JP5254899B2 - 高性能ボールグリッドアレイパッケージの最適回路設計レイアウト - Google Patents
高性能ボールグリッドアレイパッケージの最適回路設計レイアウト Download PDFInfo
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- JP5254899B2 JP5254899B2 JP2009171214A JP2009171214A JP5254899B2 JP 5254899 B2 JP5254899 B2 JP 5254899B2 JP 2009171214 A JP2009171214 A JP 2009171214A JP 2009171214 A JP2009171214 A JP 2009171214A JP 5254899 B2 JP5254899 B2 JP 5254899B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
- H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/85463—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
- H01L2224/8547—Zirconium (Zr) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
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- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
(1)ボールグリッドアレイプリント配線板基板または類似のものへ半導体チップのボンドパッドを接続するためにトレースをレイアウトする方法であって、(a)ボールパッドの複数の行と列がある表面を有し、また前記ボールパッドへ固定されたはんだボールを有する基板を供給するステップと、(b)前記基板上にトレースの複数のペアを供給し、トレースの前記ペアの各々の各トレースが前記ボールパッドの異なる一つへ延伸し、また前記複数の行および列上のボールパッドへ延伸し、トレースの前記ペアの各々の各トレースが1ボールピッチまで前記ペアの他のトレースから間隔を取り、長さの一致のために最大化され、また1ボールピッチまでの長さの差分を有し、平行と間隔について最大化されるステップを有する、前記方法。
5 半導体チップ
7 ボンドワイヤ
8 ボンドパッド
9 銅トレース
11 ビア
12 はんだボールパッド
13 はんだボール
Claims (5)
- 半導体チップのボンドパッドをボールグリッドアレイプリント配線板に接続するためのトレースのレイアウトであって、
(a)ボールパッドの複数の行と列を備え、前記ボールパッドへ固定されたはんだボールを有する基板と、
(b)前記基板の表面上の少なくとも第1及び第2のトレースのペアであって、前記トレースのペアの各々の各トレースが、前記ボールパッドの異なる一つへ延び、前記トレースのペアの各々の各トレースが、前記ペアの他方のトレースから1ボールピッチまでの間隔を空けて配置され、また1ボールピッチまでの長さの差分を有する、前記トレースのペアと、
(c)第3のトレースのペアであって、前記第3のトレースのペアの各トレースが、前記ボールパッドの異なる1つに延びる、前記第3のトレースのペアと、
を含み、
前記トレースのペアの各トレースが可能な最大範囲まで互いに平行になり、かつ、可能な限り同じ断面形状を有するように、前記トレースのペアが配置され、
前記第1のトレースのペアのトレースが、同じ列に形成された隣接するはんだボールにそれぞれ延び、そして、
前記第2のトレースのペアのトレースが、同じ列に形成された隣接するはんだボールにそれぞれ延び、当該列が、前記第1のトレースのペアのトレースが延びる列とは異なり、
前記第3のトレースのペアのトレースが、同じ行に形成された隣接するはんだボールパッドにそれぞれ延びる、
前記レイアウト。 - 請求項1に記載のレイアウトであって、前記基板が、ビアの行及び列を更に含み、前記第1及び第2のトレースのペアの前記トレースが、前記ビアによって前記はんだボールに電気的に接続される、レイアウト。
- 請求項1又は2に記載のレイアウトであって、各トレースのペアが差動信号を搬送するようにそれぞれ最適化されている、レイアウト。
- 請求項2に記載のレイアウトであって、前記第1及び第2のトレースのペアが互いに直に隣接している、レイアウト。
- 請求項1乃至4の何れかに記載のレイアウトであって、前記第1及び第2のトレースのペアが互いに直に隣接しており、前記第2及び第3のトレースのペアが互いに直に隣接している、レイアウト。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7529098P | 1998-02-19 | 1998-02-19 | |
US075290 | 1998-02-19 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11041955A Division JPH11317471A (ja) | 1998-02-19 | 1999-02-19 | 高性能ボ―ルグリッドアレイパッケ―ジの最適回路設計レイアウト |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009239318A JP2009239318A (ja) | 2009-10-15 |
JP2009239318A5 JP2009239318A5 (ja) | 2012-02-16 |
JP5254899B2 true JP5254899B2 (ja) | 2013-08-07 |
Family
ID=22124740
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11041955A Pending JPH11317471A (ja) | 1998-02-19 | 1999-02-19 | 高性能ボ―ルグリッドアレイパッケ―ジの最適回路設計レイアウト |
JP2009171214A Expired - Lifetime JP5254899B2 (ja) | 1998-02-19 | 2009-07-22 | 高性能ボールグリッドアレイパッケージの最適回路設計レイアウト |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11041955A Pending JPH11317471A (ja) | 1998-02-19 | 1999-02-19 | 高性能ボ―ルグリッドアレイパッケ―ジの最適回路設計レイアウト |
Country Status (2)
Country | Link |
---|---|
US (3) | US6215184B1 (ja) |
JP (2) | JPH11317471A (ja) |
Families Citing this family (23)
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KR102245132B1 (ko) | 2014-05-14 | 2021-04-28 | 삼성전자 주식회사 | 트레이스를 가지는 인쇄회로기판 및 볼 그리드 어레이 패키지 |
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-
1999
- 1999-02-16 US US09/250,641 patent/US6215184B1/en not_active Expired - Lifetime
- 1999-02-19 JP JP11041955A patent/JPH11317471A/ja active Pending
-
2000
- 2000-10-03 US US09/678,318 patent/US7611981B1/en not_active Expired - Fee Related
-
2009
- 2009-03-11 US US12/402,011 patent/US8039320B2/en not_active Expired - Fee Related
- 2009-07-22 JP JP2009171214A patent/JP5254899B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7611981B1 (en) | 2009-11-03 |
US6215184B1 (en) | 2001-04-10 |
US8039320B2 (en) | 2011-10-18 |
JPH11317471A (ja) | 1999-11-16 |
US20090170240A1 (en) | 2009-07-02 |
JP2009239318A (ja) | 2009-10-15 |
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