaining a pattern search. @ Fig. 14 is a view showing a state in which a hole is formed by illuminating a microscope with a dark background illumination to form a hole in a substrate. Fig. 15 is a view showing an example of a shape of a hole formed by laser or drilling on a printed circuit board. Fig. 16 is a view showing an example of an image of a workpiece mark and a search area after registration. [Description of main component symbols] Θ 1 : Light irradiation device 2 : Projection lens 3 : Mask holder drive mechanism 4 : Workpiece frame drive mechanism 1 对准: Alignment microscope l〇a : Semi-transparent mirror 10b : CCD camera l〇c : Illumination means 30 - 201019056 11 : Control unit 1 la : Image processing unit 1 1 b : Memory unit 1 1 c : Comparison and evaluation unit 1 1 d : Determination unit 1 1 e : Positioning control unit 1 1 f : Registration unit Φ 1 2 : Monitor L 1 , L2 : Lens Μ : Mask (mask mark ΜΑΜ : mask · alignment mark MS : mask holder W : workpiece (work mark WAM : workpiece. alignment mark WS : workpiece holder -31 -