JP5228363B2 - 発光素子 - Google Patents
発光素子 Download PDFInfo
- Publication number
- JP5228363B2 JP5228363B2 JP2007109654A JP2007109654A JP5228363B2 JP 5228363 B2 JP5228363 B2 JP 5228363B2 JP 2007109654 A JP2007109654 A JP 2007109654A JP 2007109654 A JP2007109654 A JP 2007109654A JP 5228363 B2 JP5228363 B2 JP 5228363B2
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- compound semiconductor
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- semiconductor layer
- electrode
- mesa structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04252—Electrodes, e.g. characterised by the structure characterised by the material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/125—Distributed Bragg reflector [DBR] lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18311—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement using selective oxidation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/185—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]
- H01S5/187—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL] using Bragg reflection
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
- H01S5/221—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials containing aluminium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2231—Buried stripe structure with inner confining structure only between the active layer and the upper electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/176—Specific passivation layers on surfaces other than the emission facet
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/18—Semiconductor lasers with special structural design for influencing the near- or far-field
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
- H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18308—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] having a special structure for lateral current or light confinement
- H01S5/18338—Non-circular shape of the structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
- H01S5/3432—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs the whole junction comprising only (AI)GaAs
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007109654A JP5228363B2 (ja) | 2007-04-18 | 2007-04-18 | 発光素子 |
| US12/078,681 US8761221B2 (en) | 2007-04-18 | 2008-04-03 | Light-emitting element and method for manufacturing the same |
| US14/273,067 US20150010032A1 (en) | 2007-04-18 | 2014-05-08 | Light-emitting element and method for manufacturing the same |
| US14/518,382 US9252565B2 (en) | 2007-04-18 | 2014-10-20 | Light-emitting element |
| US14/735,755 US9484713B2 (en) | 2007-04-18 | 2015-06-10 | Light-emitting element and method for manufacturing the same |
| US14/823,868 US9407064B2 (en) | 2007-04-18 | 2015-08-11 | Light-emitting element and method for manufacturing the same |
| US15/272,181 US9941662B2 (en) | 2007-04-18 | 2016-09-21 | Light-emitting element and method for manufacturing the same |
| US15/810,690 US10153613B2 (en) | 2007-04-18 | 2017-11-13 | Light-emitting element and method for manufacturing the same |
| US16/173,226 US10833479B2 (en) | 2007-04-18 | 2018-10-29 | Light-emitting element and method for manufacturing the same |
| US17/067,451 US11658463B2 (en) | 2007-04-18 | 2020-10-09 | Light-emitting element and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007109654A JP5228363B2 (ja) | 2007-04-18 | 2007-04-18 | 発光素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008270432A JP2008270432A (ja) | 2008-11-06 |
| JP2008270432A5 JP2008270432A5 (enExample) | 2010-02-25 |
| JP5228363B2 true JP5228363B2 (ja) | 2013-07-03 |
Family
ID=39969479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007109654A Active JP5228363B2 (ja) | 2007-04-18 | 2007-04-18 | 発光素子 |
Country Status (2)
| Country | Link |
|---|---|
| US (9) | US8761221B2 (enExample) |
| JP (1) | JP5228363B2 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5228363B2 (ja) | 2007-04-18 | 2013-07-03 | ソニー株式会社 | 発光素子 |
| TW201017863A (en) * | 2008-10-03 | 2010-05-01 | Versitech Ltd | Semiconductor color-tunable broadband light sources and full-color microdisplays |
| JP5321886B2 (ja) * | 2009-02-06 | 2013-10-23 | ソニー株式会社 | 半導体素子 |
| JP5381180B2 (ja) * | 2009-03-10 | 2014-01-08 | 富士ゼロックス株式会社 | 面発光型半導体レーザ、面発光型半導体レーザ装置、光送信装置および情報処理装置 |
| US9740019B2 (en) * | 2010-02-02 | 2017-08-22 | Apple Inc. | Integrated structured-light projector |
| US9196803B2 (en) * | 2011-04-11 | 2015-11-24 | Nichia Corporation | Semiconductor light emitting element and method for manufacturing the same |
| US10054430B2 (en) | 2011-08-09 | 2018-08-21 | Apple Inc. | Overlapping pattern projector |
| US8749796B2 (en) | 2011-08-09 | 2014-06-10 | Primesense Ltd. | Projectors of structured light |
| US9847372B2 (en) * | 2011-12-01 | 2017-12-19 | Micron Technology, Inc. | Solid state transducer devices with separately controlled regions, and associated systems and methods |
| DE102013216527A1 (de) * | 2013-08-21 | 2015-02-26 | Osram Opto Semiconductors Gmbh | Laserbauelement und Verfahren zum Herstellen eines Laserbauelements |
| JP6135559B2 (ja) * | 2014-03-10 | 2017-05-31 | ソニー株式会社 | 半導体発光素子および半導体発光素子の製造方法ならびに半導体素子 |
| KR102414187B1 (ko) | 2015-07-24 | 2022-06-28 | 삼성전자주식회사 | 발광 다이오드 모듈 |
| JP2018073853A (ja) * | 2016-10-24 | 2018-05-10 | スタンレー電気株式会社 | 反射鏡、垂直共振器型発光装置及びその製造方法 |
| US10153614B1 (en) | 2017-08-31 | 2018-12-11 | Apple Inc. | Creating arbitrary patterns on a 2-D uniform grid VCSEL array |
| EP3493337A1 (en) * | 2017-11-30 | 2019-06-05 | Koninklijke Philips N.V. | Vertical cavity surface emitting laser (vcsel) device with improved reliability |
| JP7166871B2 (ja) | 2018-10-18 | 2022-11-08 | スタンレー電気株式会社 | 垂直共振器型発光素子 |
| JP7190865B2 (ja) | 2018-10-18 | 2022-12-16 | スタンレー電気株式会社 | 垂直共振器型発光素子 |
| EP3878069B1 (en) * | 2018-11-06 | 2024-01-03 | Vixar Inc. | Small pitch vcsel array |
| JP7291497B2 (ja) * | 2019-02-21 | 2023-06-15 | スタンレー電気株式会社 | 垂直共振器型発光素子 |
| US11764544B2 (en) | 2019-02-28 | 2023-09-19 | Seoul Viosys Co., Ltd. | Vertical-cavity surface-emitting laser |
| JP2020181863A (ja) * | 2019-04-24 | 2020-11-05 | セイコーエプソン株式会社 | 半導体レーザーおよび原子発振器 |
| TWI731329B (zh) * | 2019-04-30 | 2021-06-21 | 晶智達光電股份有限公司 | 雷射元件及其半導體元件 |
| JP7056628B2 (ja) * | 2019-06-28 | 2022-04-19 | セイコーエプソン株式会社 | 発光装置およびプロジェクター |
| JP7396643B2 (ja) * | 2019-12-13 | 2023-12-12 | 国立研究開発法人情報通信研究機構 | 波長可変面発光レーザ |
| EP4451488B1 (en) * | 2020-01-08 | 2025-11-19 | Stanley Electric Co., Ltd. | Vertical cavity light-emitting element |
| CN111313235B (zh) * | 2020-03-04 | 2021-09-14 | 常州纵慧芯光半导体科技有限公司 | 一种垂直腔面发射激光器及其制造方法 |
| CN111211482B (zh) * | 2020-03-04 | 2021-09-14 | 常州纵慧芯光半导体科技有限公司 | 一种垂直腔面发射激光器及其制造方法与应用 |
| CN113224639A (zh) * | 2021-04-19 | 2021-08-06 | 深圳市德明利光电有限公司 | 一种帽盖型p型电极vcsel结构及其工艺方法 |
| CN114651337B (zh) * | 2021-12-10 | 2025-08-19 | 天津三安光电有限公司 | 发光二极管及发光装置 |
| TWI802192B (zh) * | 2021-12-29 | 2023-05-11 | 友達光電股份有限公司 | 發光元件、包含其之發光組件及顯示裝置、及顯示裝置之製造方法 |
| CN116845698B (zh) * | 2023-08-21 | 2023-11-24 | 深圳市速腾聚创科技有限公司 | 激光器、激光雷达及可移动设备 |
| CN118889190A (zh) * | 2024-09-27 | 2024-11-01 | 闽都创新实验室 | 一种窄线宽大功率垂直腔面发射激光器及制备方法 |
Family Cites Families (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4783788A (en) * | 1985-12-16 | 1988-11-08 | Lytel Incorporated | High power semiconductor lasers |
| JPH0265288A (ja) | 1988-08-31 | 1990-03-05 | Sony Corp | 半導体レーザ |
| JP2990837B2 (ja) | 1991-04-22 | 1999-12-13 | ソニー株式会社 | 半導体レーザ |
| GB2295269A (en) * | 1994-11-14 | 1996-05-22 | Sharp Kk | Resonant cavity laser having oxide spacer region |
| US5719891A (en) * | 1995-12-18 | 1998-02-17 | Picolight Incorporated | Conductive element with lateral oxidation barrier |
| JP3164203B2 (ja) * | 1996-02-16 | 2001-05-08 | 日本電信電話株式会社 | 面発光レーザおよびその製造方法 |
| US6697404B1 (en) * | 1996-08-30 | 2004-02-24 | Ricoh Company, Ltd. | Laser diode operable in 1.3μm or 1.5μm wavelength band with improved efficiency |
| EP0905835A1 (en) | 1997-09-26 | 1999-03-31 | Xerox Corporation | Independently addressable vertical cavity surface emitting laser arrays with buried selectively oxidized native oxide aperture |
| US6658040B1 (en) | 2000-07-28 | 2003-12-02 | Agilent Technologies, Inc. | High speed VCSEL |
| US6650683B2 (en) * | 2000-11-20 | 2003-11-18 | Fuji Xerox Co, Ltd. | Surface emitting semiconductor laser |
| JP2002223033A (ja) * | 2001-01-26 | 2002-08-09 | Toshiba Corp | 光素子及び光システム |
| JP2003115634A (ja) * | 2001-08-02 | 2003-04-18 | Furukawa Electric Co Ltd:The | 面発光レーザ素子 |
| JP4050028B2 (ja) * | 2001-09-28 | 2008-02-20 | 株式会社東芝 | 面発光型半導体発光素子 |
| JP2003264334A (ja) * | 2002-03-08 | 2003-09-19 | Hitachi Ltd | 半導体レーザ素子及び半導体レーザモジュール |
| JP4141172B2 (ja) * | 2002-04-30 | 2008-08-27 | 株式会社リコー | 面発光半導体レーザ素子の製造方法および面発光半導体レーザ素子および光伝送システム |
| US6813293B2 (en) * | 2002-11-21 | 2004-11-02 | Finisar Corporation | Long wavelength VCSEL with tunnel junction, and implant |
| JP2004214332A (ja) * | 2002-12-27 | 2004-07-29 | Victor Co Of Japan Ltd | 面発光レーザの製造方法。 |
| JP4561042B2 (ja) * | 2003-04-11 | 2010-10-13 | 富士ゼロックス株式会社 | 面発光型半導体レーザおよびその製造方法 |
| JP2005026625A (ja) | 2003-07-03 | 2005-01-27 | Toyota Motor Corp | 面発光半導体レーザ及びその製造方法 |
| JP2005045107A (ja) * | 2003-07-24 | 2005-02-17 | Sony Corp | 面発光レーザおよびその製造方法 |
| JP2005142463A (ja) * | 2003-11-10 | 2005-06-02 | Sony Corp | 半導体発光素子およびその製造方法 |
| US7058106B2 (en) | 2003-12-10 | 2006-06-06 | Widjaja Wilson H | Screenable moisture-passivated planar index-guided VCSEL |
| JP4193709B2 (ja) * | 2004-01-28 | 2008-12-10 | 富士ゼロックス株式会社 | 面発光型半導体レーザを光源に用いた光送信装置 |
| JP2005311089A (ja) * | 2004-04-22 | 2005-11-04 | Fuji Xerox Co Ltd | 垂直共振器型面発光半導体レーザ装置 |
| US7672347B2 (en) * | 2004-05-14 | 2010-03-02 | Sony Corporation | Semiconductor light emitting device |
| US20060013276A1 (en) | 2004-07-15 | 2006-01-19 | Mchugo Scott A | VCSEL having an air gap and protective coating |
| JP4409484B2 (ja) * | 2004-08-20 | 2010-02-03 | パナソニック株式会社 | 半導体発光装置 |
| JP2006066482A (ja) * | 2004-08-25 | 2006-03-09 | Sony Corp | 面発光型半導体レーザ素子およびその製造方法、並びに光学ユニットおよび光学モジュール |
| JP4731167B2 (ja) * | 2005-01-05 | 2011-07-20 | 株式会社リコー | 面発光レーザー素子 |
| JP5055717B2 (ja) * | 2005-06-20 | 2012-10-24 | 富士ゼロックス株式会社 | 面発光型半導体レーザ |
| JP5376104B2 (ja) * | 2005-07-04 | 2013-12-25 | ソニー株式会社 | 面発光型半導体レーザ |
| JP2007165798A (ja) * | 2005-12-16 | 2007-06-28 | Furukawa Electric Co Ltd:The | 半導体レーザ素子 |
| JP5250999B2 (ja) * | 2006-06-08 | 2013-07-31 | ソニー株式会社 | 面発光型半導体レーザ |
| JP5034662B2 (ja) * | 2006-06-20 | 2012-09-26 | ソニー株式会社 | 面発光型半導体レーザおよびその製造方法 |
| JP5082344B2 (ja) * | 2006-08-31 | 2012-11-28 | 富士ゼロックス株式会社 | 面発光型半導体レーザおよびその製造方法 |
| JP2008177430A (ja) * | 2007-01-19 | 2008-07-31 | Sony Corp | 発光素子及びその製造方法、並びに、発光素子集合体及びその製造方法 |
| JP4992503B2 (ja) * | 2007-03-27 | 2012-08-08 | ソニー株式会社 | 面発光型半導体レーザおよびその製造方法 |
| JP5228363B2 (ja) * | 2007-04-18 | 2013-07-03 | ソニー株式会社 | 発光素子 |
| JP5212686B2 (ja) * | 2007-08-22 | 2013-06-19 | ソニー株式会社 | 半導体レーザアレイの製造方法 |
| US7957447B2 (en) * | 2007-11-20 | 2011-06-07 | Fuji Xerox Co., Ltd. | VCSEL array device and method for manufacturing the VCSEL array device |
| JP5274038B2 (ja) * | 2008-02-06 | 2013-08-28 | キヤノン株式会社 | 垂直共振器型面発光レーザの製造方法とレーザアレイの製造方法 |
| JP5106487B2 (ja) * | 2008-07-31 | 2012-12-26 | キヤノン株式会社 | 面発光レーザの製造方法及び面発光レーザアレイの製造方法、該製造方法による面発光レーザアレイを備えている光学機器 |
| JP5748949B2 (ja) * | 2008-11-20 | 2015-07-15 | 株式会社リコー | 面発光レーザ素子、面発光レーザアレイ、光走査装置及び画像形成装置 |
| JP2010160117A (ja) * | 2009-01-09 | 2010-07-22 | Fuji Xerox Co Ltd | 計測装置 |
| JP4868004B2 (ja) * | 2009-02-06 | 2012-02-01 | ソニー株式会社 | 面発光型半導体レーザおよびその製造方法 |
| JP2010186791A (ja) * | 2009-02-10 | 2010-08-26 | Mitsubishi Electric Corp | 半導体発光素子及びその製造方法 |
| JP5326677B2 (ja) * | 2009-03-09 | 2013-10-30 | ソニー株式会社 | 半導体レーザおよびその製造方法 |
| JP5874227B2 (ja) * | 2011-07-22 | 2016-03-02 | 富士ゼロックス株式会社 | 面発光型半導体レーザアレイ、面発光型半導体レーザ装置、光伝送装置および情報処理装置 |
| JP5100881B1 (ja) * | 2011-11-07 | 2012-12-19 | 古河電気工業株式会社 | 集積型半導体レーザ素子 |
| US8731012B2 (en) * | 2012-01-24 | 2014-05-20 | Fuji Xerox Co., Ltd. | Surface emitting semiconductor laser and its manufacturing method, surface emitting semiconductor laser device, optical transmitter, and information processor |
| JP2013157473A (ja) * | 2012-01-30 | 2013-08-15 | Canon Inc | 面発光レーザ |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20190074662A1 (en) | 2019-03-07 |
| US20210098971A1 (en) | 2021-04-01 |
| US9252565B2 (en) | 2016-02-02 |
| US20170012409A1 (en) | 2017-01-12 |
| US20080279241A1 (en) | 2008-11-13 |
| US10833479B2 (en) | 2020-11-10 |
| US20180069375A1 (en) | 2018-03-08 |
| US20150349494A1 (en) | 2015-12-03 |
| US9484713B2 (en) | 2016-11-01 |
| US9941662B2 (en) | 2018-04-10 |
| US8761221B2 (en) | 2014-06-24 |
| US11658463B2 (en) | 2023-05-23 |
| JP2008270432A (ja) | 2008-11-06 |
| US10153613B2 (en) | 2018-12-11 |
| US20150325981A1 (en) | 2015-11-12 |
| US20150036710A1 (en) | 2015-02-05 |
| US9407064B2 (en) | 2016-08-02 |
| US20150010032A1 (en) | 2015-01-08 |
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