JP5227613B2 - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
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- JP5227613B2 JP5227613B2 JP2008046249A JP2008046249A JP5227613B2 JP 5227613 B2 JP5227613 B2 JP 5227613B2 JP 2008046249 A JP2008046249 A JP 2008046249A JP 2008046249 A JP2008046249 A JP 2008046249A JP 5227613 B2 JP5227613 B2 JP 5227613B2
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- Prior art keywords
- semiconductor light
- emitting device
- light emitting
- light
- shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Description
1a、1b 側面
2 半導体発光装置本体
3 遮光反射部材
3a、3b 遮光反射膜
4 半導体発光素子
5 半導体発光素子実装基板
6 ハウジング
6a、6b 側面
6c 前面
7 封止樹脂
7a、7b 側面
7c 光出射面
8 白色絶縁基板
8a、8b、8c、8d 側面
8e 後面
9 溝部
10 電極
10a、10b 端面
11 電極
11a、11b 端面
12 ボンディングワイヤ
13 半導体発光装置実装基板
14 電極パッド
15 電極パッド
16 導光板
16a 開口部
Claims (1)
- 絶縁基板(8)と該絶縁基板の一方の面から対向する側面を経て他方の面に延びる一対の電極(10,11)を有する半導体発光素子実装基板部の一方の側に凹部を有するハウジング部(6)が設けられ、前記凹部の内底面に露出した前記一対の電極の少なくとも一方の側に所定の間隔で複数個の半導体発光素子(4)が実装されると共に前記凹部内に封止樹脂(7)が充填されて前記複数個の半導体発光素子が一括樹脂封止されてなる多数個取り半導体発光装置本体(1)を、所定の間隔で切断することにより対向する一対の切断面(1a,1b)を有する個片化された個々の前記半導体発光装置本体に対し、
前記半導体発光装置本体の前記一対の切断面(1a,1b)はそれぞれ、前記半導体発光素子の光軸に平行な方向(x)に対しては、前記封止樹脂の光出射面(7c)の端部から10μm〜150μmの距離を置いた位置から前記絶縁基板(8)の中央位置まで、且つ光軸に垂直な方向に対しては前記封止樹脂の幅とする領域が遮光反射膜(3a)で覆われていることを特徴とする半導体発光装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008046249A JP5227613B2 (ja) | 2008-02-27 | 2008-02-27 | 半導体発光装置 |
US12/394,948 US7960748B2 (en) | 2008-02-27 | 2009-02-27 | Semiconductor light emitting device and method for manufacturing the same |
CN200910118093.7A CN101521183B (zh) | 2008-02-27 | 2009-02-27 | 半导体发光器件及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008046249A JP5227613B2 (ja) | 2008-02-27 | 2008-02-27 | 半導体発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009206261A JP2009206261A (ja) | 2009-09-10 |
JP5227613B2 true JP5227613B2 (ja) | 2013-07-03 |
Family
ID=40997434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008046249A Active JP5227613B2 (ja) | 2008-02-27 | 2008-02-27 | 半導体発光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7960748B2 (ja) |
JP (1) | JP5227613B2 (ja) |
CN (1) | CN101521183B (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8624491B2 (en) * | 2010-07-22 | 2014-01-07 | Kyocera Corporation | Light emitting device |
JP2013211507A (ja) * | 2011-08-08 | 2013-10-10 | Rohm Co Ltd | フォトインタラプタ、フォトインタラプタの製造方法、およびフォトインタラプタの実装構造 |
JP6154392B2 (ja) * | 2012-02-16 | 2017-06-28 | シチズン電子株式会社 | 発光ダイオードおよび発光ダイオードを有する照明装置 |
KR102123039B1 (ko) | 2013-07-19 | 2020-06-15 | 니치아 카가쿠 고교 가부시키가이샤 | 발광 장치 및 그 제조 방법 |
JP6175952B2 (ja) * | 2013-07-19 | 2017-08-09 | 日亜化学工業株式会社 | 発光装置 |
US9673364B2 (en) | 2013-07-19 | 2017-06-06 | Nichia Corporation | Light emitting device and method of manufacturing the same |
JP2015207754A (ja) | 2013-12-13 | 2015-11-19 | 日亜化学工業株式会社 | 発光装置 |
DE102013114345A1 (de) * | 2013-12-18 | 2015-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
JP6582382B2 (ja) | 2014-09-26 | 2019-10-02 | 日亜化学工業株式会社 | 発光装置の製造方法 |
KR20160045453A (ko) * | 2014-10-17 | 2016-04-27 | 서울반도체 주식회사 | 백라이트 유닛 및 사이드뷰 발광 다이오드 패키지 |
JP1547626S (ja) * | 2015-08-19 | 2016-04-11 | ||
JP1554165S (ja) * | 2016-01-13 | 2016-07-19 | ||
CN105511145A (zh) * | 2016-02-03 | 2016-04-20 | 京东方科技集团股份有限公司 | 一种显示装置及其制作方法 |
KR102592276B1 (ko) * | 2016-07-15 | 2023-10-24 | 삼성디스플레이 주식회사 | 발광장치 및 그의 제조방법 |
JP6891530B2 (ja) * | 2017-02-20 | 2021-06-18 | 日亜化学工業株式会社 | 発光装置 |
US20190312186A1 (en) * | 2018-04-09 | 2019-10-10 | Microsoft Technology Licensing, Llc | Side-Emitting LED with Increased Illumination |
JP2020021784A (ja) * | 2018-07-31 | 2020-02-06 | E&E Japan株式会社 | Led及びその製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163419A (ja) * | 1997-11-26 | 1999-06-18 | Rohm Co Ltd | 発光装置 |
JP3887124B2 (ja) * | 1999-04-30 | 2007-02-28 | ローム株式会社 | チップ型半導体発光素子 |
JP4125848B2 (ja) * | 1999-12-17 | 2008-07-30 | ローム株式会社 | ケース付チップ型発光装置 |
CN1189951C (zh) * | 2000-04-24 | 2005-02-16 | 罗姆股份有限公司 | 侧发射型半导体光发射器件及其制造方法 |
AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
US6670648B2 (en) * | 2001-07-19 | 2003-12-30 | Rohm Co., Ltd. | Semiconductor light-emitting device having a reflective case |
JP2004056088A (ja) * | 2002-05-31 | 2004-02-19 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
JP2004127604A (ja) * | 2002-09-30 | 2004-04-22 | Citizen Electronics Co Ltd | 発光ダイオード及びバックライトユニット |
JP4144498B2 (ja) * | 2002-10-01 | 2008-09-03 | 松下電器産業株式会社 | 線状光源装置及びその製造方法、並びに、面発光装置 |
CN1319183C (zh) * | 2002-10-11 | 2007-05-30 | 夏普株式会社 | 半导体发光器件以及制造半导体发光器件的方法 |
US20040173808A1 (en) * | 2003-03-07 | 2004-09-09 | Bor-Jen Wu | Flip-chip like light emitting device package |
JP2006093672A (ja) * | 2004-08-26 | 2006-04-06 | Toshiba Corp | 半導体発光装置 |
JP2006147985A (ja) * | 2004-11-24 | 2006-06-08 | Stanley Electric Co Ltd | 表面実装型発光ダイオード |
JP4720978B2 (ja) * | 2005-02-18 | 2011-07-13 | ミネベア株式会社 | 面状照明装置 |
WO2006095949A1 (en) * | 2005-03-11 | 2006-09-14 | Seoul Semiconductor Co., Ltd. | Led package having an array of light emitting cells coupled in series |
JP4037423B2 (ja) * | 2005-06-07 | 2008-01-23 | 株式会社フジクラ | 発光素子実装用ホーロー基板の製造方法 |
JP4891626B2 (ja) * | 2006-02-15 | 2012-03-07 | 株式会社 日立ディスプレイズ | 液晶表示装置 |
WO2008038924A1 (en) * | 2006-09-28 | 2008-04-03 | Seoul Opto Device Co., Ltd. | Ultraviolet light emitting diode package |
US7910944B2 (en) * | 2007-05-04 | 2011-03-22 | Cree, Inc. | Side mountable semiconductor light emitting device packages and panels |
-
2008
- 2008-02-27 JP JP2008046249A patent/JP5227613B2/ja active Active
-
2009
- 2009-02-27 US US12/394,948 patent/US7960748B2/en active Active
- 2009-02-27 CN CN200910118093.7A patent/CN101521183B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101521183A (zh) | 2009-09-02 |
JP2009206261A (ja) | 2009-09-10 |
US20090212315A1 (en) | 2009-08-27 |
US7960748B2 (en) | 2011-06-14 |
CN101521183B (zh) | 2014-05-07 |
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