JP5241238B2 - プリント回路基板のための埋め込み過渡保護の実質的に連続する層 - Google Patents

プリント回路基板のための埋め込み過渡保護の実質的に連続する層 Download PDF

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Publication number
JP5241238B2
JP5241238B2 JP2007553396A JP2007553396A JP5241238B2 JP 5241238 B2 JP5241238 B2 JP 5241238B2 JP 2007553396 A JP2007553396 A JP 2007553396A JP 2007553396 A JP2007553396 A JP 2007553396A JP 5241238 B2 JP5241238 B2 JP 5241238B2
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Japan
Prior art keywords
transient
transient protection
material layer
conductive
layer
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Expired - Fee Related
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JP2007553396A
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English (en)
Japanese (ja)
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JP2008529309A (ja
Inventor
ジョージ ドゥドニコヴ，
グレゴリー スクローダー，
フランズ ギジン，
Original Assignee
サンミナ−エスシーアイ コーポレーション
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2007553396A 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の実質的に連続する層 Expired - Fee Related JP5241238B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US65372305P 2005-02-16 2005-02-16
US60/653,723 2005-02-16
PCT/US2006/005639 WO2007050114A2 (en) 2005-02-16 2006-02-16 A substantially continuous layer of embedded transient protection for printed circuit boards

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011002220A Division JP5588362B2 (ja) 2005-02-16 2011-01-07 プリント回路基板のための埋め込み過渡保護の実質的に連続する層

Publications (2)

Publication Number Publication Date
JP2008529309A JP2008529309A (ja) 2008-07-31
JP5241238B2 true JP5241238B2 (ja) 2013-07-17

Family

ID=36917156

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2007553396A Expired - Fee Related JP5241238B2 (ja) 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の実質的に連続する層
JP2007553397A Pending JP2008533699A (ja) 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の選択的な堆積
JP2011002220A Expired - Fee Related JP5588362B2 (ja) 2005-02-16 2011-01-07 プリント回路基板のための埋め込み過渡保護の実質的に連続する層

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2007553397A Pending JP2008533699A (ja) 2005-02-16 2006-02-16 プリント回路基板のための埋め込み過渡保護の選択的な堆積
JP2011002220A Expired - Fee Related JP5588362B2 (ja) 2005-02-16 2011-01-07 プリント回路基板のための埋め込み過渡保護の実質的に連続する層

Country Status (5)

Country Link
US (2) US7593203B2 (https=)
JP (3) JP5241238B2 (https=)
CN (2) CN101595769B (https=)
TW (2) TWI397356B (https=)
WO (2) WO2006089272A2 (https=)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7446030B2 (en) * 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US20100038121A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20100044079A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
TWI397356B (zh) * 2005-02-16 2013-05-21 聖米納公司 印刷電路板用嵌入式瞬態保護之實質連續層
TWI389205B (zh) * 2005-03-04 2013-03-11 Sanmina Sci Corp 使用抗鍍層分隔介層結構
US9781830B2 (en) 2005-03-04 2017-10-03 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
JP3993211B2 (ja) * 2005-11-18 2007-10-17 シャープ株式会社 多層プリント配線板およびその製造方法
US20100264225A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
CN101496167A (zh) 2005-11-22 2009-07-29 肖克科技有限公司 用于过电压保护的包括电压可变换材料的半导体器件
TWI276382B (en) * 2006-02-07 2007-03-11 Asustek Comp Inc Circuit board
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
JP2010521058A (ja) 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法
JP2010504437A (ja) * 2006-09-24 2010-02-12 ショッキング テクノロジーズ インコーポレイテッド 電圧で切替可能な誘電体材料および光補助を用いた基板デバイスをメッキする技法
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20090050856A1 (en) * 2007-08-20 2009-02-26 Lex Kosowsky Voltage switchable dielectric material incorporating modified high aspect ratio particles
TWI421996B (zh) * 2008-01-10 2014-01-01 財團法人工業技術研究院 靜電放電防護架構
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090220771A1 (en) * 2008-02-12 2009-09-03 Robert Fleming Voltage switchable dielectric material with superior physical properties for structural applications
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
WO2010033635A1 (en) * 2008-09-17 2010-03-25 Shocking Technologies, Inc. Voltage switchable dielectric material containing boron compound
EP2342722A2 (en) 2008-09-30 2011-07-13 Shocking Technologies Inc Voltage switchable dielectric material containing conductive core shelled particles
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8272123B2 (en) * 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) * 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8968606B2 (en) 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
TWI363583B (en) * 2009-07-15 2012-05-01 Quanta Comp Inc Audio circuit board
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) * 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
WO2011137261A1 (en) * 2010-04-28 2011-11-03 Shocking Technologies, Inc. Embedded protection against spurious electrical events
JP2012018907A (ja) * 2010-06-11 2012-01-26 Nissan Motor Co Ltd 電機部品
EP2758992A4 (en) * 2011-09-21 2015-08-12 Littelfuse Inc VERTICAL SWITCHING INFORMATION FOR ESD PROTECTION
CN103716994B (zh) * 2012-09-28 2016-09-07 珠海方正科技高密电子有限公司 一种印制电路板的制作方法及其印制电路板
TWI496516B (zh) * 2013-08-06 2015-08-11 Pegatron Corp 電路板結構
TWI501709B (zh) * 2013-08-16 2015-09-21 Pegatron Corp 電路板
US9510439B2 (en) * 2014-03-13 2016-11-29 Honeywell International Inc. Fault containment routing
US9503090B2 (en) * 2014-08-19 2016-11-22 International Business Machines Corporation High speed level translator
TWI569392B (zh) * 2014-10-20 2017-02-01 欣興電子股份有限公司 凹槽式載板製造方法
US9980381B2 (en) 2014-12-16 2018-05-22 Motorola Solutions, Inc. Method and apparatus for intrinsically safe circuit board arrangement for portable electronic devices
DE102021130924B4 (de) * 2021-11-25 2024-01-04 Infineon Technologies Ag Schutz vor elektrostatischer Entladung einer elektronischen Komponente, welche in dem Laminat einer gedruckten Leiterplatte eingebettet ist
CN114187618B (zh) * 2021-12-09 2025-03-14 深圳市汇顶科技股份有限公司 指纹检测电路、指纹检测装置和制造指纹检测电路的方法
CN114814669A (zh) * 2022-05-06 2022-07-29 中国科学院近代物理研究所 一种磁场纹波测量方法及装置

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4133735A (en) 1977-09-27 1979-01-09 The Board Of Regents Of The University Of Washington Ion-sensitive electrode and processes for making the same
US4628022A (en) * 1983-07-13 1986-12-09 At&T Technologies, Inc. Multilayer circuit board fabrication process and polymer insulator used therein
US4992333A (en) * 1988-11-18 1991-02-12 G&H Technology, Inc. Electrical overstress pulse protection
DE3911711A1 (de) 1989-04-10 1990-10-11 Ibm Modul-aufbau mit integriertem halbleiterchip und chiptraeger
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
US5260848A (en) 1990-07-27 1993-11-09 Electromer Corporation Foldback switching material and devices
JP2773578B2 (ja) 1992-10-02 1998-07-09 日本電気株式会社 半導体装置の製造方法
US5382928A (en) * 1993-01-22 1995-01-17 The Whitaker Corporation RF filter having composite dielectric layer and method of manufacture
GB2277197B (en) 1993-04-13 1997-08-27 Motorola Inc Voltage protection arrangement
US5479031A (en) 1993-09-10 1995-12-26 Teccor Electronics, Inc. Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value
EP1233427B1 (en) 1994-07-14 2012-10-10 Surgx Corporation Single and multi-layer variable voltage protection devices
WO1996002922A2 (en) 1994-07-14 1996-02-01 Surgx Corporation Variable voltage protection structures and methods for making same
US6210537B1 (en) * 1995-06-19 2001-04-03 Lynntech, Inc. Method of forming electronically conducting polymers on conducting and nonconducting substrates
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US6172590B1 (en) 1996-01-22 2001-01-09 Surgx Corporation Over-voltage protection device and method for making same
US5796570A (en) * 1996-09-19 1998-08-18 National Semiconductor Corporation Electrostatic discharge protection package
US6013358A (en) 1997-11-18 2000-01-11 Cooper Industries, Inc. Transient voltage protection device with ceramic substrate
US6251513B1 (en) * 1997-11-08 2001-06-26 Littlefuse, Inc. Polymer composites for overvoltage protection
US6642297B1 (en) * 1998-01-16 2003-11-04 Littelfuse, Inc. Polymer composite materials for electrostatic discharge protection
GB2334627B (en) 1998-02-21 2003-03-12 Mitel Corp Vertical spark gap for microelectronic circuits
US6130459A (en) 1998-03-10 2000-10-10 Oryx Technology Corporation Over-voltage protection device for integrated circuits
US6064094A (en) 1998-03-10 2000-05-16 Oryx Technology Corporation Over-voltage protection system for integrated circuits using the bonding pads and passivation layer
US6549114B2 (en) * 1998-08-20 2003-04-15 Littelfuse, Inc. Protection of electrical devices with voltage variable materials
DE19958915A1 (de) * 1998-12-08 2000-06-29 Littelfuse Inc Schutz eines integrierten Schaltkreises mit spannungsvariablen Materialien
US6329603B1 (en) 1999-04-07 2001-12-11 International Business Machines Corporation Low CTE power and ground planes
US7446030B2 (en) 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
NL1014319C2 (nl) 2000-02-08 2001-08-09 Fci S Hertogenbosch B V Connector omvattende een ESD onderdrukker.
US6373719B1 (en) 2000-04-13 2002-04-16 Surgx Corporation Over-voltage protection for electronic circuits
US6669871B2 (en) 2000-11-21 2003-12-30 Saint-Gobain Ceramics & Plastics, Inc. ESD dissipative ceramics
US7258819B2 (en) 2001-10-11 2007-08-21 Littelfuse, Inc. Voltage variable substrate material
AU2003224894A1 (en) * 2002-04-08 2003-10-27 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
US6981319B2 (en) 2003-02-13 2006-01-03 Shrier Karen P Method of manufacturing devices to protect election components
US20040183135A1 (en) 2003-03-19 2004-09-23 Oh-Hun Kwon ESD dissipative structural components
US6853036B1 (en) 2003-08-06 2005-02-08 Esd Pulse, Inc. Method and apparatus for preventing microcircuit dynamic thermo-mechanical damage during an ESD event
TWI397356B (zh) 2005-02-16 2013-05-21 聖米納公司 印刷電路板用嵌入式瞬態保護之實質連續層

Also Published As

Publication number Publication date
WO2006089272A2 (en) 2006-08-24
JP2011109121A (ja) 2011-06-02
CN101189365B (zh) 2015-09-16
JP2008533699A (ja) 2008-08-21
TW200642547A (en) 2006-12-01
JP5588362B2 (ja) 2014-09-10
CN101595769A (zh) 2009-12-02
CN101595769B (zh) 2011-09-14
TW200642548A (en) 2006-12-01
US20060181827A1 (en) 2006-08-17
US20060181826A1 (en) 2006-08-17
WO2007050114A3 (en) 2007-12-21
TWI397356B (zh) 2013-05-21
WO2007050114A2 (en) 2007-05-03
US7593203B2 (en) 2009-09-22
US7688598B2 (en) 2010-03-30
JP2008529309A (ja) 2008-07-31
WO2006089272A3 (en) 2009-04-16
CN101189365A (zh) 2008-05-28
TWI375494B (en) 2012-10-21

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