JP5245571B2 - 半導体装置の製造方法、半導体装置の製造装置及びピン - Google Patents
半導体装置の製造方法、半導体装置の製造装置及びピン Download PDFInfo
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- JP5245571B2 JP5245571B2 JP2008167369A JP2008167369A JP5245571B2 JP 5245571 B2 JP5245571 B2 JP 5245571B2 JP 2008167369 A JP2008167369 A JP 2008167369A JP 2008167369 A JP2008167369 A JP 2008167369A JP 5245571 B2 JP5245571 B2 JP 5245571B2
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83102—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus using surface energy, e.g. capillary forces
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01006—Carbon [C]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Description
図1は、半導体装置の製造装置1の模式図である。半導体装置の製造装置1は、後述する基板10の反りを矯正する矯正機構部2、基板10に半導体チップ18を実装する実装機構部3、アンダーフィル材を塗布するアンダーフィル塗布機構部4、アンダーフィル材を硬化させる熱硬化炉5を含む。レール8によってステージ20は各部へと搬送される。
12、22 貫通孔 18 半導体チップ
30 押圧ヘッド(押圧部材) 40 真空ポンプ
50 ピン 50a 心材
50b コーティング層 51 胴体部
53 ストッパ部 55 フランジ部
60 挿抜ハンド(挿抜手段) 70 チップ実装ヘッド
80 充填ノズル
Claims (4)
- プリント基板をステージの真空吸着面に押し付けた状態で吸着させる工程と、
前記プリント基板に形成された貫通孔と前記ステージに形成された穴とに共通にピンを挿入して前記プリント基板を前記ステージに仮固定する工程と、
前記真空吸着を解除する工程と、を含む半導体装置の製造方法。 - 前記真空吸着を解除した後に前記プリント基板に半導体チップを実装する工程と、
前記プリント基板と前記半導体チップとの間に液状樹脂を充填する工程と、
前記液状樹脂を硬化させる工程と、
前記液状樹脂の硬化後に前記ピンを抜去する工程と、を更に含む請求項1に記載の半導体装置の製造方法。 - プリント基板を真空吸着可能なステージと、
前記ステージに配置された前記プリント基板を前記ステージに押圧する押圧手段と、
前記プリント基板に形成された貫通孔と前記ステージに形成された穴とに共通にピンを挿入し前記挿入された前記ピンを抜去する挿抜手段と、を備えた半導体装置の製造装置。 - 半導体装置の製造過程において半導体チップが実装される前のプリント基板をステージに倣わせるためのピンにおいて、
非弾性材料である心材と、
前記心材を耐熱性を有した弾性材料によりコーティングしたコーティング層と、
前記プリント基板に形成された貫通孔と前記ステージに形成された穴とに共通に挿入される胴体部と、
前記胴体部の中腹に形成され前記胴体部よりも径方向に大きいストッパ部と、
前記胴体部の一端に形成され前記胴体部よりも径方向に大きいフランジ部と、を備えたピン。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008167369A JP5245571B2 (ja) | 2008-06-26 | 2008-06-26 | 半導体装置の製造方法、半導体装置の製造装置及びピン |
TW098105966A TWI378749B (en) | 2008-06-26 | 2009-02-25 | Semiconductor device producing method, semiconductor device producing apparatus and pin |
KR1020090016228A KR101061091B1 (ko) | 2008-06-26 | 2009-02-26 | 반도체 장치의 제조 방법, 반도체 장치의 제조 장치 및 핀 |
US12/394,883 US8147646B2 (en) | 2008-06-26 | 2009-02-27 | Semiconductor device producing method |
CN2009101179944A CN101615589B (zh) | 2008-06-26 | 2009-02-27 | 半导体器件的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2008167369A JP5245571B2 (ja) | 2008-06-26 | 2008-06-26 | 半導体装置の製造方法、半導体装置の製造装置及びピン |
Publications (2)
Publication Number | Publication Date |
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JP2010010356A JP2010010356A (ja) | 2010-01-14 |
JP5245571B2 true JP5245571B2 (ja) | 2013-07-24 |
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Country Status (5)
Country | Link |
---|---|
US (1) | US8147646B2 (ja) |
JP (1) | JP5245571B2 (ja) |
KR (1) | KR101061091B1 (ja) |
CN (1) | CN101615589B (ja) |
TW (1) | TWI378749B (ja) |
Families Citing this family (7)
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JP6028725B2 (ja) * | 2013-12-25 | 2016-11-16 | トヨタ自動車株式会社 | 接着構造体の製造方法 |
JP6366311B2 (ja) * | 2014-03-18 | 2018-08-01 | キヤノン株式会社 | 光走査装置 |
JP5858085B2 (ja) * | 2014-04-11 | 2016-02-10 | ウシオ電機株式会社 | 露光装置及びその固定方法 |
KR20150124201A (ko) * | 2014-04-28 | 2015-11-05 | 삼성전자주식회사 | 반도체 패키지의 진공 흡착 장치 및 방법 |
JP2015223667A (ja) * | 2014-05-28 | 2015-12-14 | 株式会社ディスコ | 研削装置及び矩形基板の研削方法 |
CN104162980A (zh) * | 2014-07-30 | 2014-11-26 | 格林精密部件(惠州)有限公司 | 一种压紧式自动热熔夹具 |
CN104733358B (zh) * | 2015-03-16 | 2017-11-28 | 鸿博股份有限公司 | 一种ic卡封装装置和方法 |
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KR200159188Y1 (ko) * | 1993-12-31 | 1999-10-15 | 김영환 | 박판인쇄회로 기판 고정장치 |
JPH1086958A (ja) | 1996-09-12 | 1998-04-07 | Kokusai Electric Co Ltd | 蓋止め装置 |
JP3841576B2 (ja) * | 1998-10-30 | 2006-11-01 | 富士通テン株式会社 | 基板固定装置及び基板の固定構造 |
JP2000150775A (ja) | 1998-11-13 | 2000-05-30 | Matsushita Electric Ind Co Ltd | 半導体素子実装治具および半導体素子実装方法 |
US6323263B1 (en) * | 1999-11-11 | 2001-11-27 | Shin-Etsu Chemical Co., Ltd. | Semiconductor sealing liquid epoxy resin compositions |
DE102005003844A1 (de) | 2005-01-27 | 2006-08-03 | Schaeffler Kg | Verliergesicherte Befestigungsschraube |
JP4545017B2 (ja) * | 2005-03-02 | 2010-09-15 | 信越ポリマー株式会社 | 電子部品固定治具及び電子部品の加工方法 |
KR100606565B1 (ko) * | 2005-04-15 | 2006-07-28 | 주식회사 에이디피엔지니어링 | 로딩/언로딩 장치 및 그 로딩/언로딩 장치가 마련되는 기판합착기 |
JP4848869B2 (ja) * | 2006-07-13 | 2011-12-28 | セイコーエプソン株式会社 | 描画装置 |
JP4769697B2 (ja) * | 2006-11-29 | 2011-09-07 | 富士通株式会社 | プリント基板の製造方法、プリント基板組立体の製造方法、及びプリント基板の反り矯正方法 |
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2008
- 2008-06-26 JP JP2008167369A patent/JP5245571B2/ja active Active
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2009
- 2009-02-25 TW TW098105966A patent/TWI378749B/zh not_active IP Right Cessation
- 2009-02-26 KR KR1020090016228A patent/KR101061091B1/ko not_active IP Right Cessation
- 2009-02-27 CN CN2009101179944A patent/CN101615589B/zh not_active Expired - Fee Related
- 2009-02-27 US US12/394,883 patent/US8147646B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2010010356A (ja) | 2010-01-14 |
US20090321014A1 (en) | 2009-12-31 |
US8147646B2 (en) | 2012-04-03 |
TW201002161A (en) | 2010-01-01 |
CN101615589B (zh) | 2012-05-30 |
KR20100002076A (ko) | 2010-01-06 |
CN101615589A (zh) | 2009-12-30 |
TWI378749B (en) | 2012-12-01 |
KR101061091B1 (ko) | 2011-09-01 |
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