JP2011109121A5 - - Google Patents
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- Publication number
- JP2011109121A5 JP2011109121A5 JP2011002220A JP2011002220A JP2011109121A5 JP 2011109121 A5 JP2011109121 A5 JP 2011109121A5 JP 2011002220 A JP2011002220 A JP 2011002220A JP 2011002220 A JP2011002220 A JP 2011002220A JP 2011109121 A5 JP2011109121 A5 JP 2011109121A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- transient protection
- printed circuit
- material layer
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65372305P | 2005-02-16 | 2005-02-16 | |
| US60/653,723 | 2005-02-16 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007553396A Division JP5241238B2 (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011109121A JP2011109121A (ja) | 2011-06-02 |
| JP2011109121A5 true JP2011109121A5 (https=) | 2013-03-14 |
| JP5588362B2 JP5588362B2 (ja) | 2014-09-10 |
Family
ID=36917156
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007553396A Expired - Fee Related JP5241238B2 (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
| JP2007553397A Pending JP2008533699A (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の選択的な堆積 |
| JP2011002220A Expired - Fee Related JP5588362B2 (ja) | 2005-02-16 | 2011-01-07 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007553396A Expired - Fee Related JP5241238B2 (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の実質的に連続する層 |
| JP2007553397A Pending JP2008533699A (ja) | 2005-02-16 | 2006-02-16 | プリント回路基板のための埋め込み過渡保護の選択的な堆積 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7593203B2 (https=) |
| JP (3) | JP5241238B2 (https=) |
| CN (2) | CN101595769B (https=) |
| TW (2) | TWI397356B (https=) |
| WO (2) | WO2006089272A2 (https=) |
Families Citing this family (54)
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|---|---|---|---|---|
| US20100038119A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
| WO2001017320A1 (en) | 1999-08-27 | 2001-03-08 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
| US7446030B2 (en) * | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
| US20100038121A1 (en) * | 1999-08-27 | 2010-02-18 | Lex Kosowsky | Metal Deposition |
| US7695644B2 (en) * | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
| US20100044079A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
| US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
| US20080035370A1 (en) * | 1999-08-27 | 2008-02-14 | Lex Kosowsky | Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material |
| US20100044080A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
| TWI397356B (zh) * | 2005-02-16 | 2013-05-21 | 聖米納公司 | 印刷電路板用嵌入式瞬態保護之實質連續層 |
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| US9781830B2 (en) | 2005-03-04 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
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| JP2010521058A (ja) | 2006-09-24 | 2010-06-17 | ショッキング テクノロジーズ,インコーポレイテッド | ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法 |
| JP2010504437A (ja) * | 2006-09-24 | 2010-02-12 | ショッキング テクノロジーズ インコーポレイテッド | 電圧で切替可能な誘電体材料および光補助を用いた基板デバイスをメッキする技法 |
| US20120119168A9 (en) * | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
| US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
| US20090050856A1 (en) * | 2007-08-20 | 2009-02-26 | Lex Kosowsky | Voltage switchable dielectric material incorporating modified high aspect ratio particles |
| TWI421996B (zh) * | 2008-01-10 | 2014-01-01 | 財團法人工業技術研究院 | 靜電放電防護架構 |
| US8206614B2 (en) * | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
| US20090220771A1 (en) * | 2008-02-12 | 2009-09-03 | Robert Fleming | Voltage switchable dielectric material with superior physical properties for structural applications |
| US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
| US20100047535A1 (en) | 2008-08-22 | 2010-02-25 | Lex Kosowsky | Core layer structure having voltage switchable dielectric material |
| WO2010033635A1 (en) * | 2008-09-17 | 2010-03-25 | Shocking Technologies, Inc. | Voltage switchable dielectric material containing boron compound |
| EP2342722A2 (en) | 2008-09-30 | 2011-07-13 | Shocking Technologies Inc | Voltage switchable dielectric material containing conductive core shelled particles |
| US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
| US8362871B2 (en) * | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
| US8272123B2 (en) * | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| US9226391B2 (en) * | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
| US8968606B2 (en) | 2009-03-26 | 2015-03-03 | Littelfuse, Inc. | Components having voltage switchable dielectric materials |
| TWI363583B (en) * | 2009-07-15 | 2012-05-01 | Quanta Comp Inc | Audio circuit board |
| US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
| US9320135B2 (en) * | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
| US9224728B2 (en) * | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
| US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
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| JP2012018907A (ja) * | 2010-06-11 | 2012-01-26 | Nissan Motor Co Ltd | 電機部品 |
| EP2758992A4 (en) * | 2011-09-21 | 2015-08-12 | Littelfuse Inc | VERTICAL SWITCHING INFORMATION FOR ESD PROTECTION |
| CN103716994B (zh) * | 2012-09-28 | 2016-09-07 | 珠海方正科技高密电子有限公司 | 一种印制电路板的制作方法及其印制电路板 |
| TWI496516B (zh) * | 2013-08-06 | 2015-08-11 | Pegatron Corp | 電路板結構 |
| TWI501709B (zh) * | 2013-08-16 | 2015-09-21 | Pegatron Corp | 電路板 |
| US9510439B2 (en) * | 2014-03-13 | 2016-11-29 | Honeywell International Inc. | Fault containment routing |
| US9503090B2 (en) * | 2014-08-19 | 2016-11-22 | International Business Machines Corporation | High speed level translator |
| TWI569392B (zh) * | 2014-10-20 | 2017-02-01 | 欣興電子股份有限公司 | 凹槽式載板製造方法 |
| US9980381B2 (en) | 2014-12-16 | 2018-05-22 | Motorola Solutions, Inc. | Method and apparatus for intrinsically safe circuit board arrangement for portable electronic devices |
| DE102021130924B4 (de) * | 2021-11-25 | 2024-01-04 | Infineon Technologies Ag | Schutz vor elektrostatischer Entladung einer elektronischen Komponente, welche in dem Laminat einer gedruckten Leiterplatte eingebettet ist |
| CN114187618B (zh) * | 2021-12-09 | 2025-03-14 | 深圳市汇顶科技股份有限公司 | 指纹检测电路、指纹检测装置和制造指纹检测电路的方法 |
| CN114814669A (zh) * | 2022-05-06 | 2022-07-29 | 中国科学院近代物理研究所 | 一种磁场纹波测量方法及装置 |
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| US4133735A (en) | 1977-09-27 | 1979-01-09 | The Board Of Regents Of The University Of Washington | Ion-sensitive electrode and processes for making the same |
| US4628022A (en) * | 1983-07-13 | 1986-12-09 | At&T Technologies, Inc. | Multilayer circuit board fabrication process and polymer insulator used therein |
| US4992333A (en) * | 1988-11-18 | 1991-02-12 | G&H Technology, Inc. | Electrical overstress pulse protection |
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| US5260848A (en) | 1990-07-27 | 1993-11-09 | Electromer Corporation | Foldback switching material and devices |
| JP2773578B2 (ja) | 1992-10-02 | 1998-07-09 | 日本電気株式会社 | 半導体装置の製造方法 |
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| US20040183135A1 (en) | 2003-03-19 | 2004-09-23 | Oh-Hun Kwon | ESD dissipative structural components |
| US6853036B1 (en) | 2003-08-06 | 2005-02-08 | Esd Pulse, Inc. | Method and apparatus for preventing microcircuit dynamic thermo-mechanical damage during an ESD event |
| TWI397356B (zh) | 2005-02-16 | 2013-05-21 | 聖米納公司 | 印刷電路板用嵌入式瞬態保護之實質連續層 |
-
2006
- 2006-02-16 TW TW095105218A patent/TWI397356B/zh not_active IP Right Cessation
- 2006-02-16 JP JP2007553396A patent/JP5241238B2/ja not_active Expired - Fee Related
- 2006-02-16 US US11/357,618 patent/US7593203B2/en active Active
- 2006-02-16 CN CN200680004951.XA patent/CN101595769B/zh not_active Expired - Fee Related
- 2006-02-16 US US11/356,562 patent/US7688598B2/en active Active
- 2006-02-16 CN CN200680004950.5A patent/CN101189365B/zh not_active Expired - Fee Related
- 2006-02-16 JP JP2007553397A patent/JP2008533699A/ja active Pending
- 2006-02-16 TW TW095105219A patent/TWI375494B/zh not_active IP Right Cessation
- 2006-02-16 WO PCT/US2006/005984 patent/WO2006089272A2/en not_active Ceased
- 2006-02-16 WO PCT/US2006/005639 patent/WO2007050114A2/en not_active Ceased
-
2011
- 2011-01-07 JP JP2011002220A patent/JP5588362B2/ja not_active Expired - Fee Related
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