CN101595769B - 印刷电路板的嵌入式瞬时保护的选择性沉积 - Google Patents

印刷电路板的嵌入式瞬时保护的选择性沉积 Download PDF

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Publication number
CN101595769B
CN101595769B CN200680004951.XA CN200680004951A CN101595769B CN 101595769 B CN101595769 B CN 101595769B CN 200680004951 A CN200680004951 A CN 200680004951A CN 101595769 B CN101595769 B CN 101595769B
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CN
China
Prior art keywords
instantaneous protection
pcb
conductive
printed circuit
transient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680004951.XA
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English (en)
Chinese (zh)
Other versions
CN101595769A (zh
Inventor
乔治·达尼科夫
弗朗兹·吉森
格雷格里·施罗德
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Sanmina Corp
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Sanmina SCI Corp
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Publication date
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Publication of CN101595769A publication Critical patent/CN101595769A/zh
Application granted granted Critical
Publication of CN101595769B publication Critical patent/CN101595769B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/80—Arrangements for protection of devices protecting against overcurrent or overload, e.g. fuses or shunts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN200680004951.XA 2005-02-16 2006-02-16 印刷电路板的嵌入式瞬时保护的选择性沉积 Expired - Fee Related CN101595769B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US65372305P 2005-02-16 2005-02-16
US60/653,723 2005-02-16
PCT/US2006/005984 WO2006089272A2 (en) 2005-02-16 2006-02-16 Selective deposition of embedded transient protection for printed circuit boards

Publications (2)

Publication Number Publication Date
CN101595769A CN101595769A (zh) 2009-12-02
CN101595769B true CN101595769B (zh) 2011-09-14

Family

ID=36917156

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200680004951.XA Expired - Fee Related CN101595769B (zh) 2005-02-16 2006-02-16 印刷电路板的嵌入式瞬时保护的选择性沉积
CN200680004950.5A Expired - Fee Related CN101189365B (zh) 2005-02-16 2006-02-16 印刷电路板的基本连续的嵌入瞬时保护层

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200680004950.5A Expired - Fee Related CN101189365B (zh) 2005-02-16 2006-02-16 印刷电路板的基本连续的嵌入瞬时保护层

Country Status (5)

Country Link
US (2) US7593203B2 (https=)
JP (3) JP5241238B2 (https=)
CN (2) CN101595769B (https=)
TW (2) TWI397356B (https=)
WO (2) WO2006089272A2 (https=)

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US7446030B2 (en) * 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
US20100038121A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20100044079A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
TWI397356B (zh) * 2005-02-16 2013-05-21 聖米納公司 印刷電路板用嵌入式瞬態保護之實質連續層
TWI389205B (zh) * 2005-03-04 2013-03-11 Sanmina Sci Corp 使用抗鍍層分隔介層結構
US9781830B2 (en) 2005-03-04 2017-10-03 Sanmina Corporation Simultaneous and selective wide gap partitioning of via structures using plating resist
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TWI496516B (zh) * 2013-08-06 2015-08-11 Pegatron Corp 電路板結構
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TWI569392B (zh) * 2014-10-20 2017-02-01 欣興電子股份有限公司 凹槽式載板製造方法
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Also Published As

Publication number Publication date
WO2006089272A2 (en) 2006-08-24
JP2011109121A (ja) 2011-06-02
CN101189365B (zh) 2015-09-16
JP5241238B2 (ja) 2013-07-17
JP2008533699A (ja) 2008-08-21
TW200642547A (en) 2006-12-01
JP5588362B2 (ja) 2014-09-10
CN101595769A (zh) 2009-12-02
TW200642548A (en) 2006-12-01
US20060181827A1 (en) 2006-08-17
US20060181826A1 (en) 2006-08-17
WO2007050114A3 (en) 2007-12-21
TWI397356B (zh) 2013-05-21
WO2007050114A2 (en) 2007-05-03
US7593203B2 (en) 2009-09-22
US7688598B2 (en) 2010-03-30
JP2008529309A (ja) 2008-07-31
WO2006089272A3 (en) 2009-04-16
CN101189365A (zh) 2008-05-28
TWI375494B (en) 2012-10-21

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Granted publication date: 20110914