JP5243962B2 - カバーウエハー又は構造要素−カバー、ウエハー構造部分又はマイクロ技術に使用可能な構造要素、及び対応するウエハー−部分又は構造要素−部分をはんだ付けする方法 - Google Patents

カバーウエハー又は構造要素−カバー、ウエハー構造部分又はマイクロ技術に使用可能な構造要素、及び対応するウエハー−部分又は構造要素−部分をはんだ付けする方法 Download PDF

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JP5243962B2
JP5243962B2 JP2008539432A JP2008539432A JP5243962B2 JP 5243962 B2 JP5243962 B2 JP 5243962B2 JP 2008539432 A JP2008539432 A JP 2008539432A JP 2008539432 A JP2008539432 A JP 2008539432A JP 5243962 B2 JP5243962 B2 JP 5243962B2
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wafer
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structural element
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JP2009516365A (ja
JP2009516365A5 (enExample
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オルトゼン，マルテン
ライネルト，ヴォルフガング
メルツ，ペーター
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フラウンホーファー・ゲゼルシャフト・ツール・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
JP2008539432A 2005-11-10 2006-11-08 カバーウエハー又は構造要素−カバー、ウエハー構造部分又はマイクロ技術に使用可能な構造要素、及び対応するウエハー−部分又は構造要素−部分をはんだ付けする方法 Active JP5243962B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005053722.7 2005-11-10
DE102005053722A DE102005053722B4 (de) 2005-11-10 2005-11-10 Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile
PCT/EP2006/068252 WO2007054524A1 (de) 2005-11-10 2006-11-08 Deckelwafer bzw. bauelement-deckel, waferbauteil bzw. in der mikrosystemtechnik einsetzbares bauelement sowie lötverfahren zum verbinden entsprechender wafer- bzw. bauelement-teile

Publications (3)

Publication Number Publication Date
JP2009516365A JP2009516365A (ja) 2009-04-16
JP2009516365A5 JP2009516365A5 (enExample) 2013-04-25
JP5243962B2 true JP5243962B2 (ja) 2013-07-24

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JP2008539432A Active JP5243962B2 (ja) 2005-11-10 2006-11-08 カバーウエハー又は構造要素−カバー、ウエハー構造部分又はマイクロ技術に使用可能な構造要素、及び対応するウエハー−部分又は構造要素−部分をはんだ付けする方法

Country Status (6)

Country Link
US (1) US8039950B2 (enExample)
EP (1) EP1945563B1 (enExample)
JP (1) JP5243962B2 (enExample)
KR (1) KR101416773B1 (enExample)
DE (1) DE102005053722B4 (enExample)
WO (1) WO2007054524A1 (enExample)

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* Cited by examiner, † Cited by third party
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DE102005053722B4 (de) 2005-11-10 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile
JP4915677B2 (ja) * 2008-05-27 2012-04-11 パナソニック株式会社 センサ装置の製造方法
US7846815B2 (en) * 2009-03-30 2010-12-07 Freescale Semiconductor, Inc. Eutectic flow containment in a semiconductor fabrication process
EP2264765A1 (en) 2009-06-19 2010-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Housing for an infrared radiation micro device and method for fabricating such housing
JP2012064673A (ja) * 2010-09-14 2012-03-29 Daishinku Corp 電子部品パッケージ、及び電子部品パッケージの製造方法
FR2967302B1 (fr) * 2010-11-09 2012-12-21 Commissariat Energie Atomique Structure d'encapsulation d'un micro-dispositif comportant un matériau getter
JP5614724B2 (ja) 2011-01-31 2014-10-29 日立金属株式会社 光電変換モジュール及び光電変換モジュールの製造方法
JP5610156B2 (ja) * 2011-01-31 2014-10-22 日立金属株式会社 光電変換モジュール及び光電変換モジュールの製造方法
JP2014128842A (ja) * 2012-12-28 2014-07-10 Yamaha Corp Ｍｅｍｓ素子を有する半導体パッケージ
US9764946B2 (en) * 2013-10-24 2017-09-19 Analog Devices, Inc. MEMs device with outgassing shield
FR3014240B1 (fr) 2013-11-29 2017-05-05 Commissariat Energie Atomique Procede de realisation d'un substrat comportant un materiau getter dispose sur des parois d'un ou plusieurs trous borgnes formes dans le substrat
KR20170119155A (ko) * 2016-04-18 2017-10-26 주식회사 스탠딩에그 벌크 실리콘 멤스의 제조 방법
KR20200032361A (ko) * 2018-09-18 2020-03-26 삼성전기주식회사 Mems 디바이스
FI131434B1 (en) * 2020-01-24 2025-04-22 Teknologian Tutkimuskeskus Vtt Oy Wafer level package for device
CN114211148B (zh) * 2021-12-17 2023-07-25 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 高真空状态下微电子封装自动对位平行封焊机构
KR102731140B1 (ko) * 2022-04-01 2024-11-18 한국기술교육대학교 산학협력단 미세 구조물 제조 방법

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DE19537814B4 (de) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
DE19711283A1 (de) * 1997-03-18 1998-10-29 Siemens Ag Hermetisch dichtes optisches Sendemodul
JP3702612B2 (ja) 1997-10-07 2005-10-05 株式会社デンソー 半導体装置の製造方法
US6778041B2 (en) * 1998-06-02 2004-08-17 Matsushita Electric Industrial Co., Ltd. Millimeter wave module and radio apparatus
US6062461A (en) * 1998-06-03 2000-05-16 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
ATE340761T1 (de) 1999-12-15 2006-10-15 Asulab Sa Hermetische in-situ-gehäusungsmethode von mikrosystemen
DE10005555A1 (de) * 2000-02-09 2001-08-16 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
TW560018B (en) * 2001-10-30 2003-11-01 Asia Pacific Microsystems Inc A wafer level packaged structure and method for manufacturing the same
ATE354538T1 (de) 2002-04-11 2007-03-15 Koninkl Philips Electronics Nv Hertsellungsverfahren einer elektronischen vorrichtung in einem hohlraum mit einer bedeckung
JP2004202604A (ja) * 2002-12-24 2004-07-22 Aisin Seiki Co Ltd パッケージ構造および製造方法
US6953990B2 (en) * 2003-09-19 2005-10-11 Agilent Technologies, Inc. Wafer-level packaging of optoelectronic devices
US7129576B2 (en) * 2003-09-26 2006-10-31 Tessera, Inc. Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
EP1683209A2 (en) 2003-11-12 2006-07-26 E.I. Dupont De Nemours And Company Encapsulation assembly for electronic devices
US7211881B2 (en) * 2004-03-24 2007-05-01 Hewlett-Packard Development Company, L.P. Structure for containing desiccant
DE102005053722B4 (de) 2005-11-10 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile

Also Published As

Publication number Publication date
EP1945563B1 (de) 2018-10-31
US8039950B2 (en) 2011-10-18
JP2009516365A (ja) 2009-04-16
KR101416773B1 (ko) 2014-08-06
DE102005053722A1 (de) 2007-05-24
KR20080075122A (ko) 2008-08-14
EP1945563A1 (de) 2008-07-23
US20080317995A1 (en) 2008-12-25
WO2007054524A1 (de) 2007-05-18
DE102005053722B4 (de) 2007-08-16

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