JP5288917B2 - ペースト塗布装置及びペースト塗布方法 - Google Patents

ペースト塗布装置及びペースト塗布方法 Download PDF

Info

Publication number
JP5288917B2
JP5288917B2 JP2008179086A JP2008179086A JP5288917B2 JP 5288917 B2 JP5288917 B2 JP 5288917B2 JP 2008179086 A JP2008179086 A JP 2008179086A JP 2008179086 A JP2008179086 A JP 2008179086A JP 5288917 B2 JP5288917 B2 JP 5288917B2
Authority
JP
Japan
Prior art keywords
coating
paste
application
heads
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008179086A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010017629A5 (zh
JP2010017629A (ja
Inventor
法昭 下田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2008179086A priority Critical patent/JP5288917B2/ja
Priority to TW098122310A priority patent/TWI417144B/zh
Priority to KR1020090061242A priority patent/KR101078902B1/ko
Priority to CN2009101584841A priority patent/CN101623683B/zh
Publication of JP2010017629A publication Critical patent/JP2010017629A/ja
Publication of JP2010017629A5 publication Critical patent/JP2010017629A5/ja
Application granted granted Critical
Publication of JP5288917B2 publication Critical patent/JP5288917B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1044—Apparatus or installations for supplying liquid or other fluent material to several applying apparatus or several dispensing outlets, e.g. to several extrusion nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
JP2008179086A 2008-07-09 2008-07-09 ペースト塗布装置及びペースト塗布方法 Active JP5288917B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008179086A JP5288917B2 (ja) 2008-07-09 2008-07-09 ペースト塗布装置及びペースト塗布方法
TW098122310A TWI417144B (zh) 2008-07-09 2009-07-01 Paste coating apparatus and paste coating method
KR1020090061242A KR101078902B1 (ko) 2008-07-09 2009-07-06 페이스트 도포 장치 및 페이스트 도포 방법
CN2009101584841A CN101623683B (zh) 2008-07-09 2009-07-08 糊剂涂敷装置及糊剂涂敷方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008179086A JP5288917B2 (ja) 2008-07-09 2008-07-09 ペースト塗布装置及びペースト塗布方法

Publications (3)

Publication Number Publication Date
JP2010017629A JP2010017629A (ja) 2010-01-28
JP2010017629A5 JP2010017629A5 (zh) 2011-08-25
JP5288917B2 true JP5288917B2 (ja) 2013-09-11

Family

ID=41519761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008179086A Active JP5288917B2 (ja) 2008-07-09 2008-07-09 ペースト塗布装置及びペースト塗布方法

Country Status (4)

Country Link
JP (1) JP5288917B2 (zh)
KR (1) KR101078902B1 (zh)
CN (1) CN101623683B (zh)
TW (1) TWI417144B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5619537B2 (ja) * 2009-09-04 2014-11-05 デクセリアルズ株式会社 充填装置
JP5861166B2 (ja) * 2011-06-09 2016-02-16 株式会社ブイ・テクノロジー ディスペンサ装置、パターン欠陥修正装置、ディスペンサの詰まり解消方法
CN102411233B (zh) * 2011-11-23 2013-10-16 深圳市华星光电技术有限公司 液晶基板框胶涂覆装置及液晶基板框胶涂覆方法
US9475078B2 (en) * 2012-10-29 2016-10-25 Illinois Tool Works Inc. Automated multiple head cleaner for a dispensing system and related method
JP2015142905A (ja) * 2013-12-25 2015-08-06 芝浦メカトロニクス株式会社 接着剤塗布装置、接着剤塗布部材のクリーニング方法及び表示パネル製造装置、表示パネルの製造方法
KR102341945B1 (ko) * 2017-03-13 2021-12-22 주식회사 탑 엔지니어링 기판 처리 장치
KR101972061B1 (ko) 2017-05-25 2019-04-24 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
KR102449702B1 (ko) * 2017-12-13 2022-09-30 세메스 주식회사 액적 도포 장치 및 액적 도포 방법
JP7012213B2 (ja) * 2018-01-31 2022-01-28 パナソニックＩｐマネジメント株式会社 ペースト塗布装置及びペースト塗布方法
JP6982731B2 (ja) * 2018-01-31 2021-12-17 パナソニックＩｐマネジメント株式会社 ペースト塗布装置及びペースト塗布方法
KR101970444B1 (ko) * 2018-12-14 2019-04-18 문득수 단방향 또는 양방향 디스플레이 패널의 레진 도포장치, 그리고 이를 활용한 레진 도포방법
JP6990927B2 (ja) * 2019-01-21 2022-01-12 武蔵エンジニアリング株式会社 液体材料塗布装置および液体材料塗布方法
CN112477401B (zh) * 2020-12-21 2023-10-20 四川锐坤电子技术有限公司 一种移印设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4157149A (en) * 1977-10-31 1979-06-05 Moen Lenard E Multiple nozzle fluid dispenser for complex fluid delivery patterns
JPH0725967U (ja) * 1993-10-26 1995-05-16 日立テクノエンジニアリング株式会社 ペースト塗布機
JP3022855B1 (ja) * 1998-11-26 2000-03-21 埼玉日本電気株式会社 塗布装置のニードル硬化防止機構
DK1246724T3 (da) * 1999-12-30 2005-01-24 Akzo Nobel Nv Fremgangsmåde til limning og apparat dertil
JP3993496B2 (ja) * 2001-09-27 2007-10-17 東京エレクトロン株式会社 基板の処理方法および塗布処理装置
JP2004014393A (ja) * 2002-06-10 2004-01-15 Dainippon Printing Co Ltd プラズマディスプレイパネルの蛍光面形成方法及び蛍光面形成装置
JP2004090264A (ja) * 2002-08-29 2004-03-25 Canon Inc インクジェット記録装置及びその制御方法、プログラム
CN2705239Y (zh) * 2003-09-28 2005-06-22 汕头市远东轻化装备有限公司 一种复合涂布机的上胶复合装置
TW200638083A (en) * 2005-04-18 2006-11-01 Shibaura Mechatronics Corp The coating apparatus and method thereof
TWM287028U (en) * 2005-10-17 2006-02-01 All Ring Tech Co Ltd Multiplexing dispenser
JP4893016B2 (ja) * 2006-02-17 2012-03-07 株式会社日立プラントテクノロジー ペースト塗布機
JP2007289796A (ja) * 2006-04-20 2007-11-08 Yamaha Motor Co Ltd 塗布装置
KR100778147B1 (ko) * 2006-12-13 2007-11-21 주식회사 탑 엔지니어링 액정 디스플레이 패널 제조용 디스펜싱 장치

Also Published As

Publication number Publication date
TWI417144B (zh) 2013-12-01
CN101623683B (zh) 2012-10-10
CN101623683A (zh) 2010-01-13
KR101078902B1 (ko) 2011-11-01
JP2010017629A (ja) 2010-01-28
KR20100006541A (ko) 2010-01-19
TW201006566A (en) 2010-02-16

Similar Documents

Publication Publication Date Title
JP5288917B2 (ja) ペースト塗布装置及びペースト塗布方法
JP2005230807A (ja) 基板処理装置
JPH1133458A (ja) 液状体の塗布装置
JP5240069B2 (ja) スクリーン印刷用マスクのクリーニング装置、スクリーン印刷機及びスクリーン印刷用マスクのクリーニング方法
JP6111429B2 (ja) 粘性体塗布方法及び粘性体塗布装置
TW201236774A (en) Sweeping member, sweeping method of coater, and manufacturing method of sweeping device and display member
TWI397755B (zh) 用於滴落液晶的設備和方法
JP6475030B2 (ja) 基板処理システム及び基板処理方法
KR20100012950A (ko) 액정방울수 카운팅 방법
JP5377899B2 (ja) ペースト塗布機
JP2009022845A (ja) 液滴吐出装置、重量測定方法及び液状体の吐出方法
JP2008238143A (ja) 液滴吐出装置及び液滴吐出ヘッド交換方法
JP6194200B2 (ja) スクリーン印刷装置及び清掃処理装置
JP6318035B2 (ja) 印刷装置および印刷装置のはんだ回収方法
KR100663643B1 (ko) 액정도포장치
JP2006231288A (ja) 塗布ヘッド清掃方法及び装置、ペースト塗布方法及び装置並びにプラズマディスプレイ部材の製造方法及び装置
JP4566859B2 (ja) 塗布処理装置
JP2008104947A (ja) 塗布装置、及び制御方法
JP2016082085A (ja) 電子部品実装装置
JP2012106203A (ja) 基板への塗布膜形成方法
KR101972930B1 (ko) 기판 처리 장치
CN108430777B (zh) 印刷装置以及印刷方法
JP5246122B2 (ja) 塗液の塗布方法、プラズマディスプレイ部材の製造方法および塗液の塗布装置
JP5423917B2 (ja) 液滴吐出装置の吐出重量測定方法、及び、液滴吐出装置
KR20200011023A (ko) 점성 액체 디스펜싱 장치

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110711

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110711

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130314

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130319

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130510

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130528

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130604

R150 Certificate of patent or registration of utility model

Ref document number: 5288917

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150