KR101416773B1 - 커버 웨이퍼 또는 소자 커버, 웨이퍼 구성품 또는마이크로시스템 기술로 설치될 수 있는 소자 및 관련웨이퍼 구성품들이나 소자 부품들을 접합하기 위한 납땜방법 - Google Patents

커버 웨이퍼 또는 소자 커버, 웨이퍼 구성품 또는마이크로시스템 기술로 설치될 수 있는 소자 및 관련웨이퍼 구성품들이나 소자 부품들을 접합하기 위한 납땜방법 Download PDF

Info

Publication number
KR101416773B1
KR101416773B1 KR1020087012255A KR20087012255A KR101416773B1 KR 101416773 B1 KR101416773 B1 KR 101416773B1 KR 1020087012255 A KR1020087012255 A KR 1020087012255A KR 20087012255 A KR20087012255 A KR 20087012255A KR 101416773 B1 KR101416773 B1 KR 101416773B1
Authority
KR
South Korea
Prior art keywords
cover
annular
layer
wafer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020087012255A
Other languages
English (en)
Korean (ko)
Other versions
KR20080075122A (ko
Inventor
마르텐 올젠
볼프강 라이너르트
페터 메르츠
Original Assignee
프라운호퍼-게젤샤프트 츄어 푀르더룽 데어 안게반텐 포르슝에.파우.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 프라운호퍼-게젤샤프트 츄어 푀르더룽 데어 안게반텐 포르슝에.파우. filed Critical 프라운호퍼-게젤샤프트 츄어 푀르더룽 데어 안게반텐 포르슝에.파우.
Publication of KR20080075122A publication Critical patent/KR20080075122A/ko
Application granted granted Critical
Publication of KR101416773B1 publication Critical patent/KR101416773B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
KR1020087012255A 2005-11-10 2006-11-08 커버 웨이퍼 또는 소자 커버, 웨이퍼 구성품 또는마이크로시스템 기술로 설치될 수 있는 소자 및 관련웨이퍼 구성품들이나 소자 부품들을 접합하기 위한 납땜방법 Active KR101416773B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005053722.7 2005-11-10
DE102005053722A DE102005053722B4 (de) 2005-11-10 2005-11-10 Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile
PCT/EP2006/068252 WO2007054524A1 (de) 2005-11-10 2006-11-08 Deckelwafer bzw. bauelement-deckel, waferbauteil bzw. in der mikrosystemtechnik einsetzbares bauelement sowie lötverfahren zum verbinden entsprechender wafer- bzw. bauelement-teile

Publications (2)

Publication Number Publication Date
KR20080075122A KR20080075122A (ko) 2008-08-14
KR101416773B1 true KR101416773B1 (ko) 2014-08-06

Family

ID=37877074

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087012255A Active KR101416773B1 (ko) 2005-11-10 2006-11-08 커버 웨이퍼 또는 소자 커버, 웨이퍼 구성품 또는마이크로시스템 기술로 설치될 수 있는 소자 및 관련웨이퍼 구성품들이나 소자 부품들을 접합하기 위한 납땜방법

Country Status (6)

Country Link
US (1) US8039950B2 (enExample)
EP (1) EP1945563B1 (enExample)
JP (1) JP5243962B2 (enExample)
KR (1) KR101416773B1 (enExample)
DE (1) DE102005053722B4 (enExample)
WO (1) WO2007054524A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017183774A1 (ko) * 2016-04-18 2017-10-26 주식회사 스탠딩에그 벌크 실리콘 멤스의 제조 방법

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005053722B4 (de) 2005-11-10 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile
JP4915677B2 (ja) * 2008-05-27 2012-04-11 パナソニック株式会社 センサ装置の製造方法
US7846815B2 (en) * 2009-03-30 2010-12-07 Freescale Semiconductor, Inc. Eutectic flow containment in a semiconductor fabrication process
EP2264765A1 (en) 2009-06-19 2010-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Housing for an infrared radiation micro device and method for fabricating such housing
JP2012064673A (ja) * 2010-09-14 2012-03-29 Daishinku Corp 電子部品パッケージ、及び電子部品パッケージの製造方法
FR2967302B1 (fr) * 2010-11-09 2012-12-21 Commissariat Energie Atomique Structure d'encapsulation d'un micro-dispositif comportant un matériau getter
JP5614724B2 (ja) 2011-01-31 2014-10-29 日立金属株式会社 光電変換モジュール及び光電変換モジュールの製造方法
JP5610156B2 (ja) * 2011-01-31 2014-10-22 日立金属株式会社 光電変換モジュール及び光電変換モジュールの製造方法
JP2014128842A (ja) * 2012-12-28 2014-07-10 Yamaha Corp Ｍｅｍｓ素子を有する半導体パッケージ
US9764946B2 (en) * 2013-10-24 2017-09-19 Analog Devices, Inc. MEMs device with outgassing shield
FR3014240B1 (fr) 2013-11-29 2017-05-05 Commissariat Energie Atomique Procede de realisation d'un substrat comportant un materiau getter dispose sur des parois d'un ou plusieurs trous borgnes formes dans le substrat
KR20200032361A (ko) * 2018-09-18 2020-03-26 삼성전기주식회사 Mems 디바이스
FI131434B1 (en) * 2020-01-24 2025-04-22 Teknologian Tutkimuskeskus Vtt Oy Wafer level package for device
CN114211148B (zh) * 2021-12-17 2023-07-25 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 高真空状态下微电子封装自动对位平行封焊机构
KR102731140B1 (ko) * 2022-04-01 2024-11-18 한국기술교육대학교 산학협력단 미세 구조물 제조 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111878A (ja) * 1997-10-07 1999-04-23 Denso Corp 半導体装置の製造方法
EP0962275A2 (en) * 1998-06-03 1999-12-08 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
JP2004202604A (ja) * 2002-12-24 2004-07-22 Aisin Seiki Co Ltd パッケージ構造および製造方法
JP2005277422A (ja) * 2004-03-24 2005-10-06 Hewlett-Packard Development Co Lp 乾燥剤収容構造

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19537814B4 (de) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
DE19711283A1 (de) * 1997-03-18 1998-10-29 Siemens Ag Hermetisch dichtes optisches Sendemodul
US6778041B2 (en) * 1998-06-02 2004-08-17 Matsushita Electric Industrial Co., Ltd. Millimeter wave module and radio apparatus
ATE340761T1 (de) 1999-12-15 2006-10-15 Asulab Sa Hermetische in-situ-gehäusungsmethode von mikrosystemen
DE10005555A1 (de) * 2000-02-09 2001-08-16 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
TW560018B (en) * 2001-10-30 2003-11-01 Asia Pacific Microsystems Inc A wafer level packaged structure and method for manufacturing the same
ATE354538T1 (de) 2002-04-11 2007-03-15 Koninkl Philips Electronics Nv Hertsellungsverfahren einer elektronischen vorrichtung in einem hohlraum mit einer bedeckung
US6953990B2 (en) * 2003-09-19 2005-10-11 Agilent Technologies, Inc. Wafer-level packaging of optoelectronic devices
US7129576B2 (en) * 2003-09-26 2006-10-31 Tessera, Inc. Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps
EP1683209A2 (en) 2003-11-12 2006-07-26 E.I. Dupont De Nemours And Company Encapsulation assembly for electronic devices
DE102005053722B4 (de) 2005-11-10 2007-08-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Deckelwafer, in der Mikrosystemtechnik einsetzbares Bauelement mit einem solchen Wafer sowie Lötverfahren zum Verbinden entsprechender Bauelement-Teile

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11111878A (ja) * 1997-10-07 1999-04-23 Denso Corp 半導体装置の製造方法
EP0962275A2 (en) * 1998-06-03 1999-12-08 Delphi Technologies, Inc. Process for bonding micromachined wafers using solder
JP2004202604A (ja) * 2002-12-24 2004-07-22 Aisin Seiki Co Ltd パッケージ構造および製造方法
JP2005277422A (ja) * 2004-03-24 2005-10-06 Hewlett-Packard Development Co Lp 乾燥剤収容構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017183774A1 (ko) * 2016-04-18 2017-10-26 주식회사 스탠딩에그 벌크 실리콘 멤스의 제조 방법

Also Published As

Publication number Publication date
EP1945563B1 (de) 2018-10-31
US8039950B2 (en) 2011-10-18
JP2009516365A (ja) 2009-04-16
JP5243962B2 (ja) 2013-07-24
DE102005053722A1 (de) 2007-05-24
KR20080075122A (ko) 2008-08-14
EP1945563A1 (de) 2008-07-23
US20080317995A1 (en) 2008-12-25
WO2007054524A1 (de) 2007-05-18
DE102005053722B4 (de) 2007-08-16

Similar Documents

Publication Publication Date Title
KR101416773B1 (ko) 커버 웨이퍼 또는 소자 커버, 웨이퍼 구성품 또는마이크로시스템 기술로 설치될 수 있는 소자 및 관련웨이퍼 구성품들이나 소자 부품들을 접합하기 위한 납땜방법
US7981765B2 (en) Substrate bonding with bonding material having rare earth metal
US6454160B2 (en) Method for hermetically encapsulating microsystems in situ
US6793829B2 (en) Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
JP5450396B2 (ja) Ｍｅｍｓパッケージの製造方法
JP2006173557A (ja) 中空型半導体装置とその製造方法
US20040067604A1 (en) Wafer level packaging technique for microdevices
US20060081983A1 (en) Wafer level microelectronic packaging with double isolation
US20080296717A1 (en) Packages and assemblies including lidded chips
JP2008218811A (ja) 機能素子パッケージ
US20020090803A1 (en) Electrical or electronic component encapsulated in a sealed manner and process for producing it
JP2012054553A (ja) 金属間化合物を含む封止用ビードを介する対象の組立体
CN1964915A (zh) 在低温下形成的用于mems封装的耐热气密性密封
US7772041B2 (en) Method of sealing or welding two elements to one another
JPS62149155A (ja) 封止電子装置
US7524704B2 (en) Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam
KR100908648B1 (ko) 복층 범프 구조물 및 그 제조 방법
JP5227834B2 (ja) 機能素子パッケージの製造方法
KR100941446B1 (ko) 복층 범프 구조물 및 그 제조 방법
JP2012043901A (ja) 複合基板、及び該複合基板の製造方法
KR100273126B1 (ko) 압력 센서 패키지 제조방법
JP2007266294A (ja) 半導体素子集積デバイス、半導体装置およびその製造方法
JP2007214439A (ja) 複合センサーパッケージ

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20080522

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20111108

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20130731

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20140430

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20140702

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20140703

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20170626

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20170626

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20180626

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20180626

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20200623

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20210622

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20220627

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20230620

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20240625

Start annual number: 11

End annual number: 11