JP2018138871A - Substrate inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate inspection device that provides a setting with respect to the appearance inspection of a substrate.SOLUTION: A substrate inspection device 1 comprises: a photographic image acquisition unit 11 that acquires the three-dimensional photographic image of a non-defective substrate on which components are mounted; a memory unit 12 that memorizes component positional information including the mounting position of a component to be mounted on a to-be-inspected substrate corresponding to the non-defective substrate, and correspondence information that associates a type of component with the contents of appearance inspection of the component according to the type of component; a shape information acquisition unit 13 that acquires shape information of the component in the position of the non-defective substrate corresponding to its mounted position by using height information included in the three-dimensional photographic image; a component type acquisition unit 15 that acquires the type of component to be mounted in its mounted position; and a setting unit 16 that provides a setting with reference to an appearance inspection of component by using the shape information corresponding to the component mounted on the non-defective substrate and the contents of the appearance inspection associated, by the correspondence information, with the type of the acquired component.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a board inspection apparatus that performs settings related to appearance inspection of components mounted on a board.

2. Description of the Related Art Conventionally, there is known a board inspection apparatus that performs an appearance inspection on a component mounted on a board to be inspected (printed board). With the board inspection apparatus, for example, it is possible to inspect whether or not the component is mounted at an appropriate position on the board to be inspected and whether the soldering state is appropriate.
As a related technique, an apparatus for checking the inclination of an electronic component mounted on a substrate is also known (for example, see Patent Document 1).

JP2015-122420A

  However, in the conventional board inspection apparatus, it is necessary to manually input the position of the component mounted on the board to be inspected and the inspection content. For this reason, there is a problem that as the number of mounted parts increases, the work related to the inspection setting becomes excessive, and the load on the worker becomes very large. Further, when many such settings are made manually, an operation error is likely to occur, and for example, there is a possibility that an inspection area setting omission or an inspection item setting difference may occur.

  The present invention has been made in response to the above problems, and an object of the present invention is to provide a board inspection apparatus capable of performing settings relating to appearance inspection of components mounted on a board to be inspected.

In order to achieve the above object, in the board inspection apparatus according to the present invention, a component is mounted on a photographic image acquisition unit that acquires a three-dimensional photographic image of a non-defective substrate on which the component is mounted, and a substrate to be inspected corresponding to the non-defective substrate. Component storage information including the mounting position that is the position, and a storage unit that stores correspondence information that correlates the type of component and the contents of the appearance inspection of the component according to the type of component, and the non-defective substrate corresponding to the mounting position A shape information acquisition unit that acquires shape information related to the shape of the component at the position using height information included in the three-dimensional captured image, a component type acquisition unit that acquires the type of component mounted at the mounting position, and a non-defective product Using the shape information corresponding to the component mounted on the board and the content of the appearance inspection associated with the component type acquired by the component type acquisition unit for the component by the correspondence information, A setting unit which performs settings for visual inspection of the goods, but with a.
With such a configuration, it is possible to automatically set the appearance inspection for each component mounted on the board. As a result, for example, it is possible to prevent an inspection area from being set missing or an inappropriate inspection item from being set. In addition, the burden on the operator who sets the inspection is reduced.

In the board inspection apparatus according to the present invention, the component position information also includes the type of component mounted at the mounting position, and the component type acquisition unit determines the type of component mounted at the mounting position from the component position information. You may get it.
With such a configuration, it is possible to acquire the type of component mounted at the mounting position using the component position information.

In the board inspection apparatus according to the present invention, the component type acquisition unit may acquire the type of component mounted at the mounting position using shape information corresponding to the mounting position.
With such a configuration, it is possible to acquire the type of component mounted at the mounting position using the shape information.

In the board inspection apparatus according to the present invention, the setting unit may set an area on the board surrounding the shape of the component indicated by the shape information as an inspection area for mounting deviation inspection of the component.
With such a configuration, it becomes possible to automatically set an inspection region relating to a component mounting displacement inspection using shape information.

In the board inspection apparatus according to the present invention, the setting unit may set the mounting state of the components on the non-defective board indicated by the shape information corresponding to the inspection area for the mounting deviation inspection as a reference for the mounting deviation inspection.
With such a configuration, it is possible to automatically set a reference used for component mounting deviation inspection using shape information.

In the board inspection apparatus according to the present invention, when the type of the part to be set is an IC with a lead, the setting unit includes an area on the board surrounding the lead portion indicated by the shape information corresponding to the part to be set. The inspection area for lead inspection may be set.
With such a configuration, it is possible to automatically set an inspection area for lead inspection with respect to an IC with lead by using shape information.

In the substrate inspection apparatus according to the present invention, the setting unit may set a reference for lead inspection using a two-dimensional image of a three-dimensional captured image region corresponding to the inspection region for lead inspection.
With such a configuration, it is possible to automatically set a reference used for lead inspection of a leaded IC using a three-dimensional photographed image.

  According to the board inspection apparatus of the present invention, it is possible to automatically set the appearance inspection regarding the components mounted on the board. As a result, the load on the operator who sets the appearance inspection is reduced.

The block diagram which shows the structure of the board | substrate inspection apparatus by embodiment of this invention The figure which shows the structure of the picked-up image acquisition part in the embodiment The flowchart which shows operation | movement of the board | substrate inspection apparatus by the same embodiment The figure which shows an example of the component position information in the embodiment The figure which shows an example of the correspondence information in the embodiment The figure which shows an example of the three-dimensional picked-up image in the embodiment The figure for demonstrating acquisition of the shape information in the embodiment The figure for demonstrating acquisition of the shape information in the embodiment The figure for demonstrating the setting of the test | inspection area | region in the embodiment The figure for demonstrating the setting of the test | inspection area | region in the embodiment The figure which shows an example of a response | compatibility with component ID and shape information in the embodiment The figure which shows an example of the input screen of the kind of components in the embodiment The figure for demonstrating acquisition of the shape information in the embodiment The figure which shows an example of the setting regarding the external appearance inspection in the embodiment

  Hereinafter, a substrate inspection apparatus according to the present invention will be described using embodiments. Note that, in the following embodiments, the components given the same reference numerals are the same or equivalent, and repetitive description may be omitted. The board inspection apparatus according to the present embodiment performs settings related to the appearance inspection of components using a three-dimensional photographed image of a non-defective board.

  FIG. 1 is a block diagram showing a configuration of a substrate inspection apparatus 1 according to the present embodiment. The board inspection apparatus 1 according to the present embodiment includes a captured image acquisition unit 11, a storage unit 12, a shape information acquisition unit 13, a display unit 14, a component type acquisition unit 15, and a setting unit 16. In the present embodiment, the configuration for performing settings related to the appearance inspection of components is mainly described. However, the substrate inspection apparatus 1 also performs the appearance inspection of a substrate to be inspected according to the setting result. Therefore, the board inspection apparatus 1 may include an inspection unit (not shown) that performs an appearance inspection on each component using a three-dimensional captured image and shape information about the board to be inspected. The three-dimensional captured image and shape information will be described later.

  The captured image acquisition unit 11 acquires a three-dimensional captured image of a non-defective substrate on which components are mounted. The component may be an electronic component such as a resistor, a capacitor, an IC (integrated circuit), a transistor, or a diode. The non-defective substrate may be, for example, a substrate on which components are mounted by a chip mounter (surface mounter), and a substrate that is determined to be acceptable by a manual inspection by an inspector. That is, in the non-defective substrate, each component is mounted in a good state at a predetermined position. The three-dimensional photographed image is any information as long as it is information that can know the two-dimensional photographed image of the non-defective substrate (the photographed image of the component mounting surface of the non-defective substrate) and the height information of the non-defective substrate. May be. The two-dimensional captured image may be, for example, a color image, a gray scale image, or a black and white image, but may be a color image for more appropriate substrate inspection. Is preferred. In the present embodiment, the case of a color image will be mainly described. The non-defective substrate height information is three-dimensional information indicating the height (height in the normal direction of the non-defective substrate) at each position on the component mounting surface of the non-defective substrate. Therefore, it is possible to know the height of each component mounted on the non-defective board from the height information. The three-dimensional captured image may be, for example, a two-dimensional captured image having height information for each position, and the two-dimensional captured image and the three-dimensional information indicating the three-dimensional shape of the non-defective substrate. It may be information having. In the present embodiment, the former case will be mainly described. The captured image acquisition unit 11 may acquire a two-dimensional captured image with a digital still camera, for example. Moreover, the method by which the captured image acquisition unit 11 acquires the three-dimensional information is not limited. For example, the three-dimensional information may be acquired by a light cutting method, a phase shift method, a stereo method, or the like. In the present embodiment, a case where three-dimensional information is acquired by a light cutting method will be mainly described.

  An example of the captured image acquisition unit 11 that acquires three-dimensional information by the light cutting method will be described with reference to FIG. In FIG. 2, the captured image acquisition unit 11 includes an optical unit 41, a calculation unit 42, and a moving unit 43. The optical unit 41 irradiates the substrate 31 on which the component 32 is mounted with line light or illumination light, and photographs the substrate 31 irradiated with the line light. The irradiation unit 51, the umbrella-shaped member 52, A plurality of LEDs 53 disposed inside the umbrella-shaped member 52 and a photographing unit 54 that photographs the substrate 31 through an opening (not shown) provided at the center of the umbrella-shaped member 52 are provided. The irradiation unit 51 emits line light for three-dimensional measurement by a light cutting method. The line light is light that becomes a line in a direction perpendicular to the paper surface of FIG. 2 when the substrate 31 is irradiated. The line light may be laser light or other line light, for example. As shown in FIG. 2, two line lights may be irradiated so that the irradiation directions are symmetrical. The calculating unit 42 calculates the height of the substrate 31 in the normal direction by the light cutting method using the line light of the captured image captured by the capturing unit 54. When photographing the line light, the moving unit 43 causes the optical unit 41 and the substrate 31 to move relative to each other in the direction of the double arrow in FIG. 2, that is, in the direction perpendicular to the longitudinal direction of the line irradiated on the substrate 31. Move. For example, the moving unit 43 may move only the optical unit 41, move only the substrate 31, or move both. When moving the optical unit 41, the moving unit 43 may include, for example, a stage that movably holds the optical unit 41 and a drive motor that moves the optical unit 41 in the moving direction of the stage. Good. The same applies when the moving unit 43 moves the substrate 31. In this way, the height at each position of the substrate 31 can be obtained using line light. The height may be a height based on the surface of the substrate 31, for example. For details of the method for obtaining the height by the light cutting method, see, for example, Patent Document 1 described above.

  The plurality of LEDs 53 are used for illumination for capturing a two-dimensional captured image. The plurality of LEDs 53 may be arranged in an annular shape around the optical axis of the photographing unit 54 inside the umbrella-shaped member 52. Further, for example, as shown in FIG. 2, the LED 53 may illuminate the substrate 31 at a different angle whenever the radius of the circular ring is different. In that case, the plurality of LEDs 53 may have different colors for different angles. For example, in a ring with a small radius (that is, a ring close to the optical axis), the red LED 53 irradiates the substrate 31 with red light from above, and in a ring with a large radius, the substrate is obliquely formed with the green or blue LED 53. 31 may be irradiated with green light or blue light. By doing so, for example, the angle of the surface of the solder can be detected by the difference in color. When the substrate 31 is illuminated by the plurality of LEDs 53, a two-dimensional photographed image can be acquired by photographing the substrate 31 by the photographing unit 54. The captured image acquisition unit 11 may acquire the two-dimensional captured image by, for example, one shooting, or may be captured while the optical unit 41 and the substrate 31 are relatively moved by the moving unit 43. You may acquire by combining several images.

  As described above, the three-dimensional captured image may be acquired by a method other than the light cutting method. Since a method for acquiring a three-dimensional captured image is already known, a detailed description of the method is omitted. In addition, it is preferable that the correspondence between the acquired position on the three-dimensional captured image and the position on the substrate can be understood after the three-dimensional captured image is acquired. This is because the position on the three-dimensional captured image corresponding to a certain position on the substrate can be specified, or vice versa. The correspondence relationship may be performed by, for example, associating the three-dimensional captured image with the coordinate system of the substrate. The association between the three-dimensional captured image and the substrate may be performed manually or automatically. In the former case, for example, the operator may manually associate a position on a three-dimensional captured image corresponding to a predetermined position on the substrate with the operator. In the latter case, for example, a predetermined feature point on the three-dimensional captured image may be specified, and the two may be associated using the specified feature point. The captured image acquisition unit 11 may also acquire a three-dimensional captured image of the substrate to be inspected for appearance inspection of the substrate to be inspected.

  The storage unit 12 stores component position information. The component position information is information including the mounting position. The mounting position is a position where the component is mounted on the board to be inspected corresponding to the non-defective substrate. That is, the position on the board to be inspected where the component is mounted is the mounting position. The substrate to be inspected corresponding to the non-defective substrate is a substrate on which components are mounted in the same manner as the non-defective substrate, and is a substrate to be subjected to the appearance inspection set by the substrate inspection apparatus 1. In the case where the “non-defective substrate” and the “substrate to be inspected” are not distinguished, they may be simply referred to as “substrate”. The mounting position may be a design position where the component is mounted. The mounting position may be used as a position where the component is mounted when the component is mounted on the substrate to be inspected by a chip mounter or the like, for example. Further, the mounting position may be, for example, coordinates in the coordinate system of the substrate. The mounting position may be information indicating the center position of a component on the board, for example. The mounting position is a position on the surface of the substrate, that is, a position on a two-dimensional plane, and may not include height information. The component position information may also include the type of component mounted at the mounting position. Further, the component position information may include information other than the mounting position and the component type. For example, as shown in FIG. 4, the component position information may be information having a component ID for identifying a component, a mounting position, a mounting angle, and a type of component for each component. The mounting angle is an angle at which a component is mounted on the board to be inspected. For example, when a component is mounted on a substrate to be inspected by a chip mounter or the like, the component may be mounted after being rotated from the reference angle according to the mounting angle.

  The storage unit 12 also stores correspondence information. The correspondence information is information that associates the type of the component with the content of the appearance inspection of the component corresponding to the type of the component. The content of the appearance inspection of the component may be, for example, an item of appearance inspection. The item of appearance inspection may be considered as the type of appearance inspection. The items (types) of the appearance inspection include, for example, a mounting displacement inspection that is an inspection related to a displacement of a mounted component (for example, a displacement related to position, angle, height, etc.), a solder inspection that is an inspection related to a solder state, and a lead It may be lead inspection related to deviation, floating, solder state, short circuit, etc. of IC, volume inspection related to the volume of components and solder, size inspection related to the size of components, and the like. The correspondence information may be any information as long as it is information that can acquire the contents of the appearance inspection corresponding to the type of the component from any type of component. For example, as shown in FIG. 5, information that associates a type of a component with a flag indicating an item of an appearance inspection to be executed for the type of the component may be used. In the correspondence information shown in FIG. 5, the appearance inspection in which the flag “1” is set corresponding to a certain component type is set as the appearance inspection relating to the component type, and the flag corresponding to the certain component type is set. The appearance inspection set to “0” is not set as the appearance inspection related to the type of the component. Specifically, according to the correspondence information shown in FIG. 5, the mounting displacement inspection and the solder inspection regarding the position, angle, and height are set for the chip resistance.

  The storage unit 12 may store information other than component position information and correspondence information. For example, the captured image acquired by the captured image acquisition unit 11, the shape information acquired by the shape information acquisition unit 13, and the like may be stored in the storage unit 12. The process in which information, such as component position information, is stored in the storage unit 12 does not matter. For example, information may be stored in the storage unit 12 via a recording medium, information transmitted via a communication line or the like may be stored in the storage unit 12, or Information input via the input device may be stored in the storage unit 12. The storage in the storage unit 12 may be temporary storage in a RAM or the like, or may be long-term storage. The storage unit 12 can be realized by a predetermined recording medium (for example, a semiconductor memory, a magnetic disk, an optical disk, etc.).

  The shape information acquisition unit 13 acquires shape information regarding the shape of the component at the position of the non-defective substrate corresponding to the mounting position included in the component position information, using the height information included in the three-dimensional captured image. By using the height information included in the three-dimensional captured image, a position higher than the surface of the substrate can be specified. Therefore, the shape information acquisition unit 13 may specify shape information indicating a shape at a position higher than the surface of the substrate for each mounting position. For example, in the three-dimensional captured image, the shape information acquisition unit 13 may use a portion having the lowest height in the normal direction of the component mounting surface as the surface of the substrate, or may specify the surface of the substrate by other methods. . The shape information is preferably information indicating the position where the component is mounted on the board. The shape information may be information indicating the outline (outer edge) of a component mounted on the board, for example. As described above, since the shape information is acquired using the height information included in the three-dimensional captured image, the shape information indicating a range higher than the substrate is acquired. Therefore, for example, when the component is fixed to the substrate by solder, shape information indicating the shape including the solder region may be acquired. Further, the shape information may include information regarding the height. That is, the shape information may be information indicating not only the shape in the surface direction of the substrate but also the shape in the height direction. For example, the shape information may be information indicating a contour for each height of a certain part. For example, when the mounting position indicates the center position of the component, the shape information acquisition unit 13 specifies a position corresponding to the mounting position in the three-dimensional captured image, and is continuous from the specified position. The shape of the part may be specified by specifying a region higher than the surface of the part. Specifically, when the part whose shape information is to be acquired is an IC with a lead, as shown in FIG. 9, the lead is searched by searching for a change in height in four directions from the position indicated by the mounting position. The outline of the attached IC can be acquired. Particularly in this case, since the height of the chip portion is different from the height of the lead portion, this can also be detected in the search for a change in height. In FIG. 9, the shaded area corresponds to the chip portion, and the black area corresponds to the lead portion. The information about the height included in the shape information may be, for example, a height value (for example, 4 mm), and may be an order of height (for example, “highest”, “second highest”, etc.) Also good. The order of heights may be the order of one part. If the shape information corresponding to the leaded IC shown in FIG. 9 also includes the height order, the height information “highest” is associated with the contour of the chip in the shape information, and the lead May be associated with height information “second highest”. When specifying a plurality of levels of height in this way, for example, it is necessary to divide the height related to the component into a plurality of levels. As a method of dividing into a plurality of stages, for example, a method of grouping for each predetermined height, a method of grouping for each height of close values, a method of classification using a clustering method, or the like may be used. . When the shape information also has a height order, the height order is “highest” corresponding to the component main body and “other height” corresponding to the lead, solder, etc. It may be a stage. It is preferable that the shape information acquisition unit 13 acquires shape information for a part corresponding to each mounting position included in the part position information, that is, for each part included in the three-dimensional captured image. The acquired shape information may be accumulated in the storage unit 12. In that case, for example, as shown in FIG. 7, the shape information of each component may be stored in association with information for identifying the component (for example, a component ID or the like). In FIG. 7, the shape information F <b> 101 may be, for example, information indicating the contour of the component identified by the component ID “IC101”, or may be information further including information on the height. In addition, the shape information acquisition unit 13 uses the height information of the three-dimensional captured image of the board to be inspected to obtain the shape information at the position of the board to be inspected corresponding to the mounting position for the appearance inspection of the board to be inspected. You may get it.

  The display unit 14 displays information stored in the storage unit 12. For example, the display unit 14 may display a three-dimensional captured image. In addition, the display unit 14 may perform display in which the position corresponding to the mounting position included in the component position information can be recognized on the three-dimensional captured image to be displayed. Specifically, a graphic indicating the mounting position may be displayed at a position corresponding to the mounting position on the three-dimensional captured image. The display unit 14 may display an interface for accepting the type of component from the user. Specifically, as shown in FIG. 8, a part type acceptance screen may be displayed. Moreover, it cannot be overemphasized that the display part 14 may display other than those.

  The display unit 14 may or may not include a display device (for example, a liquid crystal display or an organic EL display) that performs such display. The display target may be displayed on another device. In that case, the display unit 14 may transmit information to be displayed to the outside of the apparatus. The display unit 14 may be realized by hardware, or may be realized by software such as a driver that drives a display device.

  The component type acquisition unit 15 acquires the type of component mounted at the mounting position included in the component position information. There is no limitation on the method by which the component type acquisition unit 15 acquires the component type. For example, the component type acquisition unit 15 may receive the type of component mounted at the mounting position from the user. That is, the acquisition of the component type may be reception of the component type. Specifically, as shown in FIG. 8, when the display unit 14 displays a three-dimensional photographed image and an instruction figure 81 indicating a position corresponding to the mounting position on the three-dimensional photographed image, the component The type acquisition unit 15 may receive the type of component corresponding to the instruction graphic 81 input by the user according to the display. 8 shows a case where the shape of the instruction graphic 81 is a square shape, the instruction graphic 81 has other shapes such as a rectangular shape, a circular shape, a round shape, and a polygonal shape. Also good. For example, the component type acquisition unit 15 may acquire the type of component mounted at the mounting position from the component position information. Specifically, as shown in FIG. 4, when the mounting position and the component type are associated with each other in the component position information, the component type acquisition unit 15 uses the component position information, The type of component corresponding to the mounting position may be read. Further, for example, the component type acquisition unit 15 may acquire the type of component mounted at the mounting position using shape information corresponding to the mounting position, that is, shape information acquired at the mounting position. . Specifically, when the shape information is information indicating the contour of the shape of the component, the component type acquisition unit 15 may identify the type of the component corresponding to the shape information by using pattern matching or the like. Good. When the shape information includes information about the height, the information can also be used to specify the type of the component with higher accuracy. In addition, it is preferable that the component type acquisition unit 15 acquires the component type for the component corresponding to each mounting position included in the component position information.

  The setting unit 16 uses the shape information corresponding to the component mounted on the non-defective board and the contents of the appearance inspection associated with the component type acquired by the component type acquiring unit 15 for the component by the correspondence information. To make settings related to the appearance inspection of the part. The shape information is acquired by the shape information acquisition unit 13. For the setting related to the appearance inspection, for example, a three-dimensional photographed image may be used, and as described later, a two-dimensional photographed image included in the three-dimensional photographed image may be used. The setting related to the appearance inspection of a certain part may be performed, for example, by setting an inspection area and setting inspection contents. That is, when making settings related to the appearance inspection of a certain part, the setting unit 16 uses the correspondence information to specify the items of the appearance inspection corresponding to the type of the part, and for each of the specified items, the setting of the inspection area. Setting and setting of inspection contents may be performed. Shape information may be used for setting the inspection region. When setting the mounting deviation inspection, for example, the setting unit 16 may set an area on the substrate surrounding the shape of the component indicated by the shape information as an inspection area for the mounting deviation inspection of the component. In addition, when the type of the setting target component is a leaded IC and the setting unit 16 sets the lead inspection for the leaded IC, for example, the setting unit 16 sets the setting target component. An area on the substrate surrounding the lead portion indicated by the shape information corresponding to may be set as an inspection area for lead inspection. For example, when the shape information includes information about the height, the setting unit 16 may use a lower part than the chip part as a lead part in the leaded IC, and perform pattern matching or the like regarding the shape of the lead part. By using it, the lead portion may be detected. In addition, when the shape information includes information about the height, and the setting unit 16 sets the solder inspection, for example, the setting unit 16 determines the height of the component main body based on the information about the height. An area on the substrate surrounding a portion indicated to be lower than this may be set as an inspection area for solder inspection. Further, when setting the solder inspection, for example, the setting unit 16 may set an area predetermined for the contour of the part indicated by the shape information as the inspection area for the solder inspection. The region determined in advance with respect to the outline of the component may be, for example, a region adjacent to the side in the short direction of the main body of the chip resistor and outside the chip resistor, and adjacent to the main body of the electrolytic capacitor. It may be a land area. The inspection area may have a predetermined shape such as a rectangular shape, or may not be so. In addition, for example, the inspection area for mounting displacement inspection is preferably in a range larger than the allowable mounting error with respect to the shape of the component indicated by the shape information, but realizes a more accurate appearance inspection. Therefore, it is preferable that the size of the part does not become too large. The same applies to other inspection areas.

  Corresponding information stored in the storage unit 12 is used for setting the examination contents. In setting the inspection content for a certain part, the setting unit 16 makes a setting for an appearance inspection item corresponding to the type of the part acquired for the part. The setting related to the appearance inspection item may be, for example, a standard setting related to the appearance inspection item, or a setting value setting related to the appearance inspection item (for example, a threshold setting). Other settings related to appearance inspection may be used. For example, the standard or threshold value is determined to be unacceptable if the deviation from the standard for the component on the board to be inspected is larger than the threshold value, and is acceptable if the deviation from the standard is within the threshold value. It may be used in an appearance inspection that is determined to be present. In the setting related to the mounting displacement inspection, the setting unit 16 may set, for example, the mounting state of the component on the non-defective board indicated by the shape information corresponding to the inspection region of the mounting displacement inspection as a reference for the mounting displacement inspection. The shape information corresponding to the inspection area for the mounting displacement inspection may be the shape information used for setting the inspection area. The mounting misalignment inspection may be, for example, an inspection of mounting misalignment regarding at least one of position, angle, and height. The component mounting status indicated by the shape information may be, for example, at least one of the position of the component, the angle of the component, and the height of the component. When the mounting state includes the height of the component, it is preferable that the shape information includes a height value as information about the height. When such inspection details are set, during the appearance inspection, for example, a standard (i.e., a position indicated by the mounting status or the position or angle) of the component mounted on the board to be inspected. When the deviation from the angle and the height is within the threshold value, it is determined to be acceptable, and when it exceeds the threshold value, it is determined to be unacceptable. In setting the inspection content, the setting unit 16 may set a reference for the lead inspection using a two-dimensional image of the region of the three-dimensional captured image corresponding to the inspection region for the lead inspection. That is, a two-dimensional image of a region of a three-dimensional captured image corresponding to the inspection region for lead inspection may be used for setting a reference for lead inspection. The use of the two-dimensional image for setting the reference for lead inspection may be, for example, setting the position, area, color, etc. of each lead included in the two-dimensional image as a reference. It may be set based on the image itself. When the two-dimensional image itself is set as a reference for lead inspection, for example, in lead inspection, the position, area, color, and the like regarding each lead specified from the two-dimensional image may be used. In the lead inspection, for example, the interval between each lead, a deviation of adjacent leads, a foreign matter on the lead surface, and the like may be inspected on the basis of a two-dimensional image of a non-defective substrate. The reference setting using the two-dimensional image of the lead portion manually specified by the user is also performed in the conventional substrate inspection apparatus, and the detailed description thereof is omitted. In addition, for example, information indicating how to set the inspection area, reference, setting value, etc. relating to the appearance inspection (for example, information indicating where to set the inspection area, information indicating what is used as the reference, threshold value) Are stored in a recording medium (not shown) for each item of the appearance inspection, and the setting unit 16 may perform settings related to the appearance inspection using the information. In setting the inspection contents, the setting unit 16 may set a predetermined threshold value or the like as a default threshold value or the like for each appearance inspection. The threshold may be changed later by the user.

Next, the operation of the substrate inspection apparatus 1 will be described using the flowchart of FIG.
(Step S101) The captured image acquisition unit 11 acquires a three-dimensional captured image related to a non-defective substrate. As described above, the acquisition of the three-dimensional captured image may be performed, for example, by acquiring a two-dimensional captured image and acquiring three-dimensional information.

  (Step S102) The shape information acquisition unit 13 acquires the shape information at the position of the non-defective substrate corresponding to each mounting position using each mounting position included in the component position information.

  (Step S103) The component type acquisition unit 15 acquires the type of component for the component for which shape information has been acquired.

  (Step S <b> 104) The setting unit 16 uses the component type acquired in Step 103 to make settings related to the appearance inspection of the component corresponding to the component type.

  (Step S105) The setting unit 16 determines whether there is a next part, that is, whether there is a part that has not been set for appearance inspection. If the next part exists, the process returns to step S103. If not, that is, if the settings relating to the appearance inspection have been completed for all the parts on the three-dimensional captured image, a series relating to the appearance inspection setting is performed. Terminate the process. When the process returns to step S103, the acquisition of the part type and the appearance inspection according to the part type are performed for the parts for which the shape information has been acquired and the parts for which the appearance inspection has not been set yet. Will be set.

  Note that the order of processing in the flowchart of FIG. 3 is an example, and the order of each step may be changed as long as similar results can be obtained. For example, instead of acquiring the shape information about all the components at once, the shape information may be acquired for each component for which the type of the component is acquired or the appearance inspection is set.

  Next, the operation of the substrate inspection apparatus 1 according to the present embodiment will be described using a specific example. In this specific example, it is assumed that the storage unit 12 stores the component position information shown in FIG. 4 and the correspondence information shown in FIG. In FIG. 4, in the component position information, a component ID, a mounting position, a mounting angle, and a component type are associated. In FIG. 5, in the correspondence information, the type of component is associated with an appearance inspection item set for the type of component. As described above, the items of the appearance inspection in which the flag “1” is set are the items of the appearance inspection to be set. In this specific example, the acquisition of the component type is performed by receiving the component type input by the user.

  When the user sets a non-defective substrate on the substrate inspection apparatus 1 and inputs an instruction to set appearance inspection, the captured image acquisition unit 11 acquires a three-dimensional captured image (step S101). Specifically, the photographing unit 54 photographs a two-dimensional color photographed image of a non-defective substrate illuminated by the LED 53. Thereafter, the LED 53 is turned off, and the irradiation unit 51 irradiates the non-defective substrate with the line light. In this way, when the line light is irradiated and the optical unit 41 and the non-defective substrate are relatively moved by the moving unit 43, the photographing unit 54 acquires the height on the surface of the non-defective substrate by the light cutting method. Shoot for. And the calculating part 42 acquires the height in each position of the surface direction of a non-defective board | substrate using the imaging | photography result. In this way, a three-dimensional captured image that is a two-dimensional captured image having height information is acquired. FIG. 6A is a diagram illustrating an example of a three-dimensional captured image of the non-defective substrate 31. FIG. 6A shows a non-defective substrate 31 on which components 71 to 80 are mounted. The three-dimensional captured image has height information in a direction perpendicular to the paper surface, that is, a normal direction of the substrate. The three-dimensional captured image is accumulated in the storage unit 12. In addition, it is assumed that the three-dimensional captured image is associated with the substrate coordinate system. As a result, the position on the three-dimensional captured image corresponding to the mounting position included in the component position information shown in FIG. 4 can be specified.

  Thereafter, the shape information acquisition unit 13 acquires the shape information of the parts existing at the positions on the three-dimensional captured image corresponding to the respective mounting positions in FIG. 4 (step S102). Specifically, the shape information acquisition unit 13 may be a component identified by the first component ID “IC101” included in the component position information of FIG. 4 (hereinafter referred to as “component IC101”. The same is true for the mounting position (X101, Y101) of the camera, and the position on the three-dimensional photographed image corresponding to the mounting position (X101, Y101) is specified, and continuous from the specified position. The contour of the component that is higher than the surface of the substrate is specified using height information included in the three-dimensional captured image. Similarly, the shape information acquisition unit 13 specifies the contour of the component IC 102 and the like. As a result, for example, as shown in FIG. 6B, component areas 71a to 80a indicating the contours of the components are acquired for the components 71 to 80, respectively. In FIG. 6B, a range higher than the surface of the non-defective substrate 31 is indicated by the component areas 71 a to 80 a. Thereafter, as described above, the shape information acquisition unit 13 identifies the highest region and other regions for each component. FIG. 6C is a diagram illustrating the highest region for each component and the other regions. In FIG. 6C, areas 71b to 80b indicated by solid lines are the highest areas, and areas 71c, 72c, 75c, and 76c indicated by broken lines are areas other than the highest areas. The shape information acquisition unit 13 accumulates the shape information indicating each of these regions and the height value of the highest region in the storage unit 12 as shown in FIG. 7 in association with the component ID.

  Next, the component type acquisition unit 15 receives the component type for the first component IC 101 included in the component position information of FIG. 4 (step S103). Specifically, first, the display unit 14 displays a two-dimensional captured image and an interface for receiving the type of component as shown in FIG. In the display, the part for which the type of part is to be received is specified by the instruction graphic 81. For example, the display unit 14 reads the mounting position (X101, Y101) corresponding to the first component IC 101 from the storage unit 12, and displays the instruction graphic 81 at a position on the two-dimensional captured image corresponding to the mounting position. May be. Then, when the user selects the component type “IC with lead” corresponding to the instruction graphic 81 and selects the “OK” button to confirm the selection of the component type, the component type acquisition unit 15 The component type “IC with lead” is acquired, and the component type is passed to the setting unit 16.

  When the component type “IC with lead” is received, the setting unit 16 refers to the correspondence information stored in the storage unit 12 and sets the appearance inspection with the flag corresponding to the component type being “1”. This is performed (step S104). Specifically, since the component type “IC with lead” is associated with mounting inspection and lead inspection with respect to position, angle, and height, the setting unit 16 sets the appearance inspection thereof. I do. First, the setting unit 16 reads the shape information F101 corresponding to the component IC 101 that is the setting target of the appearance inspection, and the region on the substrate surrounding the shape of the component IC 101 indicated by the shape information F101, that is, the region shown in FIG. 6D. 82 is set in the inspection area A101 for mounting displacement inspection. In the setting, the setting unit 16 sets the outline B101 of the component IC 101 indicated by the shape information F101 as a reference for mounting displacement inspection regarding the position, and the angle of the component IC 101 indicated by the shape information F101, for example, the component main body Is set as a reference for mounting displacement inspection related to the angle, and the height value E101 of the highest region indicated by the shape information F101 is set as a reference for mounting displacement inspection related to the height. The setting unit 16 sets predetermined threshold values TH101, TH102, and TH103 for each of the position, angle, and height of the mounting misalignment inspection. Next, the setting unit 16 performs areas on the substrate surrounding the lead portion, which are areas other than the highest area indicated by the shape information F101, that is, areas 83 and 84 in FIG. 6E, respectively, as inspection areas A102 and A103 for lead inspection. Set to. Further, in the setting, the setting unit 16 sets the two-dimensional images G101 and G102 of the three-dimensional photographed image regions corresponding to the lead inspection regions 83 and 84, respectively, as the reference for the lead inspection. That is, at the time of lead inspection, by comparing with a reference two-dimensional image, the state of solder, the interval between leads, and the like are inspected. The setting unit 16 sets a predetermined threshold set TH104 for the solder state, the interval between the leads, and the like in the lead inspection. As a result, for the component IC 101, settings relating to appearance inspection are performed as shown in FIG.

  Thereafter, similarly for the second and subsequent component ICs 102, etc., the acquisition of the component type and the setting of the appearance inspection according to the component type are respectively performed (steps S105, S103, S104). In this way, the setting of appearance inspection for each component on the board 31 is completed.

  In this specific example, the case has been described in which settings relating to mounting misalignment inspection, lead inspection, and solder inspection are performed using the correspondence information shown in FIG. 5, but the inspection contents to be set are other than those. May be. For example, size inspection, volume inspection, and the like may be performed. The size inspection is, for example, an inspection related to whether or not the size of a part is within a predetermined range, and the volume inspection is, for example, a part volume, a part volume of a part, or a solder volume. It may be an inspection regarding whether it is within the range.

  Also, in this specific example, the case where the component type is also included in the component position information has been described. However, when the component type included in the component position information is not used to acquire the component type, the component The position information may not include the type of part.

  Further, in this specific example, for the sake of convenience of explanation, a case where the contour of a part acquired using height information in a three-dimensional photographed image is the same as the shape of the part (for example, see FIGS. 6A and 6B) will be described. However, in practice, the contour of the part acquired using the height information can be a complex contour with unevenness due to the presence of solder or the like used for soldering. Therefore, for example, shape information including a region other than the highest region is acquired for the chip resistance.

  As described above, according to the board inspection apparatus 1 according to the present embodiment, it is possible to automatically set the appearance inspection for each component mounted on the board. Therefore, the burden on the operator who has made the setting is reduced. In addition, by automatically performing the setting, for example, it is possible to avoid a situation in which an inspection area is not set correctly or an inappropriate inspection item is set. In addition, when the component type acquisition unit 15 acquires the component type included in the component position information or acquires the component type by pattern matching or the like, the user needs to input the component type. The burden on the user is further reduced.

  Note that a setting value or the like may be added by the user to the setting result regarding the appearance inspection of the component performed by the setting unit 16, and the content set by the setting unit 16 may be changed. Even in such a case, compared with the case where the user performs all settings from the beginning, the burden on the user is reduced, and setting errors can be reduced.

  In the present embodiment, the case where the shape information acquisition unit 13 acquires shape information regardless of the type of component has been described. However, the shape information acquisition unit 13 acquires shape information according to the type of component. Also good. For example, when the component type acquisition unit 15 acquires a component type without using shape information, first, after the component type acquisition unit 15 acquires the component type, the shape information acquisition unit 13 acquires the component type. Shape information corresponding to the type of component may be acquired. The shape information corresponding to the type of component is, for example, shape information that can distinguish the highest region from other regions when the component type is a leaded IC or an electrolytic capacitor. When the type is a leadless IC or a chip resistor, shape information indicating only the highest region may be used. When the component type acquisition unit 15 acquires the type of component using the shape information, first, the shape information indicating the outline of the outermost edge of the component is acquired by the shape information acquisition unit 13, and the shape information is used. Then, the component type may be acquired by the component type acquisition unit 15 and the shape information regarding the region other than the highest region may be acquired again according to the acquired type of the component. Thus, the acquisition of shape information may be performed in stages. This is the same even when the component type acquisition unit 15 does not acquire the component type using the shape information. For example, when the setting unit 16 sets the solder inspection using information about the height included in the shape information for a certain part, the shape information acquisition unit 13 uses the information about the height (for example, the height for the part). Or the like) may be acquired.

  Moreover, although the case where the board | substrate inspection apparatus 1 was provided with the display part 14 was demonstrated in this Embodiment, it may not be so. For example, when the reception of the component type is not performed, the board inspection apparatus 1 may not include the display unit 14.

  In the above embodiment, each process or each function may be realized by centralized processing by a single device or a single system, or may be distributedly processed by a plurality of devices or a plurality of systems. It may be realized by doing.

  In the above embodiment, the information exchange between the components is performed by one component when, for example, the two components that exchange the information are physically different from each other. It may be performed by outputting information and receiving information by the other component, or when two components that exchange information are physically the same, one component May be performed by moving from the phase of the process corresponding to to the phase of the process corresponding to the other component.

  In the above embodiment, information related to processing executed by each component, for example, information received, acquired, selected, generated, transmitted, or received by each component In addition, information such as threshold values, mathematical formulas, addresses, and the like used by each constituent element in processing may be temporarily or for a long time held in a recording medium (not shown), even if not specified in the above description. Further, the storage of information on the recording medium (not shown) may be performed by each component or a storage unit (not shown). Further, reading of information from the recording medium (not shown) may be performed by each component or a reading unit (not shown).

  In the above embodiment, when information used by each component, for example, information such as a threshold value, an address, and various setting values used by each component may be changed by the user, Even if it is not specified in the description, the user may be able to change the information as appropriate, or may not be so. If the information can be changed by the user, the change is realized by, for example, a not-shown receiving unit that receives a change instruction from the user and a changing unit (not shown) that changes the information in accordance with the change instruction. May be. The change instruction received by the receiving unit (not shown) may be received from an input device, information received via a communication line, or information read from a predetermined recording medium, for example. .

  In addition, among the components described in the above embodiments, components that can be realized by software may be realized by executing a program. For example, each component can be realized by a program execution unit such as a CPU reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory. At the time of execution, the program execution unit may execute the program while accessing the storage unit or the recording medium. The program may be executed by being downloaded from a server or the like, or may be executed by reading a program recorded on a predetermined recording medium (for example, a magnetic disk or a semiconductor memory).

  Further, the present invention is not limited to the above-described embodiment, and various modifications are possible, and it goes without saying that these are also included in the scope of the present invention.

  As described above, according to the substrate inspection apparatus of the present invention, it is possible to obtain an effect of reducing the load on the user regarding the setting of the appearance inspection, and it is useful as an apparatus for performing the setting regarding the appearance inspection of the substrate.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 11 Captured image acquisition part 12 Storage part 13 Shape information acquisition part 14 Display part 15 Component type acquisition part 16 Setting part

Claims (6)

A captured image acquisition unit that acquires a three-dimensional captured image of a non-defective substrate on which the component is mounted;
Correspondence information for associating component position information including a mounting position, which is a position where a component is mounted on the board to be inspected corresponding to the non-defective substrate, and contents of the appearance inspection of the component according to the type of the component Is stored, and
A shape information acquisition unit that acquires shape information related to the shape of the component at the position of the non-defective substrate corresponding to the mounting position using height information included in the three-dimensional captured image;
A component type acquisition unit for acquiring the type of component mounted at the mounting position;
Using the shape information corresponding to the component mounted on the non-defective substrate, and the content of the appearance inspection associated with the component type acquired by the component type acquisition unit for the component by the correspondence information, A board inspection apparatus comprising: a setting unit configured to perform settings related to appearance inspection of a component. The component position information includes the type of component to be mounted at the mounting position,
The board inspection apparatus according to claim 1, wherein the component type acquisition unit acquires the type of component mounted at a mounting position from the component position information. The board inspection apparatus according to claim 1, wherein the component type acquisition unit acquires a type of a component to be mounted at a mounting position using shape information corresponding to the mounting position. The board inspection apparatus according to claim 1, wherein the setting unit sets an area on the board surrounding the shape of the component indicated by the shape information as an inspection area for mounting deviation inspection of the component. The board inspection apparatus according to claim 4, wherein the setting unit sets a mounting state of components on the non-defective board indicated by shape information corresponding to an inspection area for mounting deviation inspection as a reference for the mounting deviation inspection. When the type of the component to be set is an IC with lead, the setting unit sets an area on the substrate surrounding the lead portion indicated by the shape information corresponding to the component to be set as an inspection area for lead inspection. The substrate inspection apparatus according to any one of claims 1 to 5.

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