JP5242128B2 - 半導電性樹脂組成物 - Google Patents

半導電性樹脂組成物 Download PDF

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Publication number
JP5242128B2
JP5242128B2 JP2007279746A JP2007279746A JP5242128B2 JP 5242128 B2 JP5242128 B2 JP 5242128B2 JP 2007279746 A JP2007279746 A JP 2007279746A JP 2007279746 A JP2007279746 A JP 2007279746A JP 5242128 B2 JP5242128 B2 JP 5242128B2
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JP
Japan
Prior art keywords
mass
resin composition
conductive filler
semiconductive resin
semiconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007279746A
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English (en)
Japanese (ja)
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JP2008239947A5 (https=
JP2008239947A (ja
Inventor
勇志 長尾
竜之 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP2007279746A priority Critical patent/JP5242128B2/ja
Publication of JP2008239947A publication Critical patent/JP2008239947A/ja
Publication of JP2008239947A5 publication Critical patent/JP2008239947A5/ja
Application granted granted Critical
Publication of JP5242128B2 publication Critical patent/JP5242128B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/22—Thermoplastic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/139—Open-ended, self-supporting conduit, cylinder, or tube-type article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electrophotography Configuration And Component (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP2007279746A 2007-02-28 2007-10-29 半導電性樹脂組成物 Expired - Fee Related JP5242128B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007279746A JP5242128B2 (ja) 2007-02-28 2007-10-29 半導電性樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007049730 2007-02-28
JP2007049730 2007-02-28
JP2007279746A JP5242128B2 (ja) 2007-02-28 2007-10-29 半導電性樹脂組成物

Publications (3)

Publication Number Publication Date
JP2008239947A JP2008239947A (ja) 2008-10-09
JP2008239947A5 JP2008239947A5 (https=) 2010-12-09
JP5242128B2 true JP5242128B2 (ja) 2013-07-24

Family

ID=39030994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007279746A Expired - Fee Related JP5242128B2 (ja) 2007-02-28 2007-10-29 半導電性樹脂組成物

Country Status (9)

Country Link
US (1) US8653177B2 (https=)
EP (1) EP2115054B1 (https=)
JP (1) JP5242128B2 (https=)
KR (1) KR101150774B1 (https=)
CN (1) CN101616973B (https=)
AT (1) ATE537212T1 (https=)
MY (1) MY146575A (https=)
TW (1) TWI437035B (https=)
WO (1) WO2008105121A1 (https=)

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EP2312504A4 (en) * 2008-08-01 2012-11-07 Asahi Glass Co Ltd RFID-TAG AND METHOD FOR THE PRODUCTION THEREOF, IMPEDANCE-ADJUSTING METHOD AND ARTIFICIAL RESIN FOIL AND METHOD FOR THE PRODUCTION THEREOF
JP2010144112A (ja) * 2008-12-22 2010-07-01 Polyplastics Co 燃料用部品
US8246862B2 (en) * 2009-07-30 2012-08-21 Eastman Kodak Company Static dissipative polymeric composition having controlled conductivity
KR20120066753A (ko) * 2010-12-15 2012-06-25 엠파워(주) 웨이퍼 케리어용 복합소재 조성물
KR101409032B1 (ko) * 2011-02-25 2014-06-19 주식회사 디와이엠 우수한 공간전하 축적 억제 특성을 갖는 초고압 직류 전력 케이블용 반도전성 조성물
JP5788252B2 (ja) * 2011-07-25 2015-09-30 オリンパス株式会社 ポリエーテルエーテルケトン複合材料
JP5816487B2 (ja) * 2011-08-22 2015-11-18 国立大学法人信州大学 複合樹脂
US20130228726A1 (en) * 2012-03-02 2013-09-05 Yun Zheng Injection moldable esd compounds having low tribo-charge
JPWO2014002581A1 (ja) * 2012-06-27 2016-05-30 クレハエクストロン株式会社 合成樹脂組成物及び成形体
JPWO2014033827A1 (ja) * 2012-08-28 2016-08-08 日立オートモティブシステムズ株式会社 二次電池
JP6155847B2 (ja) * 2013-05-28 2017-07-05 コニカミノルタ株式会社 シームレスベルト用樹脂組成物
DE102013221968A1 (de) * 2013-10-29 2015-04-30 Vitrulan Technical Textiles Gmbh Heizmittel und elektrisch leitender Heizkörper
JP6167459B2 (ja) * 2013-11-01 2017-07-26 パナソニックＩｐマネジメント株式会社 有機エレクトロルミネッセンスデバイス
KR101672089B1 (ko) * 2014-05-20 2016-11-03 주식회사 엘지화학 수지 복합재의 제조방법 및 이로부터 얻어진 성형품
KR101903300B1 (ko) 2014-07-22 2018-10-01 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 연성 재료를 갖는 성형 플루오로중합체 브레이크 실
JP2016128541A (ja) * 2015-01-09 2016-07-14 株式会社リコー 半導電性樹脂組成物、電子写真用部材及び画像形成装置
WO2016208648A1 (ja) * 2015-06-24 2016-12-29 コスモ石油株式会社 樹脂配合物
US9493696B1 (en) 2015-11-24 2016-11-15 International Business Machines Corporation Multiphase resins with reduced percolation threshold
EP3341798B1 (en) * 2016-01-27 2019-08-21 Hewlett-Packard Development Company, L.P. Liquid electrophotographic ink developer unit
CN106336630B (zh) * 2016-08-29 2018-12-25 付融冰 一种导电材料及其制备方法和用途
EP3632966B1 (en) * 2017-05-24 2024-07-31 Mitsubishi Gas Chemical Company, Inc. Sheet formed from carbon fiber reinforced thermoplastic resin, and production method of said sheet
JP6972764B2 (ja) * 2017-08-21 2021-11-24 日本電気硝子株式会社 ガラス繊維強化熱硬化性樹脂成形体及びガラス繊維強化熱硬化性樹脂成形体の製造方法
JP7200536B2 (ja) * 2018-08-20 2023-01-10 富士フイルムビジネスイノベーション株式会社 樹脂成形体
JP7393279B2 (ja) 2020-03-31 2023-12-06 日鉄ケミカル＆マテリアル株式会社 導電性樹脂組成物及び該組成物を用いた電磁波シールド材
JP7564642B2 (ja) * 2020-05-26 2024-10-09 住友化学株式会社 液晶ポリマー樹脂組成物、及び、その製造方法、並びに、半導体搬送用キャリア
CN111978732B (zh) * 2020-09-04 2022-05-24 广东思泉新材料股份有限公司 一种三维导热网络结构的热界面材料

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Also Published As

Publication number Publication date
KR101150774B1 (ko) 2012-06-08
EP2115054A1 (en) 2009-11-11
TWI437035B (zh) 2014-05-11
US8653177B2 (en) 2014-02-18
US20100173108A1 (en) 2010-07-08
JP2008239947A (ja) 2008-10-09
EP2115054B1 (en) 2011-12-14
TW200844154A (en) 2008-11-16
CN101616973B (zh) 2012-09-19
KR20090055521A (ko) 2009-06-02
MY146575A (en) 2012-08-30
WO2008105121A1 (en) 2008-09-04
CN101616973A (zh) 2009-12-30
ATE537212T1 (de) 2011-12-15

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