JP5274022B2 - 半導体製造において使用するための石英ガラスの構成部品を形成する方法およびその方法に従って得られた構成部品 - Google Patents

半導体製造において使用するための石英ガラスの構成部品を形成する方法およびその方法に従って得られた構成部品 Download PDF

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JP5274022B2
JP5274022B2 JP2007553493A JP2007553493A JP5274022B2 JP 5274022 B2 JP5274022 B2 JP 5274022B2 JP 2007553493 A JP2007553493 A JP 2007553493A JP 2007553493 A JP2007553493 A JP 2007553493A JP 5274022 B2 JP5274022 B2 JP 5274022B2
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etching
quartz glass
surface roughness
component
minimum
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Japanese (ja)
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JP2008528432A5 (https=
JP2008528432A (ja
Inventor
ヴェーバァ．ユールゲン
キルスト．ウルリヒ
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ヘラオイス．クヴァールツグラース．ゲゼルシャフト．ミット．ベシュレンクテル．ハフツング．ウント．コンパニー．コマンディットゲゼルシャフト
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2204/00—Glasses, glazes or enamels with special properties
    • C03C2204/08—Glass having a rough surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Surface Treatment Of Glass (AREA)
JP2007553493A 2005-02-03 2006-01-18 半導体製造において使用するための石英ガラスの構成部品を形成する方法およびその方法に従って得られた構成部品 Expired - Fee Related JP5274022B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005005196A DE102005005196B4 (de) 2005-02-03 2005-02-03 Verfahren zur Herstellung eines Bauteils aus Quarzglas für den Einsatz in der Halbleiterfertigung und nach dem Verfahren erhaltenes Bauteil
DE102005005196.0 2005-02-03
PCT/EP2006/000381 WO2006081940A1 (de) 2005-02-03 2006-01-18 Verfahren zur herstellung eines bauteils aus quarzglas für den einsatz in der halbleiterfertigung und nach dem verfahren erhaltenes bauteil

Publications (3)

Publication Number Publication Date
JP2008528432A JP2008528432A (ja) 2008-07-31
JP2008528432A5 JP2008528432A5 (https=) 2013-05-16
JP5274022B2 true JP5274022B2 (ja) 2013-08-28

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JP2007553493A Expired - Fee Related JP5274022B2 (ja) 2005-02-03 2006-01-18 半導体製造において使用するための石英ガラスの構成部品を形成する方法およびその方法に従って得られた構成部品

Country Status (8)

Country Link
US (1) US20080193715A1 (https=)
EP (1) EP1843984B1 (https=)
JP (1) JP5274022B2 (https=)
KR (1) KR101345563B1 (https=)
CN (1) CN101115691B (https=)
DE (1) DE102005005196B4 (https=)
IL (1) IL184622A (https=)
WO (1) WO2006081940A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005017739B4 (de) 2005-04-15 2009-11-05 Heraeus Quarzglas Gmbh & Co. Kg Halter aus Quarzglas für die Prozessierung von Halbleiterwafern und Verfahren zur Herstellung des Halters
CN103247551A (zh) * 2012-02-01 2013-08-14 上海科秉电子科技有限公司 一种用于半导体制程中钟罩零件的粗糙度再生方法
KR20170036985A (ko) 2015-09-25 2017-04-04 한국세라믹기술원 석영 유리의 표면 엠보싱화 방법
CN108698880B (zh) 2015-12-18 2023-05-02 贺利氏石英玻璃有限两合公司 不透明石英玻璃体的制备
US11339076B2 (en) 2015-12-18 2022-05-24 Heraeus Quarzglas Gmbh & Co. Kg Preparation of carbon-doped silicon dioxide granulate as an intermediate in the preparation of quartz glass
CN109153593A (zh) 2015-12-18 2019-01-04 贺利氏石英玻璃有限两合公司 合成石英玻璃粉粒的制备
KR20180095618A (ko) 2015-12-18 2018-08-27 헤래우스 크바르츠글라스 게엠베하 ＆ 컴파니 케이지 다중-챔버 가열로에서 실리카 유리체의 제조
JP6940235B2 (ja) 2015-12-18 2021-09-22 ヘレウス クワルツグラス ゲーエムベーハー ウント コンパニー カーゲー 高融点金属の溶融坩堝内での石英ガラス体の調製
EP3390303B1 (de) 2015-12-18 2024-02-07 Heraeus Quarzglas GmbH & Co. KG Herstellung von quarzglaskörpern mit taupunktkontrolle im schmelzofen
JP6981710B2 (ja) 2015-12-18 2021-12-17 ヘレウス クワルツグラス ゲーエムベーハー ウント コンパニー カーゲー 二酸化ケイ素造粒体からの石英ガラス体の調製
EP3390304B1 (de) 2015-12-18 2023-09-13 Heraeus Quarzglas GmbH & Co. KG Sprühgranulieren von siliziumdioxid bei der herstellung von quarzglas
WO2017103153A1 (de) 2015-12-18 2017-06-22 Heraeus Quarzglas Gmbh & Co. Kg Glasfasern und vorformen aus quarzglas mit geringem oh-, cl- und al-gehalt
TWI840318B (zh) 2015-12-18 2024-05-01 德商何瑞斯廓格拉斯公司 石英玻璃體、光導、施照體、成型體及製備彼等之方法及矽組分之用途
KR102275790B1 (ko) * 2019-11-15 2021-07-09 세메스 주식회사 석영 부재의 표면 처리 방법 및 석영 부재
CN114102440A (zh) * 2020-08-28 2022-03-01 长鑫存储技术有限公司 用于石英部件的表面处理方法
KR20240036521A (ko) * 2021-06-25 2024-03-20 신에쯔 세끼에이 가부시키가이샤 석영 유리 지그의 제조 방법 및 석영 유리 지그
KR20230036331A (ko) 2021-09-07 2023-03-14 임재영 나노 보호코팅층을 가지는 반도체 공정용 글래스
CN115008027B (zh) * 2022-06-16 2023-04-28 江苏富乐华半导体科技股份有限公司 一种覆铜陶瓷基板产品的追溯方式
KR102825674B1 (ko) * 2024-05-31 2025-06-26 신에쯔 세끼에이 가부시키가이샤 성막 처리 가스 노출용 석영 유리 부재 및 이의 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19713014C2 (de) * 1997-03-27 1999-01-21 Heraeus Quarzglas Bauteil aus Quarzglas für die Verwendung bei der Halbleiterherstellung
US6368410B1 (en) 1999-06-28 2002-04-09 General Electric Company Semiconductor processing article
JP4294176B2 (ja) * 1999-09-13 2009-07-08 株式会社山形信越石英 表面が砂目加工された石英物品の洗浄方法
DE10018857C1 (de) * 2000-04-14 2001-11-29 Heraeus Quarzglas Vorrichtung zur Herstellung eines Quarzglaskörpers
JP2002047034A (ja) * 2000-07-31 2002-02-12 Shinetsu Quartz Prod Co Ltd プラズマを利用したプロセス装置用の石英ガラス治具
KR100547743B1 (ko) * 2000-09-28 2006-01-31 신에쯔 세끼에이 가부시키가이샤 반도체공업용 실리카유리지그 및 그 제조방법
US7250114B2 (en) * 2003-05-30 2007-07-31 Lam Research Corporation Methods of finishing quartz glass surfaces and components made by the methods
US7045072B2 (en) * 2003-07-24 2006-05-16 Tan Samantha S H Cleaning process and apparatus for silicate materials

Also Published As

Publication number Publication date
WO2006081940A1 (de) 2006-08-10
EP1843984B1 (de) 2017-06-14
KR101345563B1 (ko) 2014-01-02
DE102005005196B4 (de) 2009-04-23
IL184622A (en) 2012-01-31
CN101115691A (zh) 2008-01-30
CN101115691B (zh) 2012-06-13
EP1843984A1 (de) 2007-10-17
IL184622A0 (en) 2007-12-03
KR20070102700A (ko) 2007-10-19
JP2008528432A (ja) 2008-07-31
US20080193715A1 (en) 2008-08-14
DE102005005196A1 (de) 2006-08-17

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