JP4579761B2 - Ledランプユニット - Google Patents
Ledランプユニット Download PDFInfo
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- JP4579761B2 JP4579761B2 JP2005131082A JP2005131082A JP4579761B2 JP 4579761 B2 JP4579761 B2 JP 4579761B2 JP 2005131082 A JP2005131082 A JP 2005131082A JP 2005131082 A JP2005131082 A JP 2005131082A JP 4579761 B2 JP4579761 B2 JP 4579761B2
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- 230000003287 optical effect Effects 0.000 claims abstract description 58
- 230000002093 peripheral effect Effects 0.000 claims description 11
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- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 239000011236 particulate material Substances 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 239000004570 mortar (masonry) Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
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- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
- Led Devices (AREA)
Description
第二に、光学レンズの上面の周縁部が薄いため、外部の衝撃によって破損しやすいおそれがある。また、破損の程度が激しい場合、LED出射光の特性が変化するという問題がある。
第二に、光学レンズの周縁が凸レンズ形状又は直線面を成しており、光学レンズ内部の下部面にLEDチップが備えられているので、従来の側面出射LEDランプより厚さを減少させることができ、薄型化に有利である。
第三に、LEDチップから発生した大部分の光を側面方向に出射させることができるので、液晶表示装置(LCD)に光を供給するバックライト装置に適用する場合、光均一度を高めて表示品質を向上させることができる。
第四に、LEDチップの両端に電源を印加させるための結線を単純化させることができる。
本発明の第1実施例によるLEDランプユニットについて説明する。
図7及び図8は、本発明の第1実施例によるLEDランプユニットを示した斜視図で、図9Aは、図8のI−I’線上で切った構造断面図で、図9Bは、図8のLEDランプユニットの上部平面図である。
本発明の第2実施例によるLEDランプユニットについて説明する。
図10及び図11は、本発明の第2実施例によるLEDランプユニットを示す斜視図である。
本発明の第2実施例によるLEDランプユニットは、LEDチップから発生した光の正面出射より側面出射成分が最大となるようにするためのものである。
そして、LEDチップ103から発生する光の利用効率を高めるために、光学レンズ102の下面には下部反射板104が構成されている。
上記本発明の第1、第2実施例では、3つのLEDチップが形成されることを図示したが、これに限定されず、光学レンズ140及び下部反射板142は、本発明の第1、第2実施例で説明したとおりに構成され、図14Aおよび図14BのようにLEDチップ141を少なくとも3つ以上具備することができる。尚、第2実施例と同様にして光学レンズ140の上部前面に上部反射板を構成することとしてもよい。
本発明によるLEDランプユニットは、駆動のために各LEDチップに電源を印加させなければならず、その電源連結関係について説明すると次の通りである。
上記のようにして各LEDチップ150に連結されたアノード電極端151及びカソード電極端152は、後述するように多様な連結関係を有することができる。
カソード電極端152は、それぞれ或いは共通に接地されている。
したがって、本発明の技術範囲は上記実施例に記載された内容に限定されるものではなく、特許請求の範囲によって定められなければならない。
81、102、140 光学レンズ
82、103、141、150 LEDチップ
83、104、142 下部反射板
101 上部反射板
151 アノード電極端
151a 第1共通電極印加端
152 カソード電極端
152a 第2共通電極印加端
153 第1電極連結ワイヤー
154 第2電極連結ワイヤー
Claims (10)
- 一定の間隔で少なくとも3つ以上配置されているLEDチップと、
前記LEDチップ上に前記LEDチップの配置方向に沿って長く形成され、前記LEDチップの配置方向に沿って中心部分が内部に陥没したV字形状で形成される凹部を有し、周縁のフレームが曲面の凸レンズ形態を有する光学レンズと、
前記LEDチップの下部面に配置された下部反射板と、
前記光学レンズの上部面に形成された上部反射板、吸収層、及び散乱層のいずれかと、
を含むことを特徴とするLEDランプユニット。
- 前記光学レンズの凹部の表面は、曲面を有するように構成されることを特徴とする請求項1に記載のLEDランプユニット。
- 前記上部反射板は、反射シートの取付け、反射物質のコーティング、及び機能性シートを用いることのうちの何れかによって表面処理がなされていることを特徴とする請求項1に記載のLEDランプユニット。
- 前記吸収層は、ブラックシートで構成されることを特徴とする請求項1に記載のLEDランプユニット。
- 前記散乱層は、表面を粗くするか、或いは不規則な粒子物質を表面に塗布して形成されることを特徴とする請求項1に記載のLEDランプユニット。
- 前記少なくとも3つ以上のLEDチップは、両端がリード線によってアノード電極端とカソード電極端とにそれぞれ連結されており、前記各アノード電極端と前記各カソード電極端とは、それぞれ分離されていることを特徴とする請求項1に記載のLEDランプユニット。
- 前記少なくとも3つ以上のLEDチップは、両端がリード線によってアノード電極端とカソード電極端とにそれぞれ連結されており、前記各アノード電極端は分離され、個別に各LEDチップの一端に連結されており、前記各カソード電極端は、第1電極連結ワイヤーを介して互いに共通に連結されていることを特徴とする請求項1に記載のLEDランプユニット。
- 前記少なくとも3つ以上のLEDチップは、両端がリード線によってアノード電極端とカソード電極端とにそれぞれ連結されており、前記各アノード電極端は、第2電極連結ワイヤーを介して互いに共通に連結されており、前記各カソード電極端は分離され、前記LEDチップの他端に連結されていることを特徴とする請求項1に記載のLEDランプユニット。
- 前記少なくとも3つ以上のLEDチップは、両端がリード線によってアノード電極端とカソード電極端とにそれぞれ連結されており、前記各カソード電極端と前記各アノード電極端は、それぞれ第1電極連結ワイヤーと第2電極連結ワイヤーを介して共通に連結されていることを特徴とする請求項1に記載のLEDランプユニット。
- 前記少なくとも3つ以上のLEDチップは、単色光、R、G、Bの三色光、及び白色光のうちの何れかを発光させることを特徴とする請求項1に記載のLEDランプユニット。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040030072A KR101085144B1 (ko) | 2004-04-29 | 2004-04-29 | Led 램프 유닛 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005317977A JP2005317977A (ja) | 2005-11-10 |
JP4579761B2 true JP4579761B2 (ja) | 2010-11-10 |
Family
ID=35186889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005131082A Active JP4579761B2 (ja) | 2004-04-29 | 2005-04-28 | Ledランプユニット |
Country Status (5)
Country | Link |
---|---|
US (2) | US7950831B2 (ja) |
JP (1) | JP4579761B2 (ja) |
KR (1) | KR101085144B1 (ja) |
CN (1) | CN100401164C (ja) |
DE (1) | DE102005019278B4 (ja) |
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KR20050104696A (ko) | 2005-11-03 |
CN100401164C (zh) | 2008-07-09 |
US7950831B2 (en) | 2011-05-31 |
US8152338B2 (en) | 2012-04-10 |
KR101085144B1 (ko) | 2011-11-21 |
DE102005019278B4 (de) | 2008-04-03 |
JP2005317977A (ja) | 2005-11-10 |
US20050243577A1 (en) | 2005-11-03 |
US20100172134A1 (en) | 2010-07-08 |
CN1693969A (zh) | 2005-11-09 |
DE102005019278A1 (de) | 2005-12-01 |
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